公开(公告)号：JP2014033046A

公开(公告)日：2014-02-20

申请号：JP2012172074

申请日：2012-08-02

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： HITOMI TATSUYA ,  YATABE OSAMU ,  INOUE YASUSHI ,  MURATA AKIKO ,  TONO SEIJI

IPC: H01L21/306 ,  H01L21/308 ,  H01L31/04

CPC classification number: Y02E10/546

Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming a texture which allows for production of a silicon substrate in which strict management of liquid composition is not required, a surface form (uneven structure) of reduced unevenness is provided and the optical reflectance is reduced furthermore, and to provide a production method of a silicon substrate having a texture (pyramidal uneven structure) formed on the surface, and applicable to a photoelectric conversion element of solar cell, or the like, by using a composition for forming a texture.SOLUTION: A composition for forming a texture contains water and a base, and further contains a phosphonic acid anion represented by following formula (1). (In the formula (1), R is an organic group of 5-25C).

Abstract translation: 要解决的问题：为了提供一种用于形成纹理的组合物，其允许制造不需要严格管理液体组合物的硅基板，提供了减小的凹凸的表面形状（不均匀结构），并且光学反射率降低 并且提供通过使用用于形成纹理的组合物提供在表面上形成的纹理（金字塔形不均匀结构）的硅基板的制造方法，并且可以应用于太阳能电池的光电转换元件等。 ：用于形成织构的组合物含有水和碱，并且还含有由下式（1）表示的膦酸阴离子。 （式（1）中，R为5〜25℃的有机基）。

公开(公告)号：JP2011238791A

公开(公告)日：2011-11-24

申请号：JP2010109321

申请日：2010-05-11

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： YATABE OSAMU ,  MURATA AKIKO

IPC: H01L21/306 ,  H01L21/308 ,  H01L31/04

CPC classification number: Y02E10/50

Abstract: PROBLEM TO BE SOLVED: To provide a composition for texture formation for a silicon substrate surface capable of forming fine uneven portions with less variation to form the silicon substrate with low reflectance, and the forming method thereof.SOLUTION: This is a composition for texture formation which contacts with a silicon substrate surface to form uneven portions on the surface, and by bringing the composition for texture formation consisting of water, base and an amide compound having an amide bond and the texture composition into contact with the silicon substrate surface, uneven potions are formed on the substrate surface.

Abstract translation: 解决问题：提供能够形成具有较小变化的微细凹凸部的硅基板表面的组织形成用组合物，以形成低反射率的硅基板及其形成方法。 解决方案：这是一种用于纹理形成的组合物，其与硅衬底表面接触以在表面上形成不均匀部分，并且通过使由水，碱和具有酰胺键的酰胺化合物组成的组合物由 纹理组成与硅衬底表面接触，在衬底表面上形成不均匀的部分。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2010238809A

公开(公告)日：2010-10-21

申请号：JP2009083439

申请日：2009-03-30

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： YATABE OSAMU ,  YAMAMOTO YASUYUKI

IPC: H05K3/24 ,  H01L23/12 ,  H05K1/03 ,  H05K1/09

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a metalized wiring substrate, capable of forming a metal wiring pattern causing no trouble such as discoloration of the surface of the wiring substrate pattern, and blisters due to peeling of the wiring substrate pattern.
SOLUTION: This metalized wiring substrate is formed by laminating a high-melting-point metal layer 20 used as the wiring pattern, a nickel layer 30 and a precious metal layer 40 on a nitride ceramics sintered body substrate 10 in this order. This method of manufacturing the metalized wiring substrate includes a process to form a paste layer containing nickel powder on the high-melting point metal layer 20 of a first laminated substrate having the high-melting point metal layer 20 laminated on the nitride ceramics sintered body substrate 10, and subsequently manufacture a second laminated substrate by forming the nickel layer 30 on the high-melting point metal layer 20 by baking the paste layer, and a process to form the precious metal layer 40 on the nickel layer 30 of the second laminated substrate obtained in the process.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决问题的方案：提供一种金属化布线基板的制造方法，其能够形成不会引起布线基板图案的表面变色等金属布线图案，以及由于布线基板的剥离引起的起泡 模式。 解决方案：该金属化布线基板通过在氮化物陶瓷烧结体基板10上依次层叠用作布线图案的高熔点金属层20，镍层30和贵金属层40而形成。 制造金属化布线基板的方法包括在层叠有氮化物陶瓷烧结体基板的具有高熔点金属层20的第一层叠基板的高熔点金属层20上形成含有镍粉末的糊层的工序 接着，通过在高熔点金属层20上形成镍层30，通过烧结膏层来制造第二层压基板，以及在第二层叠基板的镍层30上形成贵金属层40的工序 在此过程中获得。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2003286369A

