Abstract:
A stress-balancing layer (130) is formed over portions (122) of a spring metal finger (120) that remain attached to an underlying substrate (101) to counter internal stresses inherently formed in the spring metal finger (120). The (e.g., positive) internal stress of the spring metal causes the claw (tip) (125) of the spring metal finger (120) to bend away from the substrate (101) when an underlying release material is removed. The stress-balancing pad (130) is formed on an anchor portion (122) of the spring metal finger (120), and includes an opposite (e.g., negative) internal stress that counters the positive stress of the spring metal finger (120). A stress-balancing layer (230) is either initially formed over the entire spring metal finger (120) and then partially removed (etched) from the claw portion (125), or selectively deposited only on the anchor portion (122) of the spring metal finger (120). An interposing etch stop layer (325-1) is used when the same material composition is used to form both the spring metal (220) and stress-balancing (230) layers.
Abstract:
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils (18) are described. In one method the springs (18) used to form out-of-plane structures are constrained via a tether (14) to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.
Abstract:
Optical cross-connect systems (100) involve the general concept of a two dimensional array of micro electromechanical systems (MEMS) tilt mirrors (104) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror in the two dimensional array can tilt about two non-colinear axes (x,y) and is suspended by a plurality of suspension arms (450) attached to a glass substrate
Abstract:
An illuminator apparatus (10) for a scanner device (12) includes a support structure (28) that extends along the longitudinal axis and an array of light emitted elements (30) that are disposed on and supported by the support structure (28). The array of light emitting elements are arranged on the support structure in at least three longitudinal rows. The at least three rows of light emitting elements are associated with a respective one of blue, green and red colored light emitted elements. A color image sensor apparatus for a scanner device capable of scanning a multi-colored document and a method for illuminating a colored document being scanned in a scanning device are also described.
Abstract:
A structure includes a semiconducting substrate (12;22;32) on which is formed an epitaxial buffer layer (14;24;34) of MgO and an epitaxial layer (16;26;38) of ferroelectric material or superconducting material or both. The semiconducting substrate (12;22;32) is of the tetrahedral structure type, and may be an elemental or compound material. The MgO buffer layer (14;24;34) on the tetrahedral semiconducting substrate allows epitaxial formation of the subsequent layers, facilitating the formation of a number of novel monolithic devices.
Abstract:
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
Abstract:
A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a free portion. The spring contact is self-assembling in that as the free portion is released it moves out of the plane of the substrate. Also integrated on the substrate is a sensor having an active layer and contacts. The substrate and sensor may be formed of materials which are somewhat partially transparent to light at certain infrared wavelengths.