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公开(公告)号：JP2006275302A
公开(公告)日：2006-10-12
申请号：JP2005090511
申请日：2005-03-28
Inventor： HASHIMOTO MITSUO , OMI MOTOSUKE , YAJIMA TAKASHI , NAGAI HIROYUKI , KATOU GOUSAKU
IPC: F28D15/02 , H01L23/427
Abstract: PROBLEM TO BE SOLVED: To provide desired heat transportation capability even at any attitude. SOLUTION: Even when an evaporator is arranged below a condenser and heat load is not applied to the evaporator, working fluid 19 is held by capillary tube force of a channel 14a in the condenser as shown in Fig. 6 (B) to prevent the working fluid 19 from flowing out onto an evaporator side. Consequently, only liquid phase working fluid exists in a liquid phase tube always. As a result, it is possible to prevent running-out of liquid or drying-out when the heat transportation device operates to obtain desired heat transportation capability. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：即使在任何姿态下也能提供期望的热输送能力。 解决方案：即使当蒸发器布置在冷凝器下方并且热负荷未被施加到蒸发器时，如图1所示，工作流体19通过冷凝器中的通道14a的毛细管力保持。 6（B）以防止工作流体19流出到蒸发器侧。 因此，只有液相工作流体总是存在于液相管中。 结果，当热运输装置工作以获得期望的热运输能力时，可以防止液体流出或干燥。 版权所有（C）2007，JPO＆INPIT
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12.发明专利Cooling device, manufacturing method of cooling device, manufacturing device of cooling device, and electronic equipment 审中-公开冷却装置，冷却装置的制造方法，冷却装置的制造装置和电子装置
公开(公告)号：JP2005326133A
公开(公告)日：2005-11-24
申请号：JP2004370466
申请日：2004-12-22
Inventor： OMI MOTOSUKE , SOTOZAKI MINEHIRO , KATOU GOUSAKU , NAGAI HIROYUKI
CPC classification number: F28D15/0266
Abstract: PROBLEM TO BE SOLVED: To provide a cooling device capable of ensuring desired cooling performance while suppressing the dispersion of the performance among products, a manufacturing method of cooling device, a manufacturing device of cooling device, and electronic equipment.
SOLUTION: A refrigerant is injected into a condensation substrate 5 through an injection port 24a, and the quantity of the injected refrigerant is adjusted. An O-ring 17 is installed to a lid member 12 attachable to and detachable from the condensation substrate 5. Since the quantity of the refrigerant can be adjusted, desired cooling performance can be obtained, and the dispersion of the cooling performance among products can be suppressed.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种能够确保期望的冷却性能同时抑制产品之间的性能分散，冷却装置的制造方法，冷却装置的制造装置和电子设备的冷却装置。 解决方案：制冷剂通过注入口24a注入冷凝基板5，并且调节喷射的制冷剂的量。 O形圈17安装在可冷凝基板5上可拆卸的盖部件12上。由于可以调节制冷剂的量，因此可以获得期望的冷却性能，并且可以使产品之间的冷却性能的分散 抑制。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005259747A
公开(公告)日：2005-09-22
申请号：JP2004065267
申请日：2004-03-09
Inventor： OMI MOTOSUKE , SOTOZAKI MINEHIRO , KATOU GOUSAKU , YAJIMA TAKASHI
IPC: F28D15/02 , H01L23/473
Abstract: PROBLEM TO BE SOLVED: To provide a heat transport apparatus capable of maintaining desired performance of the heat transport apparatus and an electronic device with the apparatus mounted.
