公开(公告)号：US20160093659A1

公开(公告)日：2016-03-31

申请号：US14889552

申请日：2014-05-09

Applicant: SONY CORPORATION

Inventor： Ryosuke NAKAMURA ,  Fumihiko KOGA ,  Taiichiro WATANABE

IPC: H01L27/146 ,  G01J1/44

CPC classification number: H01L27/14614 ,  G01J1/44 ,  G01J2001/448 ,  H01L27/14605 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14647 ,  H01L27/14689

Abstract: There is provided a solid-state image pickup device including: a semiconductor substrate (21); a photodiode (11A, 11B) formed in the semiconductor substrate; a transistor (10) having a gate electrode (14) part or all of which is embedded in the semiconductor substrate, the transistor being configured to read a signal electric charge from the photodiode via the gate electrode; and an electric charge transfer layer (13) provided between the gate electrode and the photodiode.