公开(公告)号：US07445956B2

公开(公告)日：2008-11-04

申请号：US11287427

申请日：2005-11-28

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: B81C1/0088 ,  B81C2201/038 ,  H01L2224/16225 ,  H01L2224/48227

Abstract: A process for producing flexible MEMS thin film without a manufactured substrate applied in a MEMS manufacture specially includes a method of forming a component interface in the middle between a manufactured substrate and a MEMS thin film formed on the manufactured substrate as a basis, which component interface is so easily destroyed by an external force that the MEMS thin film produced by the mentioned process is easily separated from the manufactured substrate, and the separated MEMS thin film due to out of limitation from the manufactured substrate may be further processed in later working process to obtain a MEMS thin film with special structural features has flexibility and particularly has electrical circuits, micro structure, or MEMS components integrated and manufactured into inside or on its both sides.

Abstract translation: 用于生产柔性MEMS薄膜的方法，其中没有制造衬底应用于MEMS制造中，特别地包括在所制造的衬底和形成在所制造的衬底上的MEMS薄膜之间的中间形成部件界面的方法， 通过外力容易地破坏由所述工艺制造的MEMS薄膜容易与制造的基板分离，并且由制造的基板不受限制地分离的MEMS薄膜可以在后续工作过程中被进一步处理 获得具有特殊结构特征的MEMS薄膜具有柔性，并且特别地具有集成并制造在其内部或两侧的电路，微结构或MEMS部件。

公开(公告)号：EP3234531A1

公开(公告)日：2017-10-25

申请号：EP15870748.9

申请日：2015-12-10

Applicant: Robert Bosch GmbH

Inventor： YEE, Seow, Yuen ,  YAMA, Gary

IPC: G01L9/12 ,  G01L1/14 ,  B81B7/02

CPC classification number: B81C99/008 ,  B81B7/0058 ,  B81B7/02 ,  B81B2201/0264 ,  B81C2201/038 ,  B81C2201/056 ,  G01L9/0005 ,  G01L19/144 ,  G01L19/147

Abstract: A MEMS device, e.g., a flexible MEMS pressure sensor, is formed by disposing a sacrificial layer, such as photoresist, on a substrate. A first flexible support layer is disposed on the substrate, and a first conductive layer is disposed over a portion of the first support layer. A liquid or gel separator, e.g., silicone oil, is disposed on an internal region of the first conductive layer. A second flexible support layer encapsulates the first conductive layer and the separator. A second conductive layer disposed over the second support layer at least partially overlaps the first conductive layer and forms a parallel plate capacitor. A third flexible support layer encapsulates the second conductive layer and second support layer. Soaking the sensor in hot water releases the sensor from the sacrificial layer.

Abstract translation: MEMS器件，例如柔性MEMS压力传感器，通过在衬底上设置诸如光致抗蚀剂的牺牲层来形成。 第一柔性支撑层设置在衬底上，并且第一导电层设置在第一支撑层的一部分之上。 液体或凝胶分离器（例如硅油）被布置在第一导电层的内部区域上。 第二柔性支撑层封装第一导电层和隔离物。 设置在第二支撑层上的第二导电层至少部分地与第一导电层重叠并形成平行板电容器。 第三柔性支撑层封装第二导电层和第二支撑层。 将传感器浸泡在热水中会从牺牲层释放传感器。

公开(公告)号：EP2379440B1

公开(公告)日：2013-04-17

申请号：EP09807540.1

申请日：2009-12-18

Applicant: Siltectra GmbH

Inventor： LICHTENSTEIGER, Lukas

IPC: B81C1/00 ,  H01L21/78 ,  H01L21/304 ,  B28D1/22

CPC classification number: B28D1/221 ,  B81C1/00634 ,  B81C2201/038 ,  H01L21/304 ,  H01L21/76251 ,  Y10T225/10

公开(公告)号：US20240140786A1

公开(公告)日：2024-05-02

申请号：US18496823

申请日：2023-10-27

Applicant: UNM Rainforest Innovations

Inventor： Tito Busani ,  Ravi Kiran Chityala

IPC: B81C99/00

CPC classification number: B81C99/008 ,  B81C2201/038

Abstract: A low-cost, conventional release using low concentrations of HF to overcome the stiction of MEMS structure.

公开(公告)号：US09527729B2

公开(公告)日：2016-12-27

申请号：US14182659

申请日：2014-02-18

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Eric Ollier

IPC: B81C1/00

CPC classification number: B81C1/00515 ,  B81C1/00206 ,  B81C1/00412 ,  B81C1/00626 ,  B81C2201/0114 ,  B81C2201/0115 ,  B81C2201/038

Abstract: Process for fabrication of a micromechanical and/or nanomechanical structure comprising the following steps, starting from an element comprising a support substrate and a sacrificial layer: a) formation of a first layer, at least part of which is porous, b) formation on the first layer of a layer made of one (or several) materials providing the mechanical properties of the structure, called the intermediate layer, c) formation on the intermediate layer of a second layer, at least part of which is porous, d) formation of said structure in the stack composed of the first layer, the intermediate layer and the second layer, e) release of said structure by at least partial removal of the sacrificial layer.

