Abstract:
A microelectromechanical device includes a substrate (21), a first structural layer (23), and a second structural layer (25) of semiconductor material. A sensing mass (32; 132) extends in the first structural layer (23) and is coupled to the substrate (21) by first elastic connections (35) that oscillate in a sensing direction (Z) perpendicular to the substrate (21), with a maximum elongation with respect to a resting position. An out-of-plane stopper structure (38) includes an anchorage (39) fixed to the substrate (21) and a mechanical end-of-travel structure (40), which extends in the second structural layer (25), faces the sensing mass (32), and is separated therefrom by a gap (41) having a width (W) smaller than the maximum elongation. The mechanical end-of-travel structure (40) is coupled to the anchorage (39) by second elastic connections (42) that enable shifts of the mechanical end-of-travel structure (40) with respect to the sensing direction (Z) in response to an impact of the sensing mass (32).
Abstract:
A microelectromechanical gyroscope includes: a substrate (2); a stator sensing structure (16b) fixed to the substrate (2); a first mass (7) elastically constrained to the substrate (2) and movable with respect to the substrate (2) in a first direction (D1); a second mass (8) elastically constrained to the first mass (7) and movable with respect to the first mass (7) in a second direction (D2); and a third mass (10) elastically constrained to the second mass (8) and to the substrate (2) and capacitively coupled to the stator sensing structure (16b), the third mass (10) being movable with respect to the substrate (2) in the second direction (D2) and with respect to the second mass (8) in the first direction (D1).
Abstract:
A microelectromechanical device includes: a support body (8, 10-13); at least one movable mass (15) of semiconductor material, elastically constrained to the support body (8, 10-13) so as to be able to oscillate; fixed detection electrodes (22, 23) rigidly connected to the support body (8, 10-13) and capacitively coupled to the at least one movable mass (15); and at least one test structure (17) of semiconductor material, rigidly connected to the support body (8, 10-13) and distinct from the fixed detection electrodes (22, 23). The test structure (17) is capacitively coupled to the at least one movable mass (15) and is configured to apply electrostatic forces (FX, FY, FZ) to the at least one movable mass (15) in response to a voltage between the test structure (17) and the at least one movable mass (15).
Abstract:
A MEMS angular rate sensor is presented with two pairs of suspended masses that are micromachined on a semiconductor layer. A first pair includes two masses opposite to and in mirror image of each other. The first pair of masses has driving structures to generate a mechanical oscillation in a linear direction. A second pair of masses includes two masses opposite to and in mirror image of each other. The second pair of masses is coupled to the first pair of driving masses with coupling elements. The two pairs of masses are coupled to a central bridge. The central bridge has a differential configuration to reject any external disturbances. Each of the masses of the two pairs of masses includes different portions to detect different linear and angular movements.
Abstract:
The MEMS gyroscope (1) is formed by a substrate (5), a first mass (7) and a second mass (10), wherein the first and the second masses are suspended over the substrate and extend, at rest, in a plane of extension (XY) defining a first direction (X) and a second direction (Y) transversal to the first direction. The MEMS gyroscope further has a drive structure (48) coupled to the first mass and configured, in use, to cause a movement of the first mass in the first direction, and an elastic coupling structure (25), which extends between the first mass and the second mass and is configured to couple the movement of the first mass in the first direction (X) with a movement of the second mass in the second direction (Y). The elastic coupling structure has a first portion (27, 28, 30, 31, 36, 37) having a first stiffness and a second portion (26, 33, 34) having a second stiffness greater than the first stiffness. The first portion of the elastic coupling structure extends, at rest, in the first and the second directions, and the second portion extends, at rest, in a third direction (C), in the plane of extension, transversal to the first and the second directions.
Abstract:
A circuit (10) comprises an inertial measurement unit such as a MEMS gyroscope (12) configured to be oscillated via a driving signal ( D + , D - , Dsq ) produced by driving circuitry (14A, 14B, 16, 18, 20A, 20B, 22, 24, 26, 28, 30, 32) and a lock-in amplifier, LIA (38) receiving a sensing signal ( S + , S - , Ssq ) from the inertial measurement unit (12) as well as a reference demodulation signal which is a function of the driving signal ( D + , D - , Dsq ). The LIA amplifier (38) is configured to produce an inertial measurement signal ( Vout ) based on the sensing signal ( S + , S - , Ssq ) from the inertial measurement unit (12) and the reference demodulation signal, wherein the reference demodulation signal is affected by a variable phase error. Phase meter circuitry (40) configured to receive the driving signal ( D + , D - , Dsq ) and the sensing signal ( S + , S - , Ssq ) produces, as a function of the phase difference ( ΔΦds ) between the driving signal ( D + , D - , Dsq ) and the sensing signal ( S + , S - , Ssq ), a phase correction signal. The phase correction signal is applied (56) to the reference demodulation signal of the lock-in amplifier (38). In response to the phase correction signal being applied (56) to the reference demodulation signal of the lock-in amplifier (38) the phase error is maintained in the in the vicinity of a reference value ( Φer0 ), thus minimizing the effects of the variation of the phase error.
Abstract:
A frequency modulation MEMS triaxial gyroscope (10), having two mobile masses (11A, 11B); a first and a second driving body (31A, 31B) coupled to the mobile masses (11A, 11B) through elastic elements (41A, 41B) rigid in a first direction (X) and compliant in a second direction transverse to the first direction (Y); and a third and a fourth driving body (32A, 32B) coupled to the mobile masses through elastic elements (42A, 42B) rigid in the second direction and compliant in the first direction (X). A first and a second driving element (59A) are coupled to the first and second driving bodies (31A, 31B) for causing the mobile masses to translate in the first direction in phase opposition. A third and a fourth driving element (63A) are coupled to the third and fourth driving bodies (32A, 32B) for causing the mobile masses to translate in the second direction and in phase opposition. An out-of-plane driving element (68A) is coupled to the first and second mobile masses for causing a translation in a third direction (Z), in phase opposition. Movement-sensing electrodes (60A, 64A, 69A) generate frequency signals as a function of external angular velocities.