SOLUTION: The heat transport apparatus 1 includes bellows 6 for suppressing an increase in pressure of flow paths P1-P4. Thus, when the heat transport apparatus 1 is used for a long time for example and the pressure in the flow paths P1-P4 increases, the bellows 6 are activated to reduce the pressure in the flow paths P1-P4 to suppress the increase in pressure of the flow paths P1-P4. Therefore, the heat transport apparatus 1 can be stably operated for a long time.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种能够保持热输送装置的期望性能的热输送装置和安装有该装置的电子装置。 解决方案：传热装置1包括用于抑制流路P1-P4的压力增加的波纹管6。 因此，当长时间使用传热装置1并且流路P1-P4中的压力增加时，波纹管6被启动以减小流路P1-P4中的压力以抑制压力的增加 的流路P1-P4。 因此，热输送装置1能够长时间稳定地运转。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2003185369A
公开(公告)日：2003-07-03
申请号：JP2001380601
申请日：2001-12-13
Applicant: SONY CORP
Inventor： SOTOZAKI MINEHIRO , KATOU GOUSAKU , SANO NAOKI , KITAGAWA KOJI
IPC: F25D9/00 , F28D15/02 , H01L23/427 , H05K7/20
Abstract: PROBLEM TO BE SOLVED: To provide a compact and thin cooling device having high cooling performance, an electronic apparatus and a method of manufacturing the cooling device. SOLUTION: This cooling device 1 is formed by joining a pair of rectangular first and second glass bases 2, 3 composed of, for example, glass as a low heat diffusive material, through a silicone member 4. The joining faces of the bases 2, 3 are provided with grooves 5, 6. The grooves 5, 6 are formed to function as a looped heat pipe when the bases 2, 3 are joined. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2002344084A
公开(公告)日：2002-11-29
申请号：JP2001141294
申请日：2001-05-11
Applicant: SONY CORP
Inventor： KATOU GOUSAKU , NARUI HIRONOBU
IPC: H01S5/22
Abstract: PROBLEM TO BE SOLVED: To provide a multi-beam semiconductor light emitting device having a good heat sink. SOLUTION: The multi-beam semiconductor light-emitting device 10 comprises a plurality of semiconductor light-emitting elements 16 integrated monolithically or in hybrid manner on the same substrate 12 via an isolation groove 14. Electrodes 22 and 36 of the elements are provided on a laminated structure for constituting the elements isolated via the groove, and formed separately independently from each other, via an insulating electrode isolation layer 52 which covers a region other than the electrodes. The electrodes are electrically connected to the structure via a window opening 38 of the isolation layer. The isolation layer is formed as a composite insulating layer of a Ti layer 54, having thermal conductivity larger than those of SiO2 films 56A and 56B, and SiO2 films 56A and 56B for sandwiching the Ti layer.
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Patent Agency Ranking
公开(公告)号：JP2002171022A
公开(公告)日：2002-06-14
申请号：JP2000368334
申请日：2000-12-04
Applicant: SONY CORP
Inventor： KATOU GOUSAKU , HIGUCHI YOSHINOBU , NARUI HIRONOBU
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device and a sub-mount member for the semiconductor device, for mounting a plurality of semiconductor elements on the sub-mount member horizontally and realizing stable characteristics and high reliability, even when the plurality of semiconductor element on a semiconductor substrate are mounted down on the sub-mount member. SOLUTION: There is a difference in height between a GaAs/AlGaAs based infrared colored laser element 20 and an AlGaInP based infrared colored laser element 30 formed on an n-GaAs substrate 10, while the element-mounting face of the sub-mount member 40 has a step, corresponding to the difference in the height of both laser elements. When the GaAs/AlGaAs-based infrared colored laser element 20 and the AlGaInP-based infrared colored laser element are mounted on the sub-mount member 40, the difference in height between both the laser elements is absorbed by the step formed on the element mounting face of the sub-mount member 40, and both the laser elements are mounted on the sub-mount member 40 horizontally.