公开(公告)日：2003-10-10

申请号：JP2002091302

申请日：2002-03-28

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： WATANABE KAZUTAKA ,  YATABE OSAMU

IPC: C08L21/00 ,  C08K9/04 ,  C09C1/28 ,  C09C3/10

Abstract: PROBLEM TO BE SOLVED: To provide a rubber-silica composite powder showing excellent productivity, capable of shortening kneading time to obtain a rubber such as a silica- containing SBR or the like and capable of giving excellent tensile strength and abrasion resistance due to good dispersion of the silica in the rubber. SOLUTION: The rubber-silica composite powder is a composite particle obtained by spraying a mixture of a rubber latex using an anionic emulsifier, silica and a cationic activator and drying it and preferably has an average particle diameter of 50 to 500 μm measured by a vibrating screen method. The obtained rubber-silica composite powder may be kneaded as it is to give a rubber composition or it is kneaded with an unfilled rubber to produce a rubber composition having a silica content adjusted at a predetermined content. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种显示出优异生产率的橡胶二氧化硅复合粉末，能够缩短捏合时间以获得诸如含二氧化硅的SBR等橡胶，并且能够提供优异的拉伸强度和耐磨性 以使二氧化硅在橡胶中具有良好的分散性。 解决方案：橡胶 - 二氧化硅复合粉末是通过使用阴离子乳化剂，二氧化硅和阳离子活化剂喷雾橡胶胶乳的混合物并将其干燥并优选测量的平均粒径为50至500μm而获得的复合颗粒 通过振动筛法。 所得橡胶二氧化硅复合粉末可以原样捏合，得到橡胶组合物，或者与未填充的橡胶捏合，制成二氧化硅含量调整为预定含量的橡胶组合物。 版权所有（C）2004，JPO

公开(公告)号：JP2003138025A

公开(公告)日：2003-05-14

申请号：JP2001340812

申请日：2001-11-06

Applicant: TOKUYAMA CORP

Inventor： WATANABE KAZUTAKA ,  YATABE OSAMU

IPC: C08J3/16

Abstract: PROBLEM TO BE SOLVED: To provide a process for producing a silica-filled rubber comprising a rubber, such as an SBR, containing a highly dispersed silica with good productivity without the necessity for an operation such as a special mechanical kneading. SOLUTION: A mixture of a rubber latex and silica is mixed with a cationic compound to solidify them together. It is desirable that the silica used comprises a wet-type silica in the form of an aqueous suspension and that the wet-type silica is obtained in the form of a slurry or a wet cake without drying, which is used to prepare an aqueous dispersion.

公开(公告)号：JP2007207914A

公开(公告)日：2007-08-16

申请号：JP2006023274

申请日：2006-01-31

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： YAMAMOTO YASUYUKI ,  YATABE OSAMU ,  MAEDA MASAKATSU

IPC: H05K3/24 ,  H01L23/12

CPC classification number: H01L23/15 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/092 ,  H05K3/4667 ,  H05K2201/0266 ,  H05K2201/0352 ,  Y10T428/131 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/31 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a metallized ceramic substrate which can ensure an airtight property even in a multilayer substrate having a plurality of metallized layers. SOLUTION: A method for manufacturing the metallized ceramic substrate has the steps of forming a first conductive paste layer containing a metal powder on a ceramic sintered body substrate, forming a second conductive paste layer containing the metal powder having an average particle size different from the metal powder constituting the first conductive paste layer, and sintering the first conductive paste layer and the second conductive paste layer to form a first conductive layer and a second conductive layer. A surface roughness of the first conductive layer differs from that of the second conductive layer. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供即使在具有多个金属化层的多层基板中也能确保气密性的金属化陶瓷基板。 解决方案：一种用于制造金属化陶瓷基板的方法包括以下步骤：在陶瓷烧结体基板上形成含有金属粉末的第一导电浆料层，形成含有平均粒径不同的金属粉末的第二导电浆料层 从构成第一导电膏层的金属粉末中烧结第一导电浆料层和第二导电浆料层，形成第一导电层和第二导电层。 第一导电层的表面粗糙度与第二导电层的表面粗糙度不同。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2009253196A

