中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.041 seconds)

    WATER SUPPLY DEVICE OF DISHWASHER AND DISHWASHER COMPRISING THE SAME
    14.
    发明申请
    WATER SUPPLY DEVICE OF DISHWASHER AND DISHWASHER COMPRISING THE SAME 审中-公开
    洗碗机的供水装置和包含该洗碗机的洗碗机

    公开(公告)号：WO2012065535A1

    公开(公告)日：2012-05-24

    申请号：PCT/CN2011/082173

    申请日：2011-11-14

    Applicant: BYD COMPANY LIMITED ,  SUN, Jian ,  LI, Mingwei ,  ZHANG, Juan ,  GUO, Qiang

    Inventor： SUN, Jian ,  LI, Mingwei ,  ZHANG, Juan ,  GUO, Qiang

    IPC: A47L15/00 ,  A47L15/42

    CPC classification number: A47L15/4217 ,  A47L15/4229

    Abstract: A water supply device of a dishwasher and a dishwasher comprising the same may be provided. The water supply device may comprise: a soft water container (b) defining a softener cavity for positioning a softener therein, the softener cavity having a first water inlet (2), a first water outlet (6) for outputting softened water and a softener processing water outlet; a regenerating container (a) defining a regenerating cavity for positioning a regenerating agent therein, the regenerating cavity having a second water inlet (3) and a second water outlet in communication with the softener cavity; a hard water container (c) defining a hard water cavity for positioning a hardener therein, the harder cavity having a third water inlet (9), a third water outlet (7) and a softener processing water inlet in communication with the softener processing water outlet; a first valve (10-1) disposed between the second water outlet and the softener cavity; and a second valve (10-2) disposed between the softener processing water inlet of the hard water cavity and the softener processing water outlet of the softener cavity.

    Abstract translation: 可以提供洗碗机的供水装置和包括其的洗碗机。 供水装置可以包括：软水容器（b），其限定用于将软化剂定位在其中的软化器腔，所述软化器腔具有第一进水口（2），用于输出软化水的第一出水口（6）和软化剂 加工出水口; 再生容器（a）限定用于在其中定位再生剂的再生腔，再生腔具有与软化器腔连通的第二进水口（3）和第二出水口; 限定用于在其中定位硬化剂的硬水腔的硬水容器（c），所述较硬腔体具有与软化剂处理水连通的第三进水口（9），第三出水口（7）和软化剂加工水入口 出口; 设置在第二出水口和软化器腔之间的第一阀（10-1）; 以及设置在硬水腔的软化剂处理水入口与软化器腔的软化剂处理水出口之间的第二阀（10-2）。

    METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME
    15.
    发明申请
    METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME 审中-公开
    金属树脂组合物及其制备方法

    公开(公告)号：WO2016000574A1

    公开(公告)日：2016-01-07

    申请号：PCT/CN2015/082541

    申请日：2015-06-26

    Applicant: BYD COMPANY LIMITED

    Inventor： SUN, Jian ,  WU, Yanqin ,  ZHANG, Yunxia ,  CHEN, Liang

    IPC: B32B15/20 ,  B32B15/08 ,  B32B27/06 ,  C25D11/34 ,  C23F1/18

    CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B2262/101 ,  B32B2307/542 ,  B32B2307/714 ,  C23F1/00 ,  C23F1/18 ,  C25D11/34

    Abstract: A metal-resin composite and method of producing the same are provided. The method includes : providing a metal substrate, the metal substrate including a metal base made of copper or copper alloy and an oxide layer attached to at least a part of a surface of the metal base; chemically etching the metal substrate to form corrosion pores on a surface of the oxide layer to obtain a surface-treated metal substrate with a treated surface; and injecting a resin composition to fill in the corrosion pores, then molding to obtain a resin layer.

