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公开(公告)号:US20140305549A1
公开(公告)日:2014-10-16
申请号:US14365856
申请日:2012-12-14
Applicant: Shenzhen BYD Auto R&D Company Limited , BYD Company Limited
Inventor: Qing Gong , Faliang Zhang , Yunchun Li
Abstract: An amorphous and a manufacturing method thereof are provided. The amorphous alloy may have a formula of ZraCubAlcMdNe, M is at least one selected from the group consisting of Ni, Fe, Co, Mn, Cr, Ti, Hf, Ta, Nb and rare earth elements; N is at least one selected from a group consisting of Ca, Mg, and C; 40≦a≦70, 15≦b≦35, 5≦c≦15, 5≦d≦15, 0≦e≦2, and a+b+c+d+e=100.
Abstract translation: 提供了一种无定形及其制造方法。 该非晶合金可以具有ZraCubAlcMdNe的式,M是选自Ni,Fe,Co,Mn,Cr,Ti,Hf,Ta,Nb和稀土元素中的至少一种; N是选自Ca,Mg和C中的至少一种; 40≦̸ a≦̸ 70,15≦̸ b≦̸ 35,5和nlE; c≦̸ 15,5和nlE; d≦̸ 15,0和nlE; e≦̸ 2和a + b + c + d + e = 100。
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公开(公告)号:US11649528B2
公开(公告)日:2023-05-16
申请号:US16960080
申请日:2018-12-24
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Qiang Guo , Mengde Wang , Wei An
CPC classification number: C22C9/05 , B22D17/007 , C22C1/02 , C22C30/02 , H04M1/026
Abstract: The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.
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公开(公告)号:US10392708B2
公开(公告)日:2019-08-27
申请号:US14576950
申请日:2014-12-19
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Liang Zhou , Weifeng Miao , Xiong Zhang
Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
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公开(公告)号:US10161045B2
公开(公告)日:2018-12-25
申请号:US15217717
申请日:2016-07-22
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Wei Zhou , Yongliang Sun
IPC: B05D3/00 , C08J7/18 , G21H5/00 , C23C18/18 , C23C18/16 , C23C18/20 , C23C18/40 , C08K3/20 , C23C18/36 , C23C18/54 , C08K3/22
Abstract: A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.
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公开(公告)号:US09968996B2
公开(公告)日:2018-05-15
申请号:US15029110
申请日:2014-09-30
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Shuming Zhao , Yanan Wang , Qiuhui Chen , Xiaohua Wang , Liuping Tang
IPC: B22D17/10 , B22D17/14 , B22D17/20 , B22D17/28 , B22D17/30 , B22D17/32 , B22D27/15 , F27B3/06 , F27B3/08 , F27B3/24 , F27B14/04 , F27B14/06 , F27B14/14 , F27D1/12 , F27D3/12 , F27D7/06 , F27D11/10 , F27D19/00 , F27D21/00 , F27B14/00 , F27B14/08
CPC classification number: B22D17/10 , B22D17/14 , B22D17/2023 , B22D17/32 , B22D27/15 , F27B3/06 , F27B3/085 , F27B3/24 , F27B14/04 , F27B14/06 , F27B14/14 , F27B2014/002 , F27B2014/045 , F27B2014/068 , F27B2014/0837 , F27B2014/0887 , F27D1/12 , F27D3/12 , F27D7/06 , F27D11/10 , F27D19/00 , F27D21/0035 , F27D2007/066
Abstract: A metal forming apparatus includes a smelting device, a molding device, an injection device and a vacuumizing device. The smelting device defines a smelting chamber, and includes a rotatable crucible and a heating unit both disposed within the smelting chamber. The molding device defines a molding chamber sealedly communicated with the smelting chamber. The injection device includes a charging barrel assembly sealedly disposed at a joint between the molding device and the smelting device and an injection unit sealedly connected with the smelting device. The vacuumizing device is sealedly connected with the smelting device and the molding device respectively so as to vacuumize the smelting chamber and the molding chamber.
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16.
公开(公告)号:US11382216B2
公开(公告)日:2022-07-05
申请号:US16274103
申请日:2019-02-12
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Xinping Lin , Yongpeng Ren , Baoxiang Zhang
IPC: H05K3/18 , C04B41/88 , C04B41/00 , C04B41/51 , C23C18/06 , C23C18/12 , C23C18/16 , H05K1/03 , C04B111/00
Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.
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17.
公开(公告)号:US10532949B2
公开(公告)日:2020-01-14
申请号:US15775104
申请日:2016-11-23
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Xinping Lin , Ge Chen , Bo Wu
IPC: C04B35/488 , C04B35/64 , C04B35/48 , C04B35/626
Abstract: A Zr-based composite ceramic material, a preparation method thereof and a shell or a decoration are provided. The Zr-based composite ceramic material includes a zirconia matrix and a cubic SrxNbO3 stable phase dispersed within the zirconia matrix, where 0.7≤x≤0.95.
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公开(公告)号:US10138557B2
公开(公告)日:2018-11-27
申请号:US15217681
申请日:2016-07-22
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Wei Zhou , Yongliang Sun
IPC: B05D3/00 , C08J7/18 , G21H5/00 , C23C18/18 , C23C18/16 , C23C18/20 , C23C18/40 , C08K3/20 , C23C18/36 , C23C18/54 , C08K3/22
Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.
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公开(公告)号:US20160119012A1
公开(公告)日:2016-04-28
申请号:US14891263
申请日:2014-06-24
Applicant: BYD COMPANY LIMITED
Inventor: Jiangang Zhou , Dajun Chen , Qing Gong
IPC: H04B1/3888 , H04B5/02 , H04M1/02
CPC classification number: H04B1/3888 , H01Q1/405 , H01Q7/00 , H04B5/0081 , H04B5/02 , H04M1/0202 , H04M2250/04
Abstract: A metal shell includes: a metal body having a through hole; a plastic member disposed on the metal body at a position of the through hole; and a NFC antenna disposed on a surface of the plastic member and configured to receive a signal via the through hole. An area of a part of the NFC antenna overlapping the through hole is larger than one third of an area of the NFC antenna. A cell phone including the metal shell is also provided.
Abstract translation: 金属壳包括:具有通孔的金属体; 塑料构件,其设置在所述金属体的通孔的位置; 以及NFC天线,其设置在所述塑料构件的表面上并且被配置为经由所述通孔接收信号。 NFC天线的与通孔重叠的部分的区域大于NFC天线的面积的三分之一。 还提供了包括金属外壳的手机。
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公开(公告)号:US10358703B2
公开(公告)日:2019-07-23
申请号:US15525471
申请日:2015-04-08
Applicant: BYD COMPANY LIMITED
Inventor: Faliang Zhang , Youping Ren , Qing Gong
Abstract: The present disclosure provides a magnesium alloy and a preparation method and an application thereof. Based on the total weight of the magnesium alloy, the magnesium alloy includes 2-3.5 wt % of Ce, 0.01-0.2 wt % of R, 0.8-1.5 wt % of Mn, 0-0.01 wt % of Fe, 0-0.01 wt % of Cu, 0-0.01 wt % of Ni, 0-0.01 wt % of Co, 0-0.01 wt % of Sn, 0-0.01 wt % of Ca, and 94.74-97.19 wt % of Mg, wherein R is at least one selected from Al and Zn.
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