公开(公告)日：2009-10-29

申请号：JP2008102338

申请日：2008-04-10

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： YAMAMOTO YASUYUKI ,  YATABE OSAMU ,  MAEDA MASAKATSU

IPC: H05K1/09 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring substrate capable of forming a wiring pattern with high accuracy on an aluminum nitride sintered body with high joint strength.
SOLUTION: The manufacturing method of the wiring substrate comprises the processes of: performing calcination by applying high-melting metal paste on an aluminum nitride sintered body substrate to form the wiring pattern consisting of high-melting metal; and applying copper paste constituted by providing copper particles on the wiring pattern consisting of the high-melting metal, performing the calcination below a melting point of copper, and printing the copper paste to form a copper wiring pattern, wherein the copper paste contains 30-65 mass% of copper particles and/or copper oxide particles with average particle diameter of 100-800 nm by taking mass of the whole copper particles as 100 mass%.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够以高接头强度在氮化铝烧结体上以高精度形成布线图案的布线基板的制造方法。 布线基板的制造方法包括以下工序：在氮化铝烧结体基板上涂敷高熔点金属浆料，形成由高熔点金属构成的布线图案，进行煅烧; 并且在由高熔点金属构成的布线图案上提供铜颗粒构成的铜浆，在铜的熔点以下进行煅烧，印刷铜膏形成铜布线图案，其中， 通过将整个铜颗粒的质量为100质量％，将65质量％的平均粒径为100〜800nm的铜粒子和/或氧化铜粒子。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2007250657A

公开(公告)日：2007-09-27

申请号：JP2006069463

申请日：2006-03-14

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： YAMAMOTO YASUYUKI ,  YATABE OSAMU ,  MAEDA MASAKATSU

IPC: H05K3/06 ,  G03F7/11 ,  G03F7/40 ,  H01B13/00 ,  H01L21/027 ,  H05K3/12

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a metalized ceramic substrate having a wiring pattern with high density, high definition, and high conductivity.
SOLUTION: The method for manufacturing the metalized ceramic substrate includes: a process for forming a conductive paste layer by applying conductive paste on a ceramic sintered base material, which contains metal powder and an organic binder to be soluble in a developer; a process for forming a photo-resist layer on the conductive paste layer; a process for forming a resist pattern to be insoluble in the developer by radiating light to a desired position on the photo-resist layer; a process for forming a desired conductive paste pattern by removing a photo-resist other than the resist pattern and the conductive paste in the lower part of the photo-resist other than the resist pattern through the use of the developer; and a process for forming the wiring pattern by removing the resist pattern by calcining, and sintering a conductive paste pattern.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有高密度，高分辨率和高导电性的布线图案的金属化陶瓷基板的制造方法。 ＆lt; P＆gt;解决方案：金属化陶瓷基板的制造方法包括：通过在陶瓷烧结基材上涂覆导电性糊料形成导电性糊料层的工序，该陶瓷烧结基材含有可溶于显影剂的金属粉末和有机粘合剂， 在导电浆料层上形成光刻胶层的工艺; 通过将光照射到光致抗蚀剂层上的期望位置来形成不溶于显影剂的抗蚀剂图案的工艺; 通过使用显影剂除去抗蚀剂图案以外的抗蚀剂图案和除了抗蚀剂图案的下部的导电糊料之外的光致抗蚀剂来形成期望的导电浆料图案的工艺; 以及通过煅烧除去抗蚀剂图案并烧结导电浆料图案来形成布线图案的工艺。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2003221402A

公开(公告)日：2003-08-05

申请号：JP2002321110

申请日：2002-11-05

Applicant: TOKUYAMA CORP

Inventor： YATABE OSAMU ,  WATANABE KAZUTAKA

IPC: B60C1/00 ,  C08C1/15 ,  C08K3/36 ,  C08L21/02

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for manufacturing a rubber filled with silica that has high reinforcing properties, high abrasion resistance, and low fuel consumption, and is well dispersed in the rubber in blending with the rubber at a high concentration. SOLUTION: A rubber latex, the silica and a cationic polymer are blended together in the presence of a silane coupling agent, wherein the rubber and the silica are coagulated in the latex. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003113250A

公开(公告)日：2003-04-18

申请号：JP2002165586

申请日：2002-06-06

Applicant: TOKUYAMA CORP

Inventor： TAKEBE KAZUO ,  YATABE OSAMU

IPC: C08J3/16

Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a rubber filled with hydrated silicic acid by which the rubber such as SBR including the hydrated silicic acid is readily produced with good productivity without requiring special operation such as mechanical kneading. SOLUTION: The rubber in a rubber latex is coagulated with the hydrated silicic acid simultaneously with or after the mixing of the rubber latex with an aqueous suspension of the hydrated silicic acid containing a cationic polymer. In one preferable embodiment, the hydrated silicic acid obtained without passing a drying step after synthesis is used in combination with the one having passed the drying step for the aqueous suspension of the hydrated silicic acid.