公开(公告)号：GB2316101B

公开(公告)日：2000-05-03

申请号：GB9713795

申请日：1997-07-01

Applicant: ROGERS CORP ,  WORLD PROPERTIES INC

Inventor： ST LAWRENCE MICHAEL E ,  HAND DORIS I

IPC: C08J5/08 ,  C08J5/10 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C08K3/38 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K5/06 ,  C08K5/3417 ,  C08K7/00 ,  C08K7/02 ,  C08K7/14 ,  C08K7/16 ,  C08K7/20 ,  C08L9/00 ,  C08L21/00 ,  C08L27/18 ,  C08L47/00 ,  C08L53/00 ,  C08L53/02 ,  C08L77/10 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B5/28 ,  B32B17/04

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

公开(公告)号：WO0249405B1

公开(公告)日：2002-12-19

申请号：PCT/US0148948

申请日：2001-12-13

Applicant: WORLD PROPERTIES INC

Inventor： ST LAWRENCE MICHAEL E ,  KENNEDY SCOTT D

IPC: B32B15/08 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10T428/24917 ,  Y10T428/2495

Abstract: A multi-layer circuit comprises a circuit (18) and a resin covered conductive layer (12) disposed on the circuit (18), wherein the resin covered conductive layer (12) comprises a liquid crystalline polymer resin (16) laminated to a conductive layer (14). Such multi-layer circuits are particularly useful for high density circuit applications.

Abstract translation: 多层电路包括设置在电路（18）上的电路（18）和树脂覆盖的导电层（12），其中树脂覆盖的导电层（12）包括层压到导电的液晶聚合物树脂（16） 层（14）。 这种多层电路对于高密度电路应用特别有用。

公开(公告)号：WO0023987A9

公开(公告)日：2002-08-22

申请号：PCT/US9923374

申请日：1999-10-07

Applicant: WORLD PROPERTIES INC

Inventor： TRASKOS RICHARD T ,  KOSA BRUCE G ,  ST LAWRENCE MICHAEL E

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

CPC classification number: G11B5/486 ,  G11B5/4833 ,  G11B5/484

Abstract: The present invention is a liquid crystal polymer suspension assembly. This assembly comprises a stainless steel layer and an electrically conductive layer with a dielectric liquid crystal polymer layer disposed therebetween and bonded thereto. Due to controlled coefficient of thermal expansion, modulus, and very low moisture absorption of the liquid crystal polymer, the suspension assembly of the present invention will have improved dimensional and hygrothermal properties over conventional assemblies, enabling higher density, higher performance assemblies to be produced.

Abstract translation: 本发明是一种液晶聚合物悬浮组件。 该组件包括不锈钢层和导电层，其间设置介电液晶聚合物层并与之结合。 由于液晶聚合物的热膨胀系数，模量和非常低的吸湿性，本发明的悬浮组件将具有优于常规组件的尺寸和湿热性能，从而能够产生更高密度，更高性能的组件。

公开(公告)号：WO0224791A3

公开(公告)日：2002-06-13

申请号：PCT/US0129345

申请日：2001-09-20

Applicant: WORLD PROPERTIES INC

Inventor： KIM KI-SOO ,  ST LAWRENCE MICHAEL E ,  ROY SAROJ

IPC: C08J5/18 ,  C08L67/04 ,  C09K19/38 ,  B32B15/08 ,  C08L101/12 ,  C09D5/03 ,  C09K19/02

CPC classification number: C09K19/3809 ,  C08J5/18 ,  C08J2300/12 ,  C08J2367/00 ,  C08L67/04

Abstract: A process to produce a liquid crystalline polymer film comprises electrostatically depositing a fine powder of liquid crystalline polymer resin onto a carrier and fusing the deposited fine powder to form a liquid crystalline polymer film that is isotropic in the x-y plane. The electrostatic deposition of the resin particles results in a substantially random molecular alignment of the liquid crystalline polymer. The carrier can comprise an all metal foil, a metal foil laminate, a polymer film material, or a release material.

Abstract translation: 制备液晶聚合物膜的方法包括将液晶聚合物树脂的细粉末静电沉积到载体上并熔融沉积的细粉末以形成在x-y平面内各向同性的液晶聚合物膜。 树脂颗粒的静电沉积导致液晶聚合物的基本随机的分子取向。 载体可以包括全金属箔，金属箔层压体，聚合物膜材料或剥离材料。