公开(公告)号：EP3113511B1

公开(公告)日：2018-12-26

申请号：EP16175620.0

申请日：2016-06-22

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  BARBARA, Paul Anthony

IPC: H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

公开(公告)号：EP3206071B1

公开(公告)日：2018-09-19

申请号：EP16194664.5

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BRIOSCHI, Roberto

IPC: G02B26/08

CPC classification number: G02B26/101 ,  B81B7/008 ,  B81B2201/042 ,  B81C2203/07 ,  G02B26/0833 ,  G02B26/0841

Abstract: The mirror group (30) is formed by a monolithic frame (31) bent along a bending line (C) and including a first and a second supporting portions (32, 33) carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions (32, 33) are arranged on opposite sides of the bending line of the frame (C), angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

公开(公告)号：EP3113509B1

公开(公告)日：2018-08-01

申请号：EP16175518.6

申请日：2016-06-21

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  GRITTI, Alex ,  FORMOSA, Kevin

IPC: H04R19/00 ,  B81B7/00 ,  H04R1/06 ,  H04R31/00 ,  H04R1/04 ,  H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

公开(公告)号：EP3113511A1

公开(公告)日：2017-01-04

申请号：EP16175620.0

申请日：2016-06-22

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto ,  BARBARA, Paul Anthony

IPC: H04R19/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: A micro-electro-mechanical microphone comprising: a substrate (2); a sensor chip (5), which is coupled to the substrate (2) and integrates a micro-electro-mechanical electro-acoustic transducer (35); a control chip (6), which is joined to the substrate (2) and is operatively coupled to the sensor chip (5); a bonding ring (16), which surrounds the sensor chip (5) and the control chip (6); a cap (3), which is coupled to the substrate (2) via the bonding ring (16) and forms an acoustic chamber (4) that houses the control chip (6) and the sensor chip (5); a barrier (18), which extends between the bonding ring (16) and the sensor chip (5) at a first distance and a second distance, respectively, therefrom, for defining a first trench (19) between the bonding ring (16) and the barrier (18) and a second trench (25) between the barrier (18) and the sensor chip (5).

Abstract translation: 一种微机电麦克风，包括：基板（2）; 传感器芯片（5），其耦合到所述基板（2）并且集成了微电机电声换能器（35）; 控制芯片（6），其连接到所述基板（2）并且可操作地耦合到所述传感器芯片（5）; 围绕传感器芯片（5）和控制芯片（6）的接合环（16）; 盖（3），其经由所述接合环（16）联接到所述基板（2），并形成容纳所述控制芯片（6）和所述传感器芯片（5）的声室（4）; 阻挡层（18），其分别在所述接合环（16）和所述传感器芯片（5）之间以其第一距离和第二距离延伸，用于限定所述接合环（16）和所述传感器芯片（5）之间的第一沟槽（19） 和阻挡层（18）和位于阻挡层（18）和传感器芯片（5）之间的第二沟槽（25）。

公开(公告)号：EP3113510A1

公开(公告)日：2017-01-04

申请号：EP16175630.9

申请日：2016-06-22

Applicant: STMicroelectronics S.r.l. ,  Stmicroelectronics (Malta) Ltd

Inventor： BRIOSCHI, Roberto

IPC: H04R19/00

Abstract: A microelectromechanical microphone includes: a supporting substrate (2), having a first face (2a) and a second face (2b); a sensor chip (5), bonded to the first face (2a) of the supporting substrate (2) and integrating a microelectromechanical electroacoustic transducer (35); and a control chip (6) operatively coupled to the sensor chip (5), at least one portion of the control chip (6) being comprised between the first face (2a) and the second face (2b) of the supporting substrate (2). The sensor chip (5) is at least partially arranged on top of the control chip (6).

Abstract translation: 微电机麦克风包括：具有第一面（2a）和第二面（2b）的支撑衬底（2）; 传感器芯片（5），其结合到所述支撑基板（2）的第一面（2a）并且集成微机电电声换能器（35）; 以及可操作地耦合到所述传感器芯片（5）的控制芯片（6），所述控制芯片（6）的至少一部分包括在所述支撑衬底（2）的第一面（2a）和第二面（2b）之间 ）。 传感器芯片（5）至少部分地布置在控制芯片（6）的顶部上。

公开(公告)号：EP2032255A1

公开(公告)日：2009-03-11

申请号：EP06780577.0

申请日：2006-06-23

Applicant: STMicroelectronics S.r.l.

Inventor： MAGNI, Pierangelo ,  BRIOSCHI, Roberto

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L2200/027 ,  B01L2200/10 ,  B01L2300/043 ,  B01L2300/0609 ,  B01L2300/0867 ,  B01L2300/123 ,  B01L2300/1805 ,  B01L2400/0481 ,  B01L2400/0622 ,  B01L2400/0638 ,  B01L2400/0644 ,  Y10T436/25 ,  Y10T436/2575

Abstract: In a microfluidic assembly (20), a microfluidic device (1') is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (1'). The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10'), adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.