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公开(公告)号：JPH05247325A
公开(公告)日：1993-09-24
申请号：JP4101292
申请日：1992-02-27
Applicant: TORAY INDUSTRIES
Inventor： OKITA KIYOMI , OTAWA HIDETOSHI , KUMAKI JIRO
Abstract: PURPOSE:To obtain the subject composition, good in heat resistance and useful for molding by injection molding with hardly any coloring with a food at a high temperature by blending polycyclohexanedimethylene terephthalate with an inorganic filler, talc and a specific compound. CONSTITUTION:The objective composition is obtained by blending (A) polycyclohexanedimethylene terephthalate or a polycyclohexanedimethylene terephthalate-based polyester prepared by partially substituting its terephthalic acid component with isophthalic acid with (B) an inorganic filler (preferably glass fiber, titanium oxide, etc.), (C) tale and (D) an organic phosphite or phosphonite compound having P-O bond bound to a 6-30C aromatic group so as to provide 5-60wt.% component (B), 0-5wt.% component (C) and 0.05-2wt.% component (D). Bis (2,6-di-t-butyl-4-methylphenyl)pentaerythritol di-phosphite, etc., are preferred as the component (C).
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公开(公告)号：JPS6343918A
公开(公告)日：1988-02-25
申请号：JP18687086
申请日：1986-08-11
Applicant: TORAY INDUSTRIES
Inventor： OTAWA HIDETOSHI , KAYABA KEIJI
Abstract: PURPOSE:To obtain the title composition excellent in heat resistance, mechanial properties and flame retardancy and useful for sealing semiconductor devices, by mixing an epoxy resin with a curing agent and a cyanuric ester of a halogenated bisphenol. CONSTITUTION:A cyanuric halide (a) is reacted with a halogenated bisphenol (b) to obtain a cyanurate (C) of the bisphenol (b) represented by the formula [wherein R are each a (halogeno)alkyl, X is Br or Cl, Y is a (halogeno) alkylene or alkylidene, -SO2-, -SO-, -S-, -O- or -CO-, l and m are each 0-5, l+m =2 and n is 1-50] and having a halogen content >=25wt%. 100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule is mixed with (B) 0.5-1.5 equivalent, per equivalent of component A, of a curing agent, 3-60pts.wt. component C and, optionally, (D) 0.1-10pts.wt. curing catalyst, 1-30pts.wt. Sb2O3, a flame- retarding aid, a filler and a mold release.
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公开(公告)号：JPS6335616A
公开(公告)日：1988-02-16
申请号：JP17756986
申请日：1986-07-30
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain the title composition excellent in heat resistance and mechanical properties and suitable for sealing semiconductors, by mixing an epoxy resin with a curing agent and a halogenated bisphenol polycarbonate oligomer. CONSTITUTION:100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule and containing at least 50wt% cresol novolak epoxy resin of an epoxy equivalent of, e.g., =25wt%) of formula I or II (wherein X is Br of Cl, R is X, alkyl or aryl, Y is alkylene, alkylidene, CO, O, S or SO2, p is 0-5, m is 1-50 and n is 0-50) as a flame retardant and 1-30pts.wt. Sb2O3 (D) as an optional component at 50-150 deg.C in, e.g., a Banbury mixer.
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公开(公告)号：JPH039948A
公开(公告)日：1991-01-17
申请号：JP14386889
申请日：1989-06-06
Applicant: TORAY INDUSTRIES
Inventor： OTAWA HIDETOSHI , OKITA KIYOMI , YONETANI KIICHI
Abstract: PURPOSE:To improve heat resistance, stability in residence during molding, high cycle characteristics and resistance to dry heat deterioration by compounding polycyclohexanedimethylene terephthalate polyester with a speci fied epoxy compd. CONSTITUTION:Terephthalic acid (or a lower alkyl ester thereof) (a) and 1,4- cyclohexanedimethanol (b) with a molar ratio of cis/trans of 50-10/50-90 are polycondensed to obtain a polycyclohexanedimethylene terephthalate (A) with a cis/trans (molar ratio) which is a ratio of the cis structure to the trans struc ture of a cyclohexane ring of (60-10)/(40-90). 100 pts.wt. component A is compounded with 0.005-10 pts.wt. epoxy compd. (B) of the formula (wherein R is a 6-30C hydrocarbon group; n is 0-20) with an average degree of polymn. of pref. 0-2 and a ratio of wt.-average mol.wt. to number-average mol.wt. of 1.0-3.0.