    Abstract translation: 提供了一种金属树脂复合物及其制造方法。 所述方法包括：提供金属基板，所述金属基板包括由铜或铜合金制成的金属基体和附着到所述金属基底表面的至少一部分的氧化物层; 化学蚀刻金属基底以在氧化物层的表面上形成腐蚀孔，以获得具有处理表面的经表面处理的金属基底; 并注入树脂组合物以填充腐蚀孔，然后成型以获得树脂层。

    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF
    16.
    发明公开
    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF 审中-公开

    公开(公告)号：EP3481165A1

    公开(公告)日：2019-05-08

    申请号：EP17819128.4

    申请日：2017-06-19

    Applicant: BYD Company Limited

    Inventor： SUN, Jian ,  CHEN, Liang ,  ZHAO, Guiwang ,  ZHU, Shuai ,  JIANG, Xiangrong

    IPC: H05K5/02

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a substrate (1), and then successively performing injection molding and etching.

    METAL RESIN COMPLEX AND PREPARATION METHOD AND USE OF SAME
    17.
    发明公开
    METAL RESIN COMPLEX AND PREPARATION METHOD AND USE OF SAME 审中-公开

    公开(公告)号：EP3527346A1

    公开(公告)日：2019-08-21

    申请号：EP17860354.4

    申请日：2017-09-22

    Applicant: BYD Company Limited

    Inventor： WU, Yingyuan ,  ZHANG, Guoqiang ,  ZHAO, Guiwang ,  SUN, Jian ,  CHEN, Liang

    IPC: B29C45/14 ,  B29C69/00 ,  B29L31/34

    Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position opposite to the upper surface slit, and the upper surface slit is communicated with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

    METAL-RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING
    18.
    发明公开
    METAL-RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING 审中-公开
    金属 - 树脂复合材料及其制备方法和电子产品外壳

    公开(公告)号：EP3243651A1

    公开(公告)日：2017-11-15

    申请号：EP15871779.3

    申请日：2015-10-29

    Applicant: BYD Company Limited

    Inventor： ZHANG, Xiao ,  TAO, Letian ,  SUN, Jian ,  CHEN, Liang

    IPC: B32B15/08 ,  B32B15/20 ,  B29C45/14 ,  C25D11/04

    CPC classification number: B29C45/14311 ,  B29C45/14778 ,  B29C2045/14868 ,  B29K2105/20 ,  B29K2705/08 ,  B29L2031/34 ,  B32B15/08 ,  B32B15/20 ,  C23F1/38 ,  C25D11/26

    Abstract: The present disclosure provides a metal-resin composite and a method of preparing the same. The metal includes titanium or titanium alloy, the composite includes a metal substrate and a resin layer coated on at least part of surface of the metal substrate, a recess is distributed on the part of surface of the metal substrate coated with the resin layer, a part of resin of the resin layer extends downward to fill in the recess, a content of oxygen element on surface of the metal substrate is greater than 1wt%. The method includes dipping a metal substrate in an etching solution containing at least one alkali metal hydroxide so as to form a recess on surface of the metal substrate, and injecting a resin onto surface of the metal substrate after surface treatment sp as to form a resin layer. The metal-resin composite of the present disclosure is suitable for a shell of electronic product.

    Abstract translation: 本公开提供了一种金属 - 树脂复合材料及其制备方法。 所述金属包括钛或钛合金，所述复合物包括金属基材和涂布在所述金属基材的至少一部分表面上的树脂层，在涂布有所述树脂层的金属基材表面的一部分上分布有凹部， 树脂层的部分树脂向下延伸填充凹槽，金属基材表面的氧元素含量大于1wt％。 该方法包括将金属基材浸渍在含有至少一种碱金属氢氧化物的蚀刻溶液中，以在金属基材的表面上形成凹部，并且在表面处理后将金属基材的表面注入树脂以形成树脂 层。 本发明的金属 - 树脂复合材料适用于电子产品的外壳。

    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF
    19.
    发明公开
    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF 审中-公开

    公开(公告)号：EP3481164A1

    公开(公告)日：2019-05-08

    申请号：EP17819127.6

    申请日：2017-06-19

    Applicant: BYD Company Limited

    Inventor： SUN, Jian ,  CHEN, Liang ,  ZHAO, Guiwang ,  WU, Yingyuan ,  JIANG, Xiangrong ,  ZOU, Yunfei

    IPC: H05K5/02

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

Patent Agency Ranking