公开(公告)号：JP2005337683A

公开(公告)日：2005-12-08

申请号：JP2004161058

申请日：2004-05-31

Applicant: Sony Corp ,  ソニー株式会社

Inventor： YAJIMA SHOICHI ,  YAJIMA TAKASHI ,  NAGAI HIROYUKI ,  SOTOZAKI MINEHIRO ,  KATOU GOUSAKU

IPC: F25D9/00 ,  F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC classification number: H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a cooling device, a method of manufacturing the cooling device, a connecting device and an electronic appliance loading the cooling device, capable of achieving high sealability and securing the reliability on cooling performance or the like for a long period. SOLUTION: In this cooling device absorbing or releasing the heat by phase change of a refrigerant, the cooling device 1 comprises a phase changer 2 or 5, a connector 9 or 10 connected with the phase changer 2 or 5 and capable of forming an area for circulating the refrigerant between the phase changer 2 and the connector, and a connecting material 18 or 19 for connecting the phase changer 2 and the connector 9 in a state of sealing the area. Thus the surface precision of a connection surface where the phase changer 2 and the connector 9 are kept into contact with each other, is not strictly required, and high sealability can be achieved. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供冷却装置，制造冷却装置的方法，连接装置和装载冷却装置的电子装置，能够实现高密封性和确保冷却性能等方面的可靠性 很长一段时间 解决方案：在该冷却装置中，通过制冷剂的相变来吸收或释放热量，冷却装置1包括相变器2或5，与相变器2或5连接并能够形成的连接器9或10 用于在相变器2和连接器之间循环制冷剂的区域，以及用于在密封该区域的状态下连接相变器2和连接器9的连接材料18或19。 因此，不会严格地要求相变器2和连接器9彼此接触的连接面的表面精度，并且可以实现高密封性。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004037039A

公开(公告)日：2004-02-05

申请号：JP2002198021

申请日：2002-07-05

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OMI MOTOSUKE ,  KATOU GOUSAKU ,  SOTOZAKI MINEHIRO

IPC: F25D9/00 ,  F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20336 ,  F28D15/0233

Abstract: PROBLEM TO BE SOLVED: To provide a cooling device having high cooling performance, excellent thermal stability and excellent strength, an electronic equipment device and a display device, and to provide a cooling device manufacturing method.
SOLUTION: This cooling device 1 is formed of a flow passage board 10 formed from a polyimide resin, an intermediate board 30, a cover board 50, a condenser board 20 formed from a metal having a high heat conductivity and assembled in holes 31 and 32 of the intermediate board 30, and an evaporator board 40. The heat from a heat source is sealed in the evaporator board or the condenser board having a high heat conductivity to practically increase the quantity of the latent heat.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004031783A

公开(公告)日：2004-01-29

申请号：JP2002187973

申请日：2002-06-27

Applicant: Sony Corp ,  ソニー株式会社

Inventor： SOTOZAKI MINEHIRO ,  KATOU GOUSAKU ,  HORI KAZUHITO

IPC: F28D15/02 ,  G06K19/00 ,  H01L23/427

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F2245/02

Abstract: PROBLEM TO BE SOLVED: To provide an evaporator having high cooling performance and capable of thinning, and to provide a capacitor, a cooling device, electronic equipment, and a method for manufacturing the cooling device. SOLUTION: The evaporator base 40 in the cooling device 1 is formed of a metal material with high heat conductance, coated with a diamond-like carbon thin film on the surface of the metal material, the surface of the base of is smooth, and fluidity of a working liquid is good. Furthermore, the evaporator prevents corrosion of the metal material, and contrives thinning compared with the conventional one formed to previously add a thickness of a corrosion part of the metal material. In addition, a heat radiation fin 22 for a capacitor base 20 is formed of a resin material, and contrives lightweight as compared with the heat radiation fin formed of the conventional metal material. Furthermore, the surface of the resin material has the equivalent heat radiation because a thin film of diamond-state carbon with the high heat conductivity is coated on the surface of the resin material. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2006132853A

