IN-SITU BALANCING OF PLATED POLYMERS

    公开(公告)号:CA2917898A1

    公开(公告)日:2015-02-26

    申请号:CA2917898

    申请日:2014-07-09

    Abstract: A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed by plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced.

    PLATED POLYMER COMPOSITE MOLDING
    8.
    发明专利

    公开(公告)号:CA2917888A1

    公开(公告)日:2015-01-15

    申请号:CA2917888

    申请日:2014-07-09

    Abstract: Plated polymeric articles having a composite layup structure and method of making the same are disclosed. A plated polymeric article comprises a composite layup having first and second polymer layers. The plated polymeric article further comprises a first metal plated onto the polymer. Additionally, methods for fabricating a plated polymeric article are disclosed. A composite layup is provided and compression molded into a desired shape having an outer surface. The outer surface of the article is prepared to receive a catalyst and then is activated with the catalyst. A first metallic layer is then plated onto the outer surface.

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