公开(公告)号：JPH1187576A

公开(公告)日：1999-03-30

申请号：JP24912197

申请日：1997-09-12

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  SADA YUTAKA ,  IWASAKI HIDEO ,  UBUKATA HIROSHI ,  MAKITA SADAO ,  TOMIOKA KENTARO

IPC: H01L23/28 ,  H01L23/34

Abstract: PROBLEM TO BE SOLVED: To improve cooling efficiency of a heating component attached onto a substrate body while being protected by a mold to improve heat dissipation performance by providing the mold covering the heating body so that portion of a predetermined heating body is exposed. SOLUTION: The substrate includes a substrate body 10, semiconductor devices (heating bodies) 21, 22 mounted on the substrate body 10 and an insulating mold 30 comprising an insulating material, for example a resin material, for covering and protecting a vicinity of the semiconductor devices 21, 22. The semiconductor devices 21, 22 are mounted facing downward on the substrate body 10 while being in a bare chip state, respectively. The semiconductor devices 21, 22 are covered by the insulating mold 30 while rear faces 21a, 22a which are faces approximately parallel to a face where the substrate body 10 and the devices 21, 22 are in contact are exposed. Thus when air is made to flow along a surface of the substrate body 10 for cooling, since the rear faces 21a, 22a of the semiconductor devices 21, 22 are in direct contact with the air, they can be more efficiently cooled than a case where entire faces are covered by the insulating mold 30.

公开(公告)号：JPH0982732A

公开(公告)日：1997-03-28

申请号：JP23355795

申请日：1995-09-12

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  IWASAKI HIDEO ,  ISHIZUKA MASARU

IPC: H01L23/32 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device of which heat radiation is efficient and the temperature rise of the semiconductor chip is suppressed. SOLUTION: A metal layer 41, that is provided with a mesh pattern of which mounting material 35 is formed with closed cells X, is arranged on the other side of the mounting material 35 that is fixed to a wiring substrate 32, on the other side of the surface on which a circuit 38 with the region 39 of higher heat density and the region 40 of lower heat density of a semiconductor chip are formed. In the circuit of metal layer 41, the pattern of a first region 42 that corresponds to the region 39 of higher heat density is formed relatively larger than the pattern of a second region 43 that corresponds to the region 40 of lower heat density and the mounting material 35 is thinner at the region of the metal layer 41 by the thickness of it and the gradient distribution of heat transfer rate can be formed.

公开(公告)号：JPH07169805A

公开(公告)日：1995-07-04

申请号：JP31233993

申请日：1993-12-14

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L21/66

Abstract: PURPOSE:To provide a testing device for a semiconductor device, in which the difference of cooling effects due to positions, where a circuit board is arranged, is reduced while improving the cooling effect and which can conduct an excellent test. CONSTITUTION:Evaporating sections 28 for heat pipes 27 are connected thermally to large-scale integrated circuit devices 25 loaded on circuit boards 24 radially stored in a board storage body 16 while condensing sections 29 for the heat pipes 27 are connected thermally to a cooling flow path 20 formed to the board storage body 16, thus similarly cooling the condensing sections 29 for each heat pipe 27 by the cooling flow path 20, then transferring heat approximately equally in each heat pipe 27 respectively. The large-scale integrated circuit devices 25 for each circuit board 24, on which the evaporating sections 28 for the heat pipes 27 are fixed, are cooled uniformly, thus keeping the temperatures of the large-scale integrated circuit devices 25 at approximately the same temperature.

公开(公告)号：JPH0774492A

公开(公告)日：1995-03-17

申请号：JP15983093

申请日：1993-06-30

Applicant: TOSHIBA CORP

Inventor： OU ROHIN ,  IWASAKI HIDEO

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/467

Abstract: PURPOSE:To provide an air-cooling electronic apparatus and a mounting method with a good cooling effect in a small mounting space. CONSTITUTION:An inlet opening 23 and a discharge opening 25 for a forced cooling air are provided in a box 21. Then, an air-direction control unit 26 is provided at the discharge opening 25 for setting the direction of the air flow so that the discharged air from the discharge opening 25 is prevented from flowing directly into the inlet opening 23. Even in a small space, the discharged air at a high temperature after cooling doesn't return to the inlet opening 23. Consequently, the inside of the box 21 is cooled sufficiently and the mounting space can be used effectively.

