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    LOW TEMP. MELTING OBJECT RECOVERING APPARATUS
    18.
    发明专利
    LOW TEMP. MELTING OBJECT RECOVERING APPARATUS 失效

    公开(公告)号：JPH08274462A

    公开(公告)日：1996-10-18

    申请号：JP7687095

    申请日：1995-03-31

    Applicant: SONY CORP

    Inventor： SUGAMA MITSUO ,  NAGATA SHINJI ,  YANAGIDA HIDETAKA ,  TAKAYAMA KINJIRO

    IPC: B23K1/00 ,  H05K3/22 ,  H05K3/34

    Abstract: PURPOSE: To provide a low temp. melting object recovering apparatus capable of recovering Pb or other metals, etc., at a proper high rate from among wastes, without giving influence on the health of workers. CONSTITUTION: A printed circuit board from which metals such as solder are to be separated and removed is thrown in a rotary mesh cage 150 of a centrifuge 110 and preheated to avoid unnecessary damage to mounted components. It is rotated at a low speed by a centrifugal motor 120 and heated gradually with a jet of hot air up to a specified temp. gradient. Then the rotation speed is increased gradually up to a specified speed enough to separate and heat it such that the molten solder is scattered by the centrifugal force to deposit to a fixed hot cage 140, droops down along this cage in a molten state and finally drains outside from a separating drain hole 132 of a heat insulated box 130.

    LOW TEMP. MELTING OBJECT RECOVERING APPARATUS
    19.
    发明专利
    LOW TEMP. MELTING OBJECT RECOVERING APPARATUS 失效

    公开(公告)号：JPH08274461A

    公开(公告)日：1996-10-18

    申请号：JP7686995

    申请日：1995-03-31

    Applicant: SONY CORP

    Inventor： SUGAMA MITSUO ,  NAGATA SHINJI ,  YANAGIDA HIDETAKA ,  TAKAYAMA KINJIRO

    IPC: B23K1/00 ,  H05K3/22 ,  H05K3/34

    Abstract: PURPOSE: To provide a low temp. melting object recovering apparatus capable of recovering Pb or other metals, etc., from a printed circuit board efficiently, without giving influence on the health of workers. CONSTITUTION: A printed circuit board is thrown in a heat-insulated box 110 from a rotary conveyer 120 and gradually heated with preheated air P in a preheating zone 130. Since an inert gas is circulated in the box 110, the circuit board never fires due to this heating. Then, in a separating-heating zone 140, hot jet J at about 400-800 deg.C is applied to the circuit board at a pressure of 1-3[kg/cm ] to melt and scatter metals such as solder wherein the hot jet J is incident obliquely to the board to result in efficient separation of the solder. The metal scattered from the board is recovered from a separating discharge hole 113. The remaining board is cooled enough by a cold air C in a cooling zone and discharged from a discharge hole 112.

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