公开(公告)号：US20180190628A1

公开(公告)日：2018-07-05

申请号：US15395584

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01L31/02 ,  H01L31/167 ,  H01L49/02 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L25/167 ,  H01F38/14 ,  H01L23/315 ,  H01L23/49 ,  H01L23/49575 ,  H01L24/08 ,  H01L24/48 ,  H01L24/85 ,  H01L28/10 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/103 ,  H01L31/1105 ,  H01L31/167 ,  H01L33/00 ,  H01L33/62 ,  H01L2224/08113 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2924/12041 ,  H01L2924/12043 ,  H04B10/803

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

公开(公告)号：US12187601B2

公开(公告)日：2025-01-07

申请号：US16247118

申请日：2019-01-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/28 ,  B81B7/00 ,  B81C1/00 ,  H01L21/02 ,  H01L21/56 ,  H01L31/0203

Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US11487381B2

公开(公告)日：2022-11-01

申请号：US16512020

申请日：2019-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Wei-Yan Shih ,  Steve Kummerl ,  Mark Stephen Toth ,  Alok Lohia ,  Terry Lee Sculley ,  Seung Bae Lee ,  Scott Robert Summerfelt

IPC: G01L1/18 ,  G06F3/041 ,  G01L1/16 ,  G01L1/22

Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.

公开(公告)号：US11264369B2

公开(公告)日：2022-03-01

申请号：US16859345

申请日：2020-04-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Stassen Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01F38/14 ,  H01L31/0203 ,  H01L31/101 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L49/02 ,  H01L31/02 ,  H01L31/103 ,  H01L31/11 ,  H01L31/167 ,  H01L33/62 ,  H04B10/80 ,  H01L33/00 ,  H01L33/60 ,  H01L23/00

Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

公开(公告)号：US20200258874A1

公开(公告)日：2020-08-13

申请号：US16859345

申请日：2020-04-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Stassen Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01L33/00 ,  H04B10/80 ,  H01L33/62 ,  H01L31/167 ,  H01L31/11 ,  H01L31/103 ,  H01L31/02 ,  H01L49/02 ,  H01L23/495 ,  H01L23/49 ,  H01L23/31 ,  H01F38/14 ,  H01L31/101 ,  H01L31/0203

Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

公开(公告)号：US10424551B2

公开(公告)日：2019-09-24

申请号：US15913497

申请日：2018-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  G02B27/09 ,  G02B3/08 ,  G02B19/00

Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.

公开(公告)号：US10074639B2

公开(公告)日：2018-09-11

申请号：US15395584

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01F38/14 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L49/02 ,  H01L31/02 ,  H01L31/103 ,  H01L31/11 ,  H01L31/167 ,  H01L33/62 ,  H04B10/80 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01F38/14 ,  H01L23/315 ,  H01L23/49 ,  H01L23/49575 ,  H01L24/08 ,  H01L24/48 ,  H01L24/85 ,  H01L28/10 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/103 ,  H01L31/1105 ,  H01L31/167 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/08113 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H04B10/803 ,  H01L2224/45099

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

公开(公告)号：US09865537B1

公开(公告)日：2018-01-09

申请号：US15395817

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Steve Kummerl ,  Benjamin Stassen Cook

IPC: H01L29/00 ,  H01L23/525 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/5256 ,  H01L21/56 ,  H01L23/315 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48245

Abstract: In described examples, an apparatus includes: an integrated circuit die having multiple terminals; the integrated circuit die positioned on a die pad portion of a leadframe having leads for external connections, at least some of the leads having an inner portion electrically coupled to at least one terminal of the integrated circuit die; a fuse element coupled between one of the leads of the leadframe and at least one terminal selected from the multiple terminals of the integrated circuit die; and encapsulation material surrounding the integrated circuit die and the leadframe to form a packaged integrated circuit including the integrated circuit die and the fuse element, and having a cavity in the encapsulation material surrounding the fuse element such that the fuse element is spaced from the encapsulation material.

公开(公告)号：US20170123548A1

公开(公告)日：2017-05-04

申请号：US14926265

申请日：2015-10-29

Applicant: Texas Instruments Incorporated

Inventor： Wei-Yan Shih ,  Steve Kummerl ,  Mark Stephen Toth ,  Alok Lohia ,  Terry Lee Sculley ,  Seung Bae Lee ,  Scott Robert Summerfelt

IPC: G06F3/041

CPC classification number: G06F3/0414 ,  G06F3/0416

Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.