ELECTRONIC EQUIPMENT CASING
    13.
    发明专利

    公开(公告)号:JP2002314262A

    公开(公告)日:2002-10-25

    申请号:JP2001118400

    申请日:2001-04-17

    Inventor: KURODA YOSHITO

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic equipment casing which is light in weight, thin in wall and high in rigidity. SOLUTION: In the electronic equipment casing including a base plate having an opening in its one surface and a frame positioned as opposed to the opening of the base plate to be integrated therewith, assuming that EB denotes the bending or pulling elastic modulus of the material of the base plate expressed by unit GPa and EF denotes the bending or tensile elastic modulus of the material of the frame, then relations G 1 and EF>=10 are satisfied.

    HEAT RADIATING DEVICE
    14.
    发明专利

    公开(公告)号:JP2002204091A

    公开(公告)日:2002-07-19

    申请号:JP2000401403

    申请日:2000-12-28

    Abstract: PROBLEM TO BE SOLVED: To provide a heat radiating device that has small restrictions on the shape or arrangement of respective members, excellent heat radiating efficiency and a large effect of reducing weight and is suitably used for a small-size electronic part or device. SOLUTION: The heat radiating device has a heat receiving part that is provided on a product having a built-in heating body and receives heat from the heating body, a heat transmitting part for transmitting the received heat, a heat radiating part for radiating the transmitted heat to the outside of the product, and a holding member for integrally holding the heat receiving part, the heat transmitting part and the heat radiating part as a cooling unit. At least part of the holding part of at least the heat transmitting part of the holding member is made of resin.

Patent Agency Ranking