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公开(公告)号：JPH0616911A
公开(公告)日：1994-01-25
申请号：JP17320492
申请日：1992-06-30
Applicant: TORAY INDUSTRIES , EASTMAN KODAK CO
Inventor： KUMAKI JIRO , OKITA KIYOMI , OTAWA HIDETOSHI
IPC: C08K5/06 , C08K5/1515 , C08K5/524 , C08K5/5333 , C08L67/00 , C08L67/02 , C08K5/15
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公开(公告)号：JPH0370767A
公开(公告)日：1991-03-26
申请号：JP20901089
申请日：1989-08-10
Applicant: TORAY INDUSTRIES
Inventor： OTAWA HIDETOSHI , OKITA KIYOMI , YONETANI KIICHI
Abstract: PURPOSE:To obtain a flame-retardant polyester composition having excellent moldability, electrical properties, etc., by compounding an aromatic polyester with specific amounts of an organic bromine compound having a specific molecular weight, an antimony compound and fine particles of calcium carbonate having specific particle diameter. CONSTITUTION:The objective flame-retardant polyester composition is produced by compounding (A) 100 pts.wt. of an aromatic polyester, preferably a polybutylene terephthalate having a relative viscosity of 1.15-2.0 with (B) 1-60 pts.wt. of an organic bromine compound (preferably brominated polystyrene, etc.) having an average molecular weight of >=3,000 (preferably >=5,000) and a bromine content of preferably >=30wt.%, (C) 1-50 pts.wt. of an antimony compound (preferably antimony oxide), (D) 0.01-10 pts.wt. of fine particles of calcium carbonate having an average particle diameter of =500 and/or an inorganic tin compound.
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公开(公告)号：JPS6341526A
公开(公告)日：1988-02-22
申请号：JP18519086
申请日：1986-08-08
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain the titled composition suitable for sealing semiconductor devices, having excellent heat resistance and mechanical properties, by blending an epoxy resin with a curing agent and halognated phenol polycondensate. CONSTITUTION:The aimed composition is obtained by blending (A) an epoxy resin (e.g. resin containing >=2 epoxy groups in one molecule, preferably cresol novolak type epoxy resin etc., containing an epoxy resin having =50wt% in the total epoxy resin) with (B) a curing agent (preferably phenol novolak or cresol novolak) and (C) a halogenated phenol polycondensate (preferably tribromophenol polycondensate). The chemical equivalent ratio of the components (B) to (A) is preferably 0.8-1.2 and the amount of the component (C) is preferably 7-40pts.wt. based on 100pts.wt. component (A).
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公开(公告)号：JPS6341525A
公开(公告)日：1988-02-22
申请号：JP18519186
申请日：1986-08-08
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain the titled composition, suitable for sealing semiconductor devices, having excellent heat resistance and mechanical properties, by blending an epoxy resin with a curing agent, halogenated polystyrene and halogenated poly-alpha-methylstyrene. CONSTITUTION:The aimed composition is obtained by blending (A) an epoxy resin (e.g. cresol novolak type epoxy resin containing >=2 epoxy groups in one molecule, etc.) with (B) a curing agent (preferably phenol novolak or cresol novolak) and (C) a halogenated polystyrene and/or a halogenated poly-alpha- methylstyrene (preferably having >=40wt% halogen content). The chemical equivalent ratio of components (B) to (A) is preferably 0.8-1.2 and the amount of component C is preferably 7-40pts.wt. based on 100pts.wt. component (A).
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公开(公告)号：JPH08208804A
公开(公告)日：1996-08-13
申请号：JP30725495
申请日：1995-11-27
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE: To obtain a semiconductor device sealed with a resin low in water absorption, excellent in moisture resistance, lowered in stress, large in breaking strength, excellent in mechanical properties, and high in soldering resistance. CONSTITUTION: The semiconductor device is produced by sealing semiconductor elements with an epoxy resin composition comprising (A) an epoxy resin in such an amount that the chemical equivalent ratio of a curing agent to the component A is 0.5-1.5, (B) 2-15wt.% curing agent, (C) 0.5-5wt.% silicone rubber, (D) 0.5-5wt.% polystyrene block copolymer, and (E) >=65wt.% inorganic filler.
