公开(公告)号：WO2019094373A3

公开(公告)日：2019-05-16

申请号：PCT/US2018/059410

申请日：2018-11-06

Applicant: RAYTHEON COMPANY

Inventor： ADAMS, Peter J. ,  SIKINA, Thomas V. ,  HAVEN, John P. ,  BENEDICT, James E.

IPC: H05K3/40 ,  H05K3/42 ,  H01P5/02 ,  H01P1/04 ,  H01Q9/27 ,  H05K1/02

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

公开(公告)号：WO2019094373A2

公开(公告)日：2019-05-16

申请号：PCT/US2018/059410

申请日：2018-11-06

Applicant: RAYTHEON COMPANY

Inventor： ADAMS, Peter J. ,  SIKINA, Thomas V. ,  HAVEN, John P. ,  BENEDICT, James E.

IPC: H05K3/40 ,  H05K3/42 ,  H01P5/02 ,  H01P1/04 ,  H01Q9/27 ,  H05K1/02

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

公开(公告)号：EP3707974A2

公开(公告)日：2020-09-16

申请号：EP18836674.4

申请日：2018-11-06

Applicant: Raytheon Company

Inventor： ADAMS, Peter J. ,  SIKINA, Thomas V. ,  HAVEN, John P. ,  BENEDICT, James E.

IPC: H05K3/40 ,  H05K3/42 ,  H01P5/02 ,  H01P1/04 ,  H01Q9/27 ,  H05K1/02

公开(公告)号：EP4235951A3

公开(公告)日：2023-09-06

申请号：EP23174882.3

申请日：2018-11-05

Applicant: Raytheon Company

Inventor： HAVEN, John P. ,  SIKINA, Thomas V. ,  ADAMS, Peter J. ,  BENEDICT, James E.

IPC: H01Q13/18 ,  H01Q1/52 ,  H01P1/04

Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.

公开(公告)号：EP4235951A2

公开(公告)日：2023-08-30

申请号：EP23174882.3

申请日：2018-11-05

Applicant: Raytheon Company

Inventor： HAVEN, John P. ,  SIKINA, Thomas V. ,  ADAMS, Peter J. ,  BENEDICT, James E.

IPC: H01P1/04

Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.