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    11.
    发明专利
    未知

    公开(公告)号：DE69700019T2

    公开(公告)日：1999-03-25

    申请号：DE69700019

    申请日：1997-01-17

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： PARKOS JOSEPH J ,  KLEIN JOHN J ,  HERTEL CHRISTOPHER J ,  BLACKBURN LOUIS

    IPC: B64C3/00 ,  B32B15/08 ,  B32B15/082 ,  C08J5/12 ,  F01D5/28 ,  B32B31/12

    Abstract: The present invention related to a method for providing a composite structure and the composite structure formed thereby. The method broadly comprises the steps of: providing a core structure (12) formed from a non-metallic composite material in a substantially uncured state; applying a fluoroelestomer film (14) in a substantially uncured state over surface portions of said core structure (12); placing a metallic structure (16) over a portion of said core structure, said metallic structure having inner surfaces which contacts said fluoroelastomer film (14), and molding said composite structure under conditions of heat and pressure for a time sufficient to co-cure said fluoroelastomer film (14) and said non-metallic core structure material (12) and to form a bond between said fluoroelastomer film and said inner surfaces of said metallic structure. The method of the present invention may be used to manufacture original metal/composite ssssstructures as well as to refurbish metal/composite structures such as fan exit guide vanes for jet engines.

    12.
    发明专利
    未知

    公开(公告)号：AT155388T

    公开(公告)日：1997-08-15

    申请号：AT93909190

    申请日：1993-03-26

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： HERTEL CHRISTOPHER J ,  WATSON CHARLES R ,  LESHANE JEFFREY S

    IPC: B29C45/00 ,  B29C45/02 ,  B29C45/34

    Abstract: A substantially microcrack- and blister-free composite can be made by drying an addition-type polyimide molding compound under suitable conditions to remove excess moisture. The molding compound includes a mixture of a polyimide resin and a plurality of carbon reinforcing fibers less than 3 mm long. The molding compound is placed into a heated material reservoir and transferred to a heated molding tool with a heated transfer ram. The ram establishes a molding pressure in a mold cavity in the molding tool sufficient to cure the molding compound into the desired composite. The molding compound is transferred to the mold cavity such that the molding compound is heated to a molding temperature at a rate of at least about 85 degrees C./min. The molding pressure and temperature are maintained in the mold cavity for a time sufficient to cure the molding compound into the desired composite. The composite is cooled and then heated to a suitable post-cure temperature at a rate sufficient to permit residual volatiles in the composite to diffuse out of the composite. The composite is held at the post-cure temperature for a sufficient time and then cooled. The invention also includes an article made by this method and a vented molding tool used in the method.

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