公开(公告)号：JPH0736571A

公开(公告)日：1995-02-07

申请号：JP18176893

申请日：1993-07-23

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  ISHIZUKA MASARU

IPC: G06F1/16 ,  G06F1/20 ,  G06K17/00 ,  G06K19/077

Abstract: PURPOSE:To provide an IC card and the mounting device of the IC card in which the deterioration of the characteristic or reliability of a semiconductor element is reduced, a trouble such as the failure of an equipment can be reduced, and cooling efficiency can be improved. CONSTITUTION:In an IC card 11, an air introducing port 15 is provided at the mounting end part of a card-shaped main body case 12 which houses semiconductor elements 19a and 19b, and an air ejecting port 16 is provided so as to be opposed to the air introducing port 15. Also, an equipment casing body 23 is equipped with a slot 25 having a cover 27 which opens and closes when the IC card 11 is inserted into or pulled out from a mounting part 24, so that the IC card 11 can be cooled by the cool air of the casing body 23 when the card 11 is inserted into the slot 25, and the intrusion of dusts can be suppressed, and the useless outflow of the cool air can be avoided since the slot 25 of the casing body 23 is closed with the cover 27 when the IC card 11 is pulled out. Thus, the deterioration of the characteristic or the reliability of the semiconductor element accompanying the rising of temperature can be reduced, the trouble such as the failure of the equipment can be reduced, and the cooling efficiency can be improved.

公开(公告)号：JPH06267692A

公开(公告)日：1994-09-22

申请号：JP5232193

申请日：1993-03-12

Applicant: TOSHIBA CORP

Inventor： FUJIMORI YOSHINORI ,  TSUCHIYA AKIRA ,  MONMA JUN ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H05G1/04 ,  H05G1/66

Abstract: PURPOSE:To provide a X-ray tube device which can efficiently disperse heat generated at an X-ray tube section, makes the rotating efficiency of a rotor high and heat radiating performance excellent with a device made small in size. CONSTITUTION:The device is equipped with an X-ray tube 3 where a rotating anode 6 and a cathode 7 are disposed while being faced to each other within a tube, a field coil 10 which is disposed around the outer circumferential section of the X-ray tube 3 to rotate the rotating anode 6, and with a solid insulating body 18 which integrally molds at least, the outer circumferential section of the rotating anode for the aforesaid X-ray tube 3 and the field coil 10. In addition, as the solid insulating body 18, solid insulating material is employed, in which high heat conductive fillers are dispersed in base material composed of resin, or resin itself.

公开(公告)号：JPH06267690A

公开(公告)日：1994-09-22

申请号：JP5244493

申请日：1993-03-12

Applicant: TOSHIBA CORP ,  TOSHIBA MATERIAL ENG KK

Inventor： FUJIMORI YOSHINORI ,  TSUCHIYA AKIRA ,  MONMA JUN ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  SORI NAOYUKI ,  SAKAMOTO TOSHIYA ,  SHIZU HIROMI ,  SANO TAKASHI

IPC: H01J35/02 ,  H05G1/02 ,  H05G1/04

Abstract: PURPOSE:To efficiently disperse heat generated, and concurrently enable a device to be made small in size while the rotating efficiency of a rotor is being enhanced by letting insulating heat radiating material be composed of solid insulating material in which high heat conductive fillers are dispersed in base material composed of resin. CONSTITUTION:The device is equipped with insulating heat radiating material 17 which is molded in each gap between a device main body and each component. And the heat radiating material 17 is composed of solid insulating material 18 in which aluminum nitride sintered powder is dispersed as a high heat conductive filler into base material composed of epoxyresin. And a support insulating pipe 8a is also formed out of the insulating material 18. Since the insulating material 18 whose insulating proof strength and heat conductivity are equal to or more than those each of which is four timed as large as that of insulating oil, is used as the heat radiating material 17, each insulating distance among component parts such as a X-ray tube 3, a field coil 10 and the like can be made small, moreover, its cooling characteristics can also be improved. Therefore, the device can be made small in size and light in weight.

