公开(公告)号：US10392708B2

公开(公告)日：2019-08-27

申请号：US14576950

申请日：2014-12-19

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Liang Zhou ,  Weifeng Miao ,  Xiong Zhang

IPC: C23C28/02 ,  C23C18/20 ,  C23C18/16 ,  B05D1/36 ,  B05D3/06 ,  B05D7/00 ,  C23C18/50 ,  C25D5/56

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

公开(公告)号：US09770887B2

公开(公告)日：2017-09-26

申请号：US14462293

申请日：2014-08-18

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Liang Zhou ,  Weifeng Miao ,  Xiong Zhang

IPC: B05D3/06 ,  B05D3/10 ,  C23C18/42 ,  B32B15/08 ,  C23C18/20 ,  C23C18/32 ,  H05K3/18 ,  C23C18/16 ,  C23C18/22 ,  C23C18/40 ,  B32B15/04 ,  H05K1/05 ,  H05K3/10

CPC classification number: B32B15/08 ,  B32B15/043 ,  C23C18/1639 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/22 ,  C23C18/32 ,  C23C18/40 ,  C23C18/42 ,  H05K1/056 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/09118 ,  H05K2203/107 ,  Y10T428/12569

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4−δ, Ca0.25Cu0.75TiO3−β, and TiO2−σ, wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.