公开(公告)日：2006-05-25

申请号：JP2004323086

申请日：2004-11-08

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KATOU GOUSAKU ,  HASHIMOTO MITSUO ,  OMI MOTOSUKE ,  YAJIMA TAKASHI ,  YAJIMA SHOICHI ,  NAGAI HIROYUKI

IPC: F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC classification number: F28D15/0266 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a heat transport device, its manufacturing method, and electronic equipment equipped with the heat transport device reducing manufacturing time and cost and positively preventing leakage, and to prevent the crack initiation of the heat transport device. SOLUTION: In this heat transport device 10, a connection end 3a (3b) of a gas phase tube 3 or the like with a width u smaller than the thickness t1 (t2) of an upper substrate 11 (13) is connected only to the upper substrate 11 (13). Consequently, the accuracy of only a side part 11d (13d) of the upper substrate 11 (13) to which the gas phase tube 3 or the like is connected, needs to be maintained. The gas phase tube 3 or the like can thereby be connected comparatively easily, and the manufacturing time and cost can be reduced. Further, since the thickness t1 (t2) of the upper substrate 11 (13) is increased, strain becomes large in positive electrode joining of both substrates, but a positive electrode joining temperature is made lower than a conventional one to suppress strain and to prevent crack initiation. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决问题的方案为了提供配备有热传输装置的热输送装置及其制造方法以及减少制造时间和成本的电子设备，并且可靠地防止泄漏，并且防止热输送装置的裂纹开始。 解决方案：在该传热装置10中，连接宽度u小于上基板11（13）的厚度t1（t2）的气相管3等的连接端3a（3b） 仅到上基板11（13）。 因此，仅需要维持连接有气相管3等的上基板11（13）的侧部11d（13d）的精度。 气相管3等可以相对容易地连接，并且可以降低制造时间和成本。 此外，由于上基板11（13）的厚度t1（t2）增加，所以两个基板的正极接合中的应变变大，但是使正极接合温度比常规的接合温度低，以抑制应变并防止 裂纹发生。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006125718A

公开(公告)日：2006-05-18

申请号：JP2004313949

申请日：2004-10-28

Applicant: Sony Corp ,  ソニー株式会社

Inventor： YAJIMA TAKASHI ,  NAGAI HIROYUKI ,  KATOU GOUSAKU ,  YAJIMA SHOICHI

IPC: F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC classification number: F28D15/0266

Abstract: PROBLEM TO BE SOLVED: To provide a heat transport device capable of absorbing external force, and enhancing a degree of freedom in design, and an electronic device mounted therewith.
SOLUTION: In the heat transport device 10, since a gaseous phase pipe 3 and a liquid phase pipe 4 are composed by bending a multiplicity of portions 3a, 3b, 4a, and 4b, an evaporator 1 and a condenser 2 can elastically repel each other. That is to say, the gaseous phase pipe 3 and the liquid phase pipe 4 function as springs, and they can absorb force acting on the evaporator 1 and the condenser 2.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够吸收外力并提高设计自由度的热输送装置及其安装的电子装置。 解决方案：在传热装置10中，由于通过弯曲多个部分3a，3b，4a和4b构成气相管3和液相管4，所以蒸发器1和冷凝器2可以弹性地 排斥对方 也就是说，气相管3和液相管4用作弹簧，并且它们可以吸收作用在蒸发器1和冷凝器2上的力。版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004353902A

公开(公告)日：2004-12-16

申请号：JP2003149975

申请日：2003-05-27

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KATOU GOUSAKU ,  SOTOZAKI MINEHIRO

IPC: F25D9/00 ,  F28D15/02

Abstract: PROBLEM TO BE SOLVED: To provide a cooling system, for enhancing efficiency of heat transport, by further stably circulating a working fluid.
SOLUTION: A liquid phase flow passage 14 having the largest flow passage resistance, can make the working fluid easily drawable in an evaporation flow passage 11, by operating capillary force. The evaporation flow passage 11 promotes evaporation of a drawn-in liquid phase fluid, and can prevent a backflow of a volume-increasing fluid to the liquid phase flow passage 14, since the flow passage resistance is smaller than the liquid phase flow passage 14. A gaseous phase flow passage 12 promotes a flow of the working fluid of further increasing the volume by evaporation, and can prevent a backflow of vapor to the evaporation flow passage 11, since the flow passage resistance is smaller than the evaporation flow passage 11. Thus, a stable flow of the working fluid can be maintained, and efficiency of the heat transport can be enhanced.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004190977A

