Abstract:
The phase change memory cell (5) is formed by a resistive element (22) and by a memory region (38) of a phase change material. The resistive element has a first thin portion having a first sublithographic dimension in a first direction (Y) ; and the memory region (38) has a second thin portion (38a) having a second sublithographic dimension in a second direction (X) transverse to the first dimension. The first thin portion (22) and the second thin portion (38a) are in direct electrical contact and define a contact area (58) of sublithographic extension. The second thin portion (38a) is delimited laterally by oxide spacer portions (55a) surrounded by a mold layer (49) which defines a lithographic opening (51). The spacer portions (55a) are formed after forming the lithographic opening, by a spacer formation technique.
Abstract:
A vertical-current-flow resistive element (12) comprising a monolithic region (12) having a first portion (12a) and a second portion (12b) arranged on top of one another and formed by a single material. The first portion has a first resistivity, and the second portion (12b) has a second resistivity, lower than the first resistivity. To this aim, a monolithic region with a uniform resistivity and a height greater than at least one of the other dimensions is first formed; then the resistivity of the first portion (12a) is increased by introducing, from the top, species that form a prevalently covalent bond with the conductive material of the monolithic region, so that the concentration of said species becomes higher in the first portion (12a) than in the second portion (12b). Preferably, the conductive material is a binary or ternary alloy, chosen from among TiAl, TiSi 2 , Ta, WSi, and the increase in resistivity is obtained by nitridation.