향상된 반사성 전자빔 리소그래피를 위한 디바이스 및 방법
    12.
    发明公开
    향상된 반사성 전자빔 리소그래피를 위한 디바이스 및 방법 有权
    改进反射电子束光刻的装置和方法

    公开(公告)号:KR1020130135002A

    公开(公告)日:2013-12-10

    申请号:KR1020120101618

    申请日:2012-09-13

    Abstract: Described are a device and a method for reflective electron beam lithography. The device includes a substrate, conductive layers which are formed on the substrate, separated by an insulating filler structure, and arranged in parallel, and apertures in each conductive layer. An aperture in one conductive layer is vertically arranged with regard to an aperture in another conductive layer. The peripheral region of each aperture includes a suspended conductive layer. [Reference numerals] (102) Provide a substrate;(104) Deposit a first insulating material on the substrate;(106) Deposit and pattern a photosensitive material on the upper part of the first insulating material;(108) Etch the first insulating material;(110) Deposit a second insulating material;(112) Perform a CMP process;(114) Deposit a conductive material on the second insulating material;(116) Deposit and pattern the photosensitive material on the upper part of the conductive material;(118) Etch the conductive material;(120) Repeat Step 104-Step 118;(122) Etch the second insulating material

    Abstract translation: 描述了用于反射电子束光刻的装置和方法。 该器件包括衬底,形成在衬底上的由绝缘填料结构隔开并平行布置的导电层和每个导电层中的孔。 一个导电层中的孔相对于另一导电层中的孔垂直地布置。 每个孔的周边区域包括悬置的导电层。 (102)提供基板;(104)在基板上沉积第一绝缘材料;(106)在第一绝缘材料的上部上沉积和图案感光材料;(108)蚀刻第一绝缘材料 (110)沉积第二绝缘材料;(112)进行CMP工艺;(114)将导电材料沉积在第二绝缘材料上;(116)将感光材料沉积并图案化在导电材料的上部;( 118)蚀刻导电材料;(120)重复步骤104-步骤118;(122)蚀刻第二绝缘材料

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