Method of manufacturing a thin-film transistor

    公开(公告)号:GB2358080B

    公开(公告)日:2004-06-02

    申请号:GB0000374

    申请日:2000-01-07

    Abstract: The present invention provides a thin-film transistor (TFT) and its production method which enables an arrangement restraining bipolar transistor type behavior, in order to stabilize saturation current and to provide a TFT that can improve reliability. The TFT includes a channel region facing a gate electrode through a gate insulating film, a source electrode connected to the channel region and a drain region connected to the channel region on the side opposite this source region are formed in a polycrystal semiconductor film that was patterned in island forms. In the channel region, a recombination center is formed for capturing a small number of carriers (holes) by introducing impurities, such as inert gases, metals, Group III elements, Group IV elements and Group V elements after a crystallization process is carried out on a semiconductor film 100.

    Thin-film transistor and its manufacturing method

    公开(公告)号:AU2384101A

    公开(公告)日:2001-07-16

    申请号:AU2384101

    申请日:2001-01-02

    Abstract: The present invention provides, in a TFT, a gate electrode and a channel domain that are plurally divided in the channel-length direction, a low-concentration domain that is formed between the divided channel domains, and a low-concentration drain domain that adjoins a second channel domain located closest to a drain domain side among the divided channel domains. Therefore, even if the impurity concentration is relatively high in the low-concentration domain located between the divided channel domains and a low-concentration drain domain, an abnormal increase of drain current in the saturated region can be prevented, and a TFT with a high drain current level can be obtained. Thus, the present invention provides a TFT and its manufacturing method where abnormal increase of drain current in the saturated region can be prevented and the drain current level in the saturated region is sufficiently high.

    Method of manufacturing a thin-film transistor

    公开(公告)号:AU2383801A

    公开(公告)日:2001-07-16

    申请号:AU2383801

    申请日:2001-01-02

    Abstract: The present invention provides a thin-film transistor (TFT) and its production method which enables an arrangement restraining bipolar transistor type behavior, in order to stabilize saturation current and to provide a TFT that can improve reliability. The TFT includes a channel region facing a gate electrode through a gate insulating film, a source electrode connected to the channel region and a drain region connected to the channel region on the side opposite this source region are formed in a polycrystal semiconductor film that was patterned in island forms. In the channel region, a recombination center is formed for capturing a small number of carriers (holes) by introducing impurities, such as inert gases, metals, Group III elements, Group IV elements and Group V elements after a crystallization process is carried out on a semiconductor film 100.

    A thin film transistor and a method for manufacturing thereof

    公开(公告)号:AU2383601A

    公开(公告)日:2001-07-16

    申请号:AU2383601

    申请日:2001-01-02

    Abstract: The present invention provides a thin film transistor (TFT) and its production method which enable the stabilizing of saturation current and improving reliability by improving the film quality of the channel region. The TFT includes a channel region towering over a gate electrode through a gate insulation film, a source region connecting to the channel region and a drain region connecting to the channel region on an opposite side of the source region are formed on the polycrystal semiconductor film on which island-like patterning is performed. An indented section is formed on a surface of the channel region, and the section corresponding to the indented section becomes a recombination center which captures the small-number carrier (holes) because the degree of the crystallization is low in the section corresponding to the indented section due to shift from the optimum conditions at the time of laser annealing of the semiconductor.

    19.
    发明专利
    未知

    公开(公告)号:DE69937316T2

    公开(公告)日:2008-07-10

    申请号:DE69937316

    申请日:1999-03-16

    Inventor: YUDASAKA ICHIO

    Abstract: A substrate structure, comprising a substrate, a plurality of thin film layers laminated on the substrate, and a bank enclosing an area in which the plurality of the thin film layers are arranged, the bank including a first layer, a second layer and a third layer, the second layer being disposed between the first and third layers, the first and third layers being made from one of an inorganic material and an organic material, the third layer being made from the other of the inorganic material and the organic material.

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