Abstract:
L'invention concerne un procédé de commande d'un spectromètre d'analyse d'un produit,le procédé comprenant des étapes consistant à: acquérir une mesure (LFL, TPL) représentative du fonctionnement d'une source de lumière (LS),déterminer en fonction de la mesure, une valeur de courant d'alimentation (LCx) de la source de lumière, et/ou une valeur de durée d'intégration (ITy) de cellules photosensibles (y) d'un capteur (OPS), disposées sur un trajet d'un faisceau lumineux (LB) émis par la source de lumière et ayant interagi avec un produit à analyser, et si la valeur de durée d'intégration et/ou de courant d'alimentation est comprise entre des valeurs de seuil, fournir à la source de lumière un courant d'alimentation correspondant à la valeur déterminée de courant d'alimentation, ajuster la durée d'intégration d'une cellule photosensible à la valeur déterminée de durée d'intégration, et acquérir des mesures d'intensité lumineuse (MSy) fournies par le capteur, permettant de former un spectre.
Abstract:
L'invention concerne un procédé de commande d'un spectromètre d'analyse d'un produit, le spectromètre comprenant une source de lumière (LS) comportant plusieurs diodes électroluminescentes (LD1-LD4) ayant des spectres d'émission respectifs couvrant en combinaison une bande de longueurs d'onde d'analyse, le procédé comprenant des étapes consistant à: fournir un courant d'alimentation (I1-I4) à au moins une des diodes électroluminescentes pour l'allumer, mesurer une intensité lumineuse (LFL1- LFL4) émise par la source de lumière en mesurant un courant à une borne d'au moins une autre des diodes électroluminescentes maintenue éteinte, déterminer en fonction de chaque mesure d'intensité lumineuse, une valeur de consigne (LC1-LC4) du courant d'alimentation de chaque diode allumée, et réguler le courant d'alimentation de chaque diode allumée pour qu'il corresponde à la valeur de consigne.
Abstract:
A method for detecting defects includes directing a scanning beam to a location on a surface of a transparent sample, measuring top and bottom surface specular reflection intensity, and storing coordinate values of the first location and the top and bottom surface specular reflection intensity in a memory. The method may further include comparing the top surface specular reflection intensity measured at each location with a first threshold value, comparing the bottom surface specular reflection intensity measured at each location with a second threshold value, and determining if a defect is present at each location and on which surface the defect is present. The method may further include comparing the top surface specular reflection intensity measured at each location with a first intensity range, comparing the bottom surface specular reflection intensity measured at each location with a second intensity range, and determining on which surface the defect is present.
Abstract:
A via hole is accurately formed in an interlayer insulating film over a metal wiring. Of emission spectra of plasma to be used for dry etching of the interlayer insulating film, the emission intensities of at least CO, CN, and AlF are monitored such that an end point of the dry etching of the interlayer insulating film is detected based on the emission intensities thereof.
Abstract:
A method for controlling a spectrometer for analyzing a product includes steps of: acquiring a measurement representative of the operation of a light source, determining, depending on the measurement, a value of supply current of the light source, and/or a value of integration time of light-sensitive cells of a sensor, disposed on a route of a light beam emitted by the light source and having interacted with a product to be analyzed, and if the integration time and/or supply current value is between threshold values, supplying the light source with a supply current corresponding to the determined supply current value, adjusting the integration time of a light-sensitive cell to the determined integration time value, and acquiring light intensity measurements supplied by the sensor, enabling a spectrum to be formed.
Abstract:
A monitoring system is disclosed, designed to detect the depth of deposition of a substance on a′ surface (12), such as the depth of dust in a ventilation shaft. The monitoring system includes a light source (14) and a sensor (16, 30). The light source is arranged to transmit light across a detection surface and the sensor is on the other side of the detection surface. When a substance, such as dirt or grease, is deposited on the surface it obstructs the light and the amount of light reaching the sensor decreases. A processing means (26) detects the decrease in light and from this the depth of the deposition on the surface can be calculated. Preferably the sensor comprises a CCD array (32), and the substance throws a shadow on the array. The processing means can then determine the depth of the substance from the position on the array of the edge of the shadow. Preferably the monitoring system is placed in a low power ‘sleep’ mode in between intermittent operations for detecting the depth of the substance. In this, way, it can be battery operated and the battery life is preserved.
Abstract:
A monitoring system is disclosed, designed to detect the depth of deposition of a substance on a′ surface (12), such as the depth of dust in a ventilation shaft. The monitoring system includes a light source (14) and a sensor (16, 30). The light source is arranged to transmit light across a detection surface and the sensor is on the other side of the detection surface. When a substance, such as dirt or grease, is deposited on the surface it obstructs the light and the amount of light reaching the sensor decreases. A processing means (26) detects the decrease in light and from this the depth of the deposition on the surface can be calculated. Preferably the sensor comprises a CCD array (32), and the substance throws a shadow on the array. The processing means can then determine the depth of the substance from the position on the array of the edge of the shadow. Preferably the monitoring system is placed in a low power ‘sleep’ mode in between intermittent operations for detecting the depth of the substance. In this, way, it can be battery operated and the battery life is preserved.