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公开(公告)号：JP2002164606A
公开(公告)日：2002-06-07
申请号：JP2000363150
申请日：2000-11-29
Applicant: SONY CORP
Inventor： NARUI HIRONOBU , KATOU GOUSAKU , HIGUCHI YOSHINOBU
IPC: H01L25/16 , H01L25/04 , H01L25/18 , H01L33/08 , H01L33/30 , H01L33/44 , H01L33/62 , H01S5/022 , H01S5/22 , H01L33/00
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method wherein a plurality of semiconductor elements are mounted on a submount member horizontally and stable characteristic and high reliability can be obtained, when a plurality of the semiconductor elements formed on a semiconductor substrate are down-mounted on the submount member and height difference exists between the semiconductor elements. SOLUTION: A relatively high AlGaAs based infrared laser element 20, a relatively low AlGaInP based infrared laser element 30 and a protruding type retaining body 40 having a height nearly equal to that of the laser element 20 which are formed on an N-type GaAs substrate 10 are down-mounted on the submount member 50. The submount member 50 is interposed between a surface of the substrate 10 and an element mounting surface of the submount member 50. As a result, when the height difference exists between both the semiconductor laser elements, the substrate 10 is not inclined on account of the height difference and horizontal down-mounting is enabled.
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公开(公告)号：JP2002075958A
公开(公告)日：2002-03-15
申请号：JP2000266783
申请日：2000-09-04
Applicant: SONY CORP
Inventor： KATOU GOUSAKU , NARUI HIRONOBU
Abstract: PROBLEM TO BE SOLVED: To provide a structural substrate which has a formally tapered or convex ridge part equal in height, a reliable semiconductor device which can be produced stably by stacking a semiconductor layer on the structural substrate, and a manufacturing method which can manufacture them with good reproducibility. SOLUTION: An etching stop layer 11 consisting of GaInP and a ridge part forming layer 12 consisting of GaAs are made on a GaAs substrate 10, and they are etched through a stripe-formed insulating film. Though the ridge part forming layer 12 can be etched easily, the etching is substantially checked by the etching stop layer 11 under it since the etching rate is large there, and it is finished at the point of time when the etching stop layer 11 is surfaced without progressing to the substrate 10. As a result, the etching is performed by the amount of thickness of the ridge part forming layer 12, and the dispersion in height direction of the ridge part 14a is reduced.
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公开(公告)号：JP2001210916A
公开(公告)日：2001-08-03
申请号：JP2000018536
申请日：2000-01-27
Applicant: SONY CORP
Inventor： KATOU GOUSAKU
Abstract: PROBLEM TO BE SOLVED: To reduce the threshold current density and operating current of a light-emitting element and prolong the service life of the element, without having to use complicated structure such as GRIN structure. SOLUTION: In a ZnSe based semiconductor laser, an N-type ZnMgSSe clad layer 5, an N-type ZnSSe optical guide layer 6, an active layer 8, a P-type ZnSSe optical guide layer 10 and a P-type ZnMgSSe clad layer 11 are laminated in this order. Between the N-type ZnMgSSe optical guide layer 6 and the active layer 8, an N-type ZnSe intermediate layer 7, having a band gap and a refractive index which are intermediate between those of the layer 6 and the layer 8, is formed. Between the P-type ZnSSe optical guide layer 10 and the active layer 8, a P-type ZnSe intermediate layer 9, having a band gap and a refractive index which are intermediate between those of the layer 10 and the layer 8, is formed.
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公开(公告)号：JPH05303945A
公开(公告)日：1993-11-16
申请号：JP10799692
申请日：1992-04-27
Applicant: SONY CORP
Inventor： KATOU GOUSAKU
IPC: H01J29/76
Abstract: PURPOSE:To provide a cooling device for a deflection yoke in which need of an additional electric circuit is eliminated and possibility of generation of noise is eliminated without forming a large and long core at the deflection yoke, and without forming a deflection coil in multiple wires. CONSTITUTION:A liquid cooling device comprises a cooling pipe 9 installed on a deflection yoke 3, a boiler 6 and a heat sink 5 respectively connected to both ends of the cooling pipe 9, and a tank 4 for storing cooling liquid cooled by the heat sink 5. The cooling liquid stored in the tank 4 is supplied thorugh the cooling pipe 9 to the boiler 6, and gas of the cooling liquid gasified by the boiler 6 is supplied to the heat sink 5. For heat source 7 for the boiler 6, a heat sink of a semiconductor element or a semiconductor circuit is used.
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