公开(公告)号：JPH06209057A

公开(公告)日：1994-07-26

申请号：JP2920093

申请日：1993-02-18

Applicant: TOSHIBA CORP

Inventor： MONMA JUN ,  FUJIMORI YOSHINORI ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  SHIMOTORI KAZUMI ,  OKAMOTO MITSUHIRO ,  NAKAYAMA NORIO ,  YAMAKAWA KOJI

IPC: H01L23/373

Abstract: PURPOSE:To reduce the thermal contact resistance between a heat generating body and cooling parts by dispersing the powder of sintered aluminum nitride in the matrix of a flexible insulating material. CONSTITUTION:A module structure body 1a is constituted by mounting and sticking a TEG chip 3 for measuring thermal resistance of 10W in power consumption on and to the upper surface of a ceramic substrate 2 made of aluminum nitride as a semiconductor element 3. A heat radiating fin 4 is put on the upper surface of the chip 3 with a sheet-like heat radiating body 11 which has high thermal conductivity and in the resin matrix of which the powder of sintered aluminum nitride is dispersed and grease-like heat radiating body 12 having high thermal conductivity in between. Therefore, the thermal contact resistance between a heat generating body and cooling parts can be remarkably reduced when the heat radiating bodies 11 and 12 are interposed between them, because the bodies 11 and 12 have high coefficients of thermal conductivity, plasticity, and flexibility and the degree of contact between the bodies 11 and 12 is improved.

公开(公告)号：JPH0674675A

公开(公告)日：1994-03-18

申请号：JP23073392

申请日：1992-08-31

Applicant: TOSHIBA CORP

Inventor： OU ROHIN ,  MIZUKAMI HIROSHI ,  KUNO KATSUMI ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  KAWANO KOICHIRO

IPC: F25B39/00 ,  F28F3/00

Abstract: PURPOSE:To obtain a laminate body heat exchanger and a manufacture thereof which has no drop in the efficiency of the heat exchanger because of the effect of a contact heat resistance while achieving a handy designing of a production process and a reduction in production costs. CONSTITUTION:A laminate body heat exchanger has a plurality of slits formed parallel on a sheet comprising a high thermal conductive material such as copper and aluminum and a pin fin part 5 built up with a part left between slits. A fin element 1 which is provided with a rectangular hole 6 to form a refrigerant passage is laminated on both end sides in the longitudinal direction (vertical way) of the pin fin part 5 through a spacer 2 provided with a rectangular hole 7 alone corresponding to the rectangular hole 6 for forming the refrigerant passage of the fin element 1 so that the rectangular holes 6 and 7 form continuous through passages 12.

公开(公告)号：JPH01248519A

公开(公告)日：1989-10-04

申请号：JP7443888

申请日：1988-03-30

Applicant: TOSHIBA CORP

Inventor： IWASAKI HIDEO

IPC: B05C11/08 ,  G03F7/16 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To enable a uniform resist film over the entire area of substrate to be formed by providing a plurality of supply ports of resist liquid solution. CONSTITUTION:A resist liquid solution supply port is located directly above the rotary center of a substrate 3 which is retained by a spinner 4 and the other resist liquid solution supply port 10 is provided at an area other than directly above the rotary center. Since resist liquid solution is supplied also from this supply port 10, nonuniform area of resist film expanding radially from the rotary center is relaxed. In this manner, nonuniform area of resist film extending in the direction of radius of substrate caused by the difference in recessed and projecting stages of etching pattern is relaxed and a resist film with uniform composition and film thickness can be obtained.