Abstract:
Fluidic conduits (330A), which can be used in microarraying systems (300), dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes (350) that include at least one capillary channel (351). Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels (351) can either be integrated into the spring beams (300) or formed on the spring beams. Capillary forces produced by the narrow channels (351) allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
Abstract:
Optical cross-connect systems (100) involve the general concept of a two dimensional array (104) of microelectromechanical systems (MEMS) tilt mirrors (106) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror (106) in the two dimensional array (104) can tilt about two non-colinear axes (x,y) and is suspended by a plurality of suspension arms (450) attached to a substrate.
Abstract:
An illuminator apparatus (10) for a scanner device (12) includes a support structure (28) that extends along the longitudinal axis and an array of light emitted elements (30) that are disposed on and supported by the support structure (28). The array of light emitting elements are arranged on the support structure in at least three longitudinal rows. The at least three rows of light emitting elements are associated with a respective one of blue, green and red colored light emitted elements. A color image sensor apparatus for a scanner device capable of scanning a multi-colored document and a method for illuminating a colored document being scanned in a scanning device are also described.
Abstract:
Optical cross-connect (100) involve the general concept of a two dimensional array (104) of microelectromechanical system (MEMS) tilt mirrors (106) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror (106) in the two dimensional array can rotate about its x and y axis and is suspended by a plurality of suspension arms (450) attached to a glass substrate.
Abstract:
Optical cross-connect systems (100) involve the general concept of a two dimensional array (104) of microelectromechanical systems (MEMS) tilt mirrors (106) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror (106) in the two dimensional array (104) can tilt about two non-colinear axes (x,y) and is suspended by a plurality of suspension arms (450) attached to a substrate.
Abstract:
A method and system for lithographic printing by controlling the surface energy of a printing plate (12) to affect its hydrophilic and hydrophobic properties. These properties enable the ink to be applied to the printing plate (12) in an imagewise manner and provides for rapid production of images on a recording medium. The lithographic printing plate (12) may be rewritten repeatedly between printing jobs or may even by rewritten between individual recording media.
Abstract:
An epitaxial (111) magnesium oxide (MgO) layer, suitable for use as a buffer layer (14), on a (111) surface of a tetrahedral semiconductor substrate (12), and method for its manufacture is described. The article may further include an epitaxial oxide overlayer (16) on the (111) MgO layer. The overlayer (16) may be a conducting, superconducting, and/or ferroelectric oxide layer. The method of producing the epitaxial (111) magnesium oxide (MgO) layer (14) on the (111) surface of a tetrahedral semiconductor substrate (12) proceeds at low temperature. The method may further include steps for forming the epitaxial oxide layer on the (111) MgO layer. The methods include the steps of preparing the (111) surface of a tetrahedral semiconductor substrate for deposition and the low temperature depositing of an MgO layer on the prepared surface. Further steps may include the depositing of the oxide layer over the MgO layer.