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Patent Agency Ranking
公开(公告)号：JPH07157640A
公开(公告)日：1995-06-20
申请号：JP30880993
申请日：1993-12-09
Applicant: TORAY INDUSTRIES
Inventor： OKITA KIYOMI , OTAWA HIDETOSHI , KUMAKI JIRO
Abstract: PURPOSE:To obtain a polyester compsn. which gives a molding excellent in pin penetration strength by melt mixing a polycyclohexanedimethylene terephthalate resin with specific flame retardants and a hindered phenol compd. or a phosphite compd. CONSTITUTION:This polyester compsn. is obtd. by melt mixing 100 pts.wt. polycyclohexanedimethylene terephthalate (PCT) resin with 1-60 pts.wt. org. bromine compd. having an average mol. wt. of 3,000 or higher, 1-50 pts.wt. antimony compd., and 0.05-5 pts.wt. component comprising a hindered phenol compd. and/or a phosphite compd. having a mol.wt. of 500 or higher. The resin pref. has 80mol% or higher repeating units formed from terephthalic acid and 1,4-cyclohexanedimethanol; a brominated phenoxy compd. is a pref. example of the bromine compd.; and the hindered phenol compd. and the phosphite compd. are pref. used in a ratio of the former compd. to the latter of (1:3) to (3:1). The compsn. may further contain a glass filler surface-treated with an aminosilane and an alkoxysilane to increase pin penetration strength.
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公开(公告)号：JPH0616914A
公开(公告)日：1994-01-25
申请号：JP17316992
申请日：1992-06-30
Applicant: TORAY INDUSTRIES , EASTMAN KODAK CO
Inventor： KUMAKI JIRO , OKITA KIYOMI , OTAWA HIDETOSHI
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公开(公告)号：JPH0616912A
公开(公告)日：1994-01-25
申请号：JP17319292
申请日：1992-06-30
Applicant: TORAY INDUSTRIES , EASTMAN KODAK CO
Inventor： OKITA KIYOMI , OTAWA HIDETOSHI , KUMAKI JIRO
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公开(公告)号：JPH0258562A
公开(公告)日：1990-02-27
申请号：JP20933988
申请日：1988-08-25
Applicant: TORAY INDUSTRIES
Inventor： OKITA KIYOMI , OTAWA HIDETOSHI , YONETANI KIICHI
Abstract: PURPOSE:To obtain the subject flame-retardant composition having excellent flame-retardance, mechanical properties, electrical properties, moldability and heat-resistance, free from bleed-out tendency and emitting little gas in use by compounding a halogenated phenoxy resin and an antimony compound to a polyester. CONSTITUTION:The objective resin contains (A) 100 pts.wt. of an aromatic polyester, (B) 1-50 pts.wt. of a halogenated phenoxy resin having the recurring unit of formula (X is Cl or Br; Y is 1-10C alkylene, alkylidene, cycloalkane, carbonyl, -O-, -S- or -SO2-) and (C) 0.1-30 pts.wt. of an antimony compound. The halogenated phenoxy resin of the component B has a number-average polymerization degree (Pn) of 6-50, a weight-average polymerization degree (Pw) of 15-150 and a ratio of the weight-average polymerization degree to the number-average polymerization degree (Pw/Pn) of 1.25-5.0. The number-average particle diameter of the halogenated phenoxy resin is 0.05-2mum.
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公开(公告)号：JPS63196620A
公开(公告)日：1988-08-15
申请号：JP2708087
申请日：1987-02-10
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain a low-stress thermosetting composition excellent in heat shock resistance, bleed out resistance, mechanical strengths and moisture resistance, by mixing an epoxy resin with a curing agent and a specified modified olefin polymer. CONSTITUTION:A resin composition comprising an epoxy resin (A), a curing agent (B) and a polymer (C) obtained by grafting an unsaturated carboxylic acid or its derivative onto an olefin homopolymer or copolymer. Said epoxy resin is not particularly limited as far as it contains at least two epoxy groups in the molecule. When it is used for sealing semiconductors, it is desirable from the viewpoint of heat resistance and moisture resistance that it contains at least 50wt.%, based on the total epoxy resin, epoxy resin of an epoxy equivalent
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