公开(公告)号：WO2006121486A3

公开(公告)日：2007-07-26

申请号：PCT/US2006006921

申请日：2006-02-28

Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  GOODWIN PAUL ,  WOLFE MARK

Inventor： WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  GOODWIN PAUL ,  WOLFE MARK

IPC: H05K1/14

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Abstract translation: 灵活的电路装有集成电路，沿其主要一侧或两侧布置。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且包括当柔性电路产生时设置在较高热能装置（例如AMB）附近的高导热性芯或区域 底物。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。