Abstract translation: 该方法包括形成第一层即硅层（6），其部分是多孔的，并且在第一层上形成层间（16）以确保结构的机械性能。 第二层形成在层间，其中第二层的一部分是多孔的。 该结构形成在第一层，层间和第二层的堆叠中，其中第一和第二层由多孔硅锗制成，并且层间由非多孔硅锗制成。 通过牺牲层（4）的部分抽出来释放结构。

公开(公告)号：US20150274516A1

公开(公告)日：2015-10-01

申请号：US14182659

申请日：2014-02-18

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Eric OLLIER

IPC: B81C1/00

CPC classification number: B81C1/00515 ,  B81C1/00206 ,  B81C1/00412 ,  B81C1/00626 ,  B81C2201/0114 ,  B81C2201/0115 ,  B81C2201/038

Abstract: Process for fabrication of a micromechanical and/or nanomechanical structure comprising the following steps, starting from an element comprising a support substrate and a sacrificial layer: a) formation of a first layer, at least part of which is porous, b) formation on the first layer of a layer made of one (or several) materials providing the mechanical properties of the structure, called the intermediate layer, c) formation on the intermediate layer of a second layer, at least part of which is porous, d) formation of said structure in the stack composed of the first layer, the intermediate layer and the second layer, e) release of said structure by at least partial removal of the sacrificial layer.

Abstract translation: 制造微机械和/或纳米机械结构的方法，包括以下步骤：从包括支撑基底和牺牲层的元件开始：a）形成第一层，其中至少一部分是多孔的，b）在 第一层由一种（或多种）材料制成，提供称为中间层的结构的机械性能，c）在第二层的中间层上形成，其中至少一部分是多孔的，d）形成 由第一层，中间层和第二层构成的堆叠中的所述结构，e）通过至少部分去除牺牲层来释放所述结构。

公开(公告)号：US20110259936A1

公开(公告)日：2011-10-27

申请号：US13141821

申请日：2009-12-18

Applicant: Lukas Lichtensteiger

Inventor： Lukas Lichtensteiger

IPC: B26F3/00

CPC classification number: B28D1/221 ,  B81C1/00634 ,  B81C2201/038 ,  H01L21/304 ,  H01L21/76251 ,  Y10T225/10

Abstract: A method of printing comprises the steps of: providing a solid state material having an exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer having a stress pattern; subjecting the composite structure to conditions facilitating fracture of the solid state material along a plane at a depth therein; and removing the auxiliary layer and, therewith, a layer of the solid state material terminating at the fracture depth, wherein an exposed surface of the removed layer of solid state material has a surface topology corresponding to the stress pattern.

Abstract translation: 印刷方法包括以下步骤：提供具有暴露表面的固态材料; 将辅助层施加到暴露的表面以形成复合结构，所述辅助层具有应力图案; 使复合结构受到促进固态材料沿着其深度处的平面断裂的条件; 并且除去辅助层，并且随后移除终止于断裂深度处的固态材料层，其中所述去除的固态材料层的暴露表面具有对应于应力图案的表面拓扑。

公开(公告)号：US5949119A

公开(公告)日：1999-09-07

申请号：US219419

申请日：1998-12-23

Applicant: Michel Vilain

Inventor： Michel Vilain

IPC: G01J5/20 ,  B81B3/00 ,  F15C5/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L49/00 ,  H01L29/82

CPC classification number: B81C1/00658 ,  B81B3/007 ,  F15C5/00 ,  G01J5/20 ,  B81B2203/0118 ,  B81C2201/0109 ,  B81C2201/038

Abstract: A device having at least one element of a floating rigid microstructure element made of a structure layer(s) and a rigidity lining which increases its resistance to flexing and to torsion. The increased rigidity of the microstructure element allows the thickness and/or the width to be reduced, particularly of the structure layer(s) and hence allows an increase in the thermal resistance.

Abstract translation: 具有由结构层制成的浮动刚性微结构元件的至少一个元件和刚性衬里的装置，其增加其抵抗挠曲和扭转。 微结构元件的增加的刚度允许减小厚度和/或宽度，特别是结构层的厚度和/或宽度，从而允许增加耐热性。

公开(公告)号：JP5523469B2

公开(公告)日：2014-06-18

申请号：JP2011536532

申请日：2009-11-13

Applicant: シーゲイト テクノロジー エルエルシー

Inventor： リー，キム・ヤン ,  クオ，デイビッド・エス ,  ビューヒェル，ドロシア ,  ペリョス，カルマン

IPC: G11B5/84 ,  G11B5/65

CPC classification number: G11B5/855 ,  B81C1/00111 ,  B81C2201/0154 ,  B81C2201/038 ,  Y10T428/2457 ,  Y10T428/26

公开(公告)号：JP2006150588A

公开(公告)日：2006-06-15

申请号：JP2005343386

申请日：2005-11-29

Applicant: Wen-Chang Dong ,  ▲びん▼昌 董

Inventor： DONG WEN-CHANG

IPC: B81C1/00

CPC classification number: B81C1/0088 ,  B81C2201/038 ,  H01L2224/16225 ,  H01L2224/48227

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an interface capable of easily separating a device from a base substrate in a semi-conductor or micro-machine manufacturing step.
SOLUTION: An interface 30 which is separable by breakage with the external force is constituted of a material of weak bonding property or a material to be easily removed by the etching during the manufacturing step between a process substrate 10 and a device 20. In a second step of the device manufacture, the separable interface 30 is broken to separate the device 20 from the process substrate 10. In particular, the device is flexible and provided with a circuit contact, a small structure or a micro-machine device on upper and lower sides via a micro-machine thin film formed of the separable interface 30.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于形成能够在半导体或微机械制造步骤中容易地将基板与基板分离的界面的方法。 解决方案：通过外力断裂可分离的界面30由处理基板10和装置20之间的制造步骤期间通过蚀刻容易地去除的材料具有弱粘合性质或材料构成。 在设备制造的第二步骤中，可分离接口30被破坏以将设备20与处理衬底10分离。特别地，该设备是柔性的，并且设置有电路接触件，小结构或微机器设备 通过由可分离界面30形成的微机薄膜，上下两侧。（C）2006，JPO＆NCIPI