公开(公告)号：EP4290692A1

公开(公告)日：2023-12-13

申请号：EP22811611.7

申请日：2022-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： BAEK, Kwanghyun ,  KIM, Youngsub ,  KIM, Jinhoon ,  PARK, Chunmyung ,  LEE, Youngju ,  LEE, Juneseok ,  CHA, Wangi ,  HA, Dohyuk

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/46 ,  H01Q1/52

Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.