ELECTROSTATIC DEPOSITION OF HIGH TEMPERATURE, HIGH PERFORMANCE THERMOPLASTICS
    2.
    发明申请
    ELECTROSTATIC DEPOSITION OF HIGH TEMPERATURE, HIGH PERFORMANCE THERMOPLASTICS 审中-公开
    静电沉积高温,高性能热塑性

    公开(公告)号:WO0224791A3

    公开(公告)日:2002-06-13

    申请号:PCT/US0129345

    申请日:2001-09-20

    Abstract: A process to produce a liquid crystalline polymer film comprises electrostatically depositing a fine powder of liquid crystalline polymer resin onto a carrier and fusing the deposited fine powder to form a liquid crystalline polymer film that is isotropic in the x-y plane. The electrostatic deposition of the resin particles results in a substantially random molecular alignment of the liquid crystalline polymer. The carrier can comprise an all metal foil, a metal foil laminate, a polymer film material, or a release material.

    Abstract translation: 制备液晶聚合物膜的方法包括将液晶聚合物树脂的细粉末静电沉积到载体上并熔融沉积的细粉末以形成在x-y平面内各向同性的液晶聚合物膜。 树脂颗粒的静电沉积导致液晶聚合物的基本随机的分子取向。 载体可以包括全金属箔,金属箔层压体,聚合物膜材料或剥离材料。

    Silanated copper foils, method of making, and use thereof

    公开(公告)号:AU2002332593A1

    公开(公告)日:2003-03-10

    申请号:AU2002332593

    申请日:2002-08-21

    Abstract: A coated foil comprises a thick silane layer disposed on the copper foil, wherein the silane layer is present in an amount greater than or equal to about 0.1 gram per square meter. The copper foil may further comprise thermal barrier. The silanated copper foil may further comprise an elastomer layer disposed on a side of the thick silane layer opposite the copper foil. When the silanated copper foil is used in the manufacture of circuit materials the circuit materials demonstrate improved bond retention after exposure to acidic processing conditions.

    Conductive polymer foams method of manufacture and uses thereof

    公开(公告)号:GB2458067A

    公开(公告)日:2009-09-09

    申请号:GB0911839

    申请日:2008-02-06

    Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of electrically conductive particles aligned into a plurality of columns that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.

    Conductive polymer foams, method of manufacture, and uses thereof

    公开(公告)号:GB2458066A

    公开(公告)日:2009-09-09

    申请号:GB0911838

    申请日:2008-02-06

    Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.

    METHOD FOR IMPROVING BONDING OF RIGID, THERMOSETTING COMPOSITIONS TO HYDROPHILIC SURFACES, AND THE ARTICLES FORMED THEREBY
    8.
    发明申请
    METHOD FOR IMPROVING BONDING OF RIGID, THERMOSETTING COMPOSITIONS TO HYDROPHILIC SURFACES, AND THE ARTICLES FORMED THEREBY 审中-公开
    用于改善刚性,热固化组合物与水凝胶表面粘结的方法及其形成的制品

    公开(公告)号:WO0179371A3

    公开(公告)日:2002-02-07

    申请号:PCT/US0111985

    申请日:2001-04-11

    Inventor: KIM KI-SOO

    Abstract: A process for improving the adhesion between hydrophilic surfaces and the surface of thermosetting compositions that cure by a free radical process is disclosed. The process comprises pretreating the hydrophilic surface with an aqueous solution containing a zinc diacrylate, zinc dimethacrylate or combination thereof and a carrier, preferably a low molecular weight poly(vinyl alcohol)(PVA), drying the coating, applying the thermosetting composition, and curing the thermosetting composition. Quite unexpectedly, use of the aqueous adhesion promoting solution increased the peel strength (pli) by about 0.5 pli to about 5 pli, an improvement of up to 110 %. Additionally no undercut was seen after exposure to a sulfuric acid solution in laminate materials prepared with the aqueous adhesion promoting solution.

    Abstract translation: 公开了一种改善亲水表面与通过自由基方法固化的热固性组合物表面之间的粘合性的方法。 该方法包括用含有二丙烯酸锌,二甲基丙烯酸锌或其组合的水溶液和优选低分子量聚(乙烯醇)(PVA)的载体,干燥涂层,施加热固性组合物和固化 热固性组合物。 非常出人意料地,使用水性粘附促进溶液将剥离强度(pli)提高约0.5pli至约5pli,改善至110%。 此外,在用含水粘附促进溶液制备的层压材料中暴露于硫酸溶液之后,还没有看到底切。

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