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公开(公告)号：JPH02202541A
公开(公告)日：1990-08-10
申请号：JP2294889
申请日：1989-01-31
Applicant: TORAY INDUSTRIES
Inventor： OKITA KIYOMI , OTAWA HIDETOSHI , YONETANI KIICHI
Abstract: PURPOSE:To obtain a flame-retardant composition having excellent fluidity in molding, appearance of moldings and mechanical characteristics by blending an aromatic polyester with a brominated styrene based polymer and specific bisamide compound and as necessary brominated epoxy compound. CONSTITUTION:The aimed composition obtained by blending (A) 100 pts. wt. aromatic polyester with (B) 1-60 pts.wt. brominated styrene based polymer (preferably tribroaopolystyrene) expressed by formula I (R is H or methyl; 1 is 1-5; m is >=30) and (C) 0-50 pts.wt. brominated epoxy compound expressed by formula II (X is 1-10C alkylene alkylidene, CO, etc.; p and q are 1-4; n' is 050) contained at a weight ratio of the component B/component C of 100/0-5/95 and at an amount of and R are 1-20C bivalent hydrocarbon groups; R , R , R and R are 1-30C monovalent hydrocarbon group).
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Patent Agency Ranking
公开(公告)号：JPS6390530A
公开(公告)日：1988-04-21
申请号：JP23443286
申请日：1986-10-03
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain the titled composition of low stress, outstanding in thermal shock resistance, soldering heat resistance, mechanical properties and moisture resistance, by incorporating an epoxy resin with a curing agent and specific copolymer. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of an epoxy resin (having in one molecule two or more epoxy groups, e.g., cresol novolak type one) with (B) pref. 0.1-10pts.wt. of a curing agent (pref. of phenol novolak or cresol novolak type) and (C) pref. 10-100pts. wt. of a copolymer from (i) ethylene or another alpha-olefin and (ii) an unsaturated carboxylic acid or its derivative (pref. ethyl acrylate, methyl methacrylate, glycidyl methacrylate or maleic anhydride).
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公开(公告)号：JPH0625517A
公开(公告)日：1994-02-01
申请号：JP17318092
申请日：1992-06-30
Applicant: TORAY INDUSTRIES , EASTMAN KODAK CO
Inventor： KUMAKI JIRO , OKITA KIYOMI , OTAWA HIDETOSHI
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公开(公告)号：JPH05140427A
公开(公告)日：1993-06-08
申请号：JP30505991
申请日：1991-11-20
Applicant: TORAY INDUSTRIES
Inventor： OKITA KIYOMI , KUMAKI JIRO , OTAWA HIDETOSHI
Abstract: PURPOSE:To prepare the subject compsn. which is excellent in stability during dwelling in a molding machine at high temp. and gives a molded article excellent in the prevention of the corrosion of a metal contact in the use at high temp. for a long time by compounding an arom. polyester with a specific polybromostyrene. CONSTITUTION:100 pts.wt. arom. polyester (e.g. polybutylene terephthalate) is compounded with 0.5-60 pts.wt. polybromostyrene which is prepd. from a bromostyrene monomer, mainly comprises structural units of the formula, and has a number-average mol.wt. of 1X10 to 30X10 and a wt.-average mol.wt. of 2X10 to 120X10 .
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公开(公告)号：JPH02245057A
公开(公告)日：1990-09-28
申请号：JP6684889
申请日：1989-03-16
Applicant: TORAY INDUSTRIES
Inventor： OKITA KIYOMI , OTAWA HIDETOSHI , YONETANI KIICHI
IPC: C08K3/10 , C08K5/02 , C08K5/13 , C08K5/52 , C08K5/521 , C08K5/524 , C08K5/59 , C08L67/00 , C08L67/02
Abstract: PURPOSE:To prepare a flame-retardant compsn. improved in the moldability, mechanical properties, arc resistance, and heat resistance by compounding an arom. polyester with an org. bromine compd., an antimony compd., a specific tin compd., and a hindered phenol compd. CONSTITUTION:100 pts.wt. arom. polyester is compounded with 1-60 pts.wt. org. bromine compd. having an average MW of at least 3000, 1-50 pts.wt. antimony compd. 0.01-10 pts.wt. at least one tin compd. selected from the group consisting of stannic acid, metastannic acid, and metal salts thereof, and 0.01-5 pts.wt. hindered phenol compd. to give a flame-retardant polyester compsn. The addition of at least one phosphorus compd. selected from the group consisting of phosphoric acid, phosphorus acid, and esters thereof to the resulting compsn. is pref. because it enables the further reduction in the quantity of a gas generated.
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公开(公告)号：JPS63248820A
公开(公告)日：1988-10-17
申请号：JP8285187
申请日：1987-04-06
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , OTAWA HIDETOSHI
Abstract: PURPOSE:To obtain the title composition of high soldering heat resistance, thermal shock resistance, moisture resistance and mechanical properties by formulating an epoxy resin, a curing agent, silicone rubber, a polystyrene block copolymer and an inorganic filler in a certain proportion. CONSTITUTION:The subject composition suitable for sealing semiconductor apparatus is obtained by forming (A) 5-25wt.% of an epoxy resin, for example, resol novolak type epoxy resin, (B) 2-15wt.% of a curing agent, preferably a phenol novolak resin, (C) 0.5-5wt.% of a silicone rubber, preferably in the form of a powder of less than 100mum average particle size, (D) 0.5-5wt.% of a polystyrene block copolymer, preferably styrene-butadiene copolymer and (E) 65-80wt.% of an inorganic filler, preferably fused silica.
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