公开(公告)号：CA2039669A1

公开(公告)日：1991-10-05

申请号：CA2039669

申请日：1991-04-03

Applicant: TORAY INDUSTRIES

Inventor： HONDA SHIRO ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI ,  KAYABA KEIJI ,  TESHIBA TOSHIHIRO

IPC: C08G59/22 ,  C08G59/24 ,  C08K7/18 ,  H01L23/29 ,  C08L63/00 ,  C08L53/02 ,  C08L23/08

Abstract: SEMICONDUCTOR DEVICE-ENCAPSULATING EPOXY RESIN COMPOSITION Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A)containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

公开(公告)号：DE69023019D1

公开(公告)日：1995-11-23

申请号：DE69023019

申请日：1990-02-20

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI

IPC: H01L23/29

Abstract: A semiconductor-encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a silane coupling agent having a secondary amino group. This composition has an excellent moldability and reliability, and a good solder dipping stability.

公开(公告)号：DE69113666T2

公开(公告)日：1996-05-09

申请号：DE69113666

申请日：1991-04-04

Applicant: TORAY INDUSTRIES

Inventor： HONDA SHIRO ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI ,  KAYABA KEIJI ,  TESHIBA TOSHIHIRO

IPC: C08G59/22 ,  C08G59/24 ,  C08K7/18 ,  H01L23/29 ,  C08K3/36 ,  C08L63/00 ,  C08L31/00 ,  C08L53/00

Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises (i) an epoxy resin (A) comprising at least one of a bifunctional epoxy resin (a1) having a biphenol skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler comprising fused silica (C) consisting of 97 to 50 wt% of crushed fused silica (C1) of a mean particle diameter not more than 10 mu m and 3 to 50 wt% of spherical fused silica (C2) of a mean particle diameter not more than 4 mu m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler is 75 to 90 wt% of the total weight of the composition.

公开(公告)号：DE69023019T2

公开(公告)日：1996-04-18

申请号：DE69023019

申请日：1990-02-20

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI

IPC: H01L23/29

Abstract: A semiconductor-encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a silane coupling agent having a secondary amino group. This composition has an excellent moldability and reliability, and a good solder dipping stability.

公开(公告)号：DE69113666D1

公开(公告)日：1995-11-16

申请号：DE69113666

申请日：1991-04-04

Applicant: TORAY INDUSTRIES

Inventor： HONDA SHIRO ,  SAWAMURA YASUSHI ,  TANAKA MASAYUKI ,  KAYABA KEIJI ,  TESHIBA TOSHIHIRO

IPC: C08G59/22 ,  C08G59/24 ,  C08K7/18 ,  H01L23/29 ,  C08K3/36 ,  C08L63/00 ,  C08L31/00 ,  C08L53/00

Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises (i) an epoxy resin (A) comprising at least one of a bifunctional epoxy resin (a1) having a biphenol skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler comprising fused silica (C) consisting of 97 to 50 wt% of crushed fused silica (C1) of a mean particle diameter not more than 10 mu m and 3 to 50 wt% of spherical fused silica (C2) of a mean particle diameter not more than 4 mu m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler is 75 to 90 wt% of the total weight of the composition.

公开(公告)号：JP2002275357A

公开(公告)日：2002-09-25

申请号：JP2001078597

申请日：2001-03-19

Applicant: TORAY INDUSTRIES

Inventor： NIWA KATSUHIRO ,  TOKUNAGA ATSUTO ,  KAYABA KEIJI

IPC: C08L63/02 ,  C08G59/62 ,  C08K3/00 ,  C08L79/08 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has an ability to withstand the solder reflow at a high temperature. SOLUTION: The epoxy-based resin composition, comprising an epoxy resin (A), a curing agent (B), a filler (C) and a curing accelerator (D), is characterized in that the above epoxy resin (A) contains an epoxy resin expressed by chemical formula (I), and the filler has a content ratio to the whole epoxy-based resin composition of 86-96 wt.% and also the composition contains a polyimide compound (E).

公开(公告)号：JPH08208804A

公开(公告)日：1996-08-13

申请号：JP30725495

申请日：1995-11-27

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  OTAWA HIDETOSHI

IPC: C08L63/00 ,  C08G59/18 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE: To obtain a semiconductor device sealed with a resin low in water absorption, excellent in moisture resistance, lowered in stress, large in breaking strength, excellent in mechanical properties, and high in soldering resistance. CONSTITUTION: The semiconductor device is produced by sealing semiconductor elements with an epoxy resin composition comprising (A) an epoxy resin in such an amount that the chemical equivalent ratio of a curing agent to the component A is 0.5-1.5, (B) 2-15wt.% curing agent, (C) 0.5-5wt.% silicone rubber, (D) 0.5-5wt.% polystyrene block copolymer, and (E) >=65wt.% inorganic filler.

公开(公告)号：JPH0684428B2

公开(公告)日：1994-10-26

申请号：JP20191788

申请日：1988-08-15

Applicant: TORAY INDUSTRIES

Inventor： OKAMOTO MASARU ,  SUZUE SHIGERU ,  KAYABA KEIJI

IPC: C08K5/13 ,  C08G63/00 ,  C08G63/60 ,  C08G63/78 ,  C08G63/82 ,  C08K5/00 ,  C08K5/49 ,  C08L67/00 ,  C08L67/02 ,  C09K19/04

公开(公告)号：JPH0632870A

公开(公告)日：1994-02-08

申请号：JP19038792

申请日：1992-07-17

Applicant: TORAY INDUSTRIES

Inventor： TSUTSUMI YASUAKI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08G59/18 ,  C08G59/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain the subject composition containing an epoxy resin, a curing agent, a filler, a modified styrenic block copolymer and antimony tetroxide in prescribed amounts and excellent in flame resistancy, moldability, heat resistance to soldering and reliability to high temperature. CONSTITUTION:The objective composition consists essentially of (A) preferably 6-18wt.% epoxy resin, (B) preferably 3-10wt.% curing agent such as a phenolic novolak resin, (C) preferably 70-88wt.% filler such as an amorphous silica, (D) preferably 1-6wt.% modified styrenic block copolymer obtained by subjecting a styrene based block copolymer to copolymerization or graft reaction with an unsaturated carboxylic acid (derivative) and (E) 0.01-30wt.% antimony tetroxide.

公开(公告)号：JPH0625511A

公开(公告)日：1994-02-01

申请号：JP18014392

申请日：1992-07-07

Applicant: TORAY INDUSTRIES

Inventor： TSUTSUMI YASUAKI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

IPC: C08G59/18 ,  C08G59/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To provide the subject composition improved in reliability through suppressing interfacial debonding between resin and chips and the crack develop ment of resin package during semiconductor device soldering process, also excellent in moldability. CONSTITUTION:This composition comprises an epoxy resin, a curing agent, 50-95wt.% of fused silica composed of 99-50wt.% of crushed fused silica