公开(公告)日：2004-07-08

申请号：JP2002361020

申请日：2002-12-12

Applicant: Sony Corp ,  ソニー株式会社

Inventor： SOTOZAKI MINEHIRO ,  OMI MOTOSUKE ,  KATOU GOUSAKU ,  YAJIMA SHOICHI ,  YAJIMA TAKASHI

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20

CPC classification number: F28D15/043 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To prevent occurrence of residual gas in manufacturing of a heat transport device suitable for miniaturization and thickness reduction. SOLUTION: In the heat transport device 1, the coating treatment is applied with ion implantation, thermal oxidation, and steam oxidation or the like on a wick part generating capillary force to circulate the working fluid or the surface of the flow path where the working fluid of the gas phase or the liquid phase flows. The occurrence of the residual gas and especially hydrogen gas are prevented thereby. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JPH11150330A

公开(公告)日：1999-06-02

申请号：JP31407397

申请日：1997-11-14

Applicant: SONY CORP

Inventor： NOGUCHI HIROYASU ,  KATOU GOUSAKU ,  NAGAI MASAHARU

IPC: H01L33/06 ,  H01L33/28 ,  H01S5/00 ,  H01S3/18 ,  H01L33/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element, which is longer in life and is higher in reliability. SOLUTION: A semiconductor light-emitting element is constituted into a structure, wherein the element has first and second conductivity type clad layers 3 and 7 which consist of a Zn1- XMg1-x MGy Be1-x-y Sz Se1- Z (0

公开(公告)号：JPH06151708A

公开(公告)日：1994-05-31

申请号：JP32240192

申请日：1992-11-06

Applicant: SONY CORP

Inventor： KATOU GOUSAKU

IPC: H01L27/04 ,  H01L21/822

Abstract: PURPOSE:To mount a by-pass capacitor on a semiconductor integrated circuit device on the position close to a power source terminal in a short wiring distance by a method wherein the bypass capacitor is connected between the power source terminal and an idle terminal, and the idle terminal is earthed. CONSTITUTION:An idle terminal NC 8 and a positive power source terminal Vcc 7 are connected by a bypass capacitor C1, and the idle terminal NC8 and a negative electrode power source terminal-Vcc 4 are connected by a bypass capacitor C2. Also, the idle terminal NC 8 is connected to a GND pattern. As a result, the positive electrode power source terminal Vcc and the negative electrode power source terminal-Vcc are earthed respectively through the intermediary of the bypass capacitors C1 and C2. In this case, the bypass capacitor C1 and C2 are connected respectively at the position close to the two electrode terminals, and as a result of the above-mentioned connection, the distance of wiring is shortened, and the mounting effect of the bypass capacitor can be improved.

公开(公告)号：JPH0591361A

公开(公告)日：1993-04-09

申请号：JP25851391

申请日：1991-09-10

Applicant: SONY CORP

Inventor： KATOU GOUSAKU

IPC: H04N3/23

Abstract: PURPOSE:To improve the linearity by synchronizing to a vertical synchronizing signal, changing the amplitude of the deflection current to a parabolic shape, following the change and making variable the power voltage of a linearity correcting circuit. CONSTITUTION:A first power VCC1 is held at a direct current level decided by a resistance 35, a variable resistance 36, and a resistance 38 by a power modulating circuit 31, a parabolic signal VP is superimposed and supplied through a HOT 50 to a transistor 6. For this reason, in a deflection current I of a horizontal deflection coil 12, the peak value follows the parabolic signal VP and changes. On the other hand, in a second power VCC1, the power is held at the direct current level decided by a resistance 55, a variable resistance 56, and a resistance 58 by a power modulating circuit 51, and in the power voltage of a linearity correcting circuit 69 to which the parabolic signal VP is superimposed and supplied, the power is held so as to follow the terminal voltage of the HOT 50 and change. Then, at a terminal voltage Vcs of a capacitor 14 for S-character correction, the amplitude of the change follows the parabolic signal VP and changes.