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11.发明授权公开(公告)号：US11810604B2
公开(公告)日：2023-11-07
申请号：US17949712
申请日：2022-09-21
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico Giusti , Marco Ferrera
CPC classification number: G11B5/6058 , G11B5/483 , G11B5/73919 , H10N30/03 , H10N30/2047
Abstract: Various embodiments of the present disclosure provide a read/write device for a hard-disk memory system. The read/write device includes a fixed structure; a membrane region including a first and a second membrane, which are constrained to the fixed structure, and a central portion, interposed between the first and second membranes; a first and a second piezoelectric actuator, mechanically coupled, respectively, to the first and second membranes; and a read/write head, which is fixed to the central portion of the membrane region. The first and second piezoelectric actuators can be controlled so as to cause corresponding deformations of the first and second membranes, said deformations of the first and second membranes causing corresponding movements of the read/write head with respect to the fixed structure.
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公开(公告)号：US11498335B2
公开(公告)日：2022-11-15
申请号：US17107683
申请日：2020-11-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico Giusti , Marco Ferrera , Carlo Luigi Prelini , Mauro Cattaneo , Andrea Nomellini
Abstract: A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.
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13.发明授权公开(公告)号：US11427463B2
公开(公告)日：2022-08-30
申请号：US16165828
申请日：2018-10-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Dario Paci , Marco Ferrera , Andrea Picco
IPC: B81B3/00 , H01L41/09 , H01L41/22 , B81C1/00 , H01L41/31 , G02B3/14 , G02B26/08 , H01L25/16 , H01L41/187
Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.
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14.发明授权公开(公告)号：US11383971B2
公开(公告)日：2022-07-12
申请号：US16518865
申请日：2019-07-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Fabio Quaglia , Marco Ferrera , Marco Del Sarto
Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.
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公开(公告)号：US10974508B2
公开(公告)日：2021-04-13
申请号：US16392007
申请日：2019-04-23
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Domenico Giusti , Marco Ferrera , Carlo Luigi Prelini
Abstract: A fluid ejection device, comprising: a chamber; a membrane, with a first side and a second side opposite to one another, where the first side faces the chamber; an actuator, of a piezoelectric type, which extends on the second side of the membrane and is operatively coupled to the membrane for causing, in use, a vibration of the membrane; a passivation layer, which extends only alongside, or partially on, the actuator; and a protection layer, which extends on the actuator at least in surface portions of the latter that are free from the passivation layer, and has a Young's modulus lower than the Young's modulus of the passivation layer.
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Patent Agency Ranking
公开(公告)号：US10746982B2
公开(公告)日：2020-08-18
申请号：US15887557
申请日：2018-02-02
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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17.发明授权Method for manufacturing a die assembly having a small thickness and die assembly relating thereto 有权具有小厚度的模具组件的制造方法和与其相关的模具组件公开(公告)号：US09327964B2
公开(公告)日：2016-05-03
申请号：US14524661
申请日：2014-10-27
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Marco Ferrera , Matteo Garavaglia , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/097 , B81C1/00238 , B81C1/00325 , B81C2203/0118 , B81C2203/0792
Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。
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18.发明申请METHOD FOR MANUFACTURING A DIE ASSEMBLY HAVING A SMALL THICKNESS AND DIE ASSEMBLY RELATING THERETO 有权用于制造具有小厚度的模具组件的方法和与其相关的模具组件公开(公告)号：US20150115378A1
公开(公告)日：2015-04-30
申请号：US14524661
申请日：2014-10-27
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Marco Ferrera , Matteo Garavaglia , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/097 , B81C1/00238 , B81C1/00325 , B81C2203/0118 , B81C2203/0792
Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。
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19.发明申请SEMICONDUCTOR INTEGRATED DEVICE WITH MECHANICALLY DECOUPLED ACTIVE AREA AND RELATED MANUFACTURING PROCESS 有权具有机械解除活动区域的半导体集成器件及相关制造工艺公开(公告)号：US20130168840A1
公开(公告)日：2013-07-04
申请号：US13719103
申请日：2012-12-18
Inventor： Angelo Antonio Merassi , Marco Ferrera , Marco Mantovani , Paolo Ferrari , Benedetto Vigna
CPC classification number: H01L23/562 , H01L21/56 , H01L23/16 , H01L23/3107 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
Abstract translation: 半导体集成器件具有：具有前表面的半导体材料体的主体和配置在前表面的有源区域; 以及具有在主体的背面承载模具的支撑元件和覆盖模具的包覆材料的包装。 机体包括机械解耦区域，机械解耦有源区域与由包装引起的机械应力; 机械解耦区域是主体内的沟槽布置，其从主体的外框架释放活动区域，设计成吸收由包装引起的机械应力。
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公开(公告)号：US11600765B2
公开(公告)日：2023-03-07
申请号：US17137220
申请日：2020-12-29
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico Giusti , Carlo Luigi Prelini , Marco Ferrera , Carla Maria Lazzari , Luca Seghizzi , Nicolo′ Boni , Roberto Carminati , Fabio Quaglia
Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.
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