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    MAGNETIC STRIPE DATA TRANSMISSION DEVICE AND METHOD
    11.
    发明公开
    MAGNETIC STRIPE DATA TRANSMISSION DEVICE AND METHOD 审中-公开

    公开(公告)号：EP3418940A1

    公开(公告)日：2018-12-26

    申请号：EP17796375.8

    申请日：2017-05-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： KUM, Junsig ,  OLYUNIN, Nikolay ,  LEE, Youngju ,  LEE, Jungyub ,  HA, Dohyuk

    IPC: G06K7/08 ,  G06Q20/32 ,  G06Q20/20 ,  H04B5/00 ,  G07G1/00

    CPC classification number: G07F7/0893 ,  G06Q20/204 ,  G06Q20/3278 ,  G07F7/086 ,  H04B5/00

    Abstract: The present invention relates to a device for transmitting data and, particularly, to a device for transmitting data by using a magnetic stripe method. According to one embodiment of the present invention, the magnetic stripe data transmission device comprises: a coil to which a current is supplied in a first direction and a second direction, which is opposite to the first direction; a core for inducing a magnetic field when the current is supplied to the coil; a power source for supplying the current to the coil; driving units for intermittently supplying, to the coil, in the first direction or the second direction, a burst pulse or pseudo-burst pulse current supplied from the power source; and a control unit for outputting, to the driving units, a control signal in order to perform control such that the current is supplied to the coil alternately in the first direction and the second direction, wherein the core can be made of a material having an aspect ratio value of at least 0.5, having a coercivity value of 1000-10,000 [A/m], and having pseudo-hard magnetic density of which the saturated magnetic flux density value is at least 1 [T].

    SEPARABLE ANTENNA AND ELECTRONIC DEVICE COMPRISING SAME
    13.
    发明公开
    SEPARABLE ANTENNA AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：EP4243202A1

    公开(公告)日：2023-09-13

    申请号：EP22750060.0

    申请日：2022-02-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： PARK, Sanghoon ,  BAEK, Kwanghyun ,  LEE, Juneseok ,  HA, Dohyuk ,  PARK, Jungho ,  LEE, Youngju ,  LEE, Jungyub ,  HEO, Jinsu

    IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02

    Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). According to embodiments of the present disclosure, the antenna module comprises: a plurality of antennas; a first printed circuit board (PCB) on which the plurality of antennas are disposed; a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed; and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB and a coupling pad of the second PCB.

    ANTENNA MODULE AND DEVICE INCLUDING SAME
    17.
    发明公开
    ANTENNA MODULE AND DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：EP4246720A1

    公开(公告)日：2023-09-20

    申请号：EP22752988.0

    申请日：2022-02-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： LEE, Juneseok ,  KIM, Youngsub ,  PARK, Sanghoon ,  PARK, Jungho ,  BAEK, Kwanghyun ,  LEE, Youngju ,  LEE, Jungyub ,  HA, Dohyuk ,  HEO, Jinsu

    IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/22

    Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to various embodiments of the present disclosure, an antenna device may include a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include an RF routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements through a second surface of the second PCB opposite the first surface of the second PCB.

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