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    Photovoltaic window
    195.
    发明授权
    Photovoltaic window 有权
    光伏窗

    公开(公告)号：US09548410B2

    公开(公告)日：2017-01-17

    申请号：US13717186

    申请日：2012-12-17

    Applicant: Intel Corporation

    Inventor： Aleksandar Aleksov ,  Brian S. Doyle ,  Ravindranath V. Mahajan

    IPC: H01L31/048 ,  H01L27/30 ,  H02S20/26

    CPC classification number: H01L31/0488 ,  H01L27/301 ,  H02S20/26 ,  Y02B10/10 ,  Y02E10/50

    Abstract: An apparatus for collecting solar energy, including a first panel, wherein the first panel allows at least 50% of incident light having a wavelength in the range of 1 nm to 1,500 nm to pass through said panel and a second panel, wherein the second panel allows at least 50% of incident light having a wavelength in the range of 410 nm to 650 nm to pass through said panel. A photovoltaic cell is disposed between the first panel and second panel, which includes a first electrode disposed adjacent to the first panel, a second electrode disposed adjacent to the second panel, a photovoltaic component contacting the first and second electrodes. The photovoltaic component absorbs at least 50% of light having a wavelength in one of the following ranges: greater than 650 nm, less than 410 nm and combinations thereof.

    Abstract translation: 一种用于收集太阳能的装置，包括第一面板，其中所述第一面板允许波长在1nm至1,500nm范围内的至少50％的入射光通过所述面板和第二面板，其中所述第二面板 允许波长在410nm至650nm范围内的至少50％的入射光通过所述面板。 光伏电池设置在第一面板和第二面板之间，其包括邻近第一面板设置的第一电极，邻近第二面板设置的第二电极，与第一和第二电极接触的光伏组件。 光伏组件吸收至少50％的具有以下范围之一的波长的光：大于650nm，小于410nm及其组合。

    Wireless charging system
    196.
    发明授权
    Wireless charging system 有权
    无线充电系统

    公开(公告)号：US09118188B2

    公开(公告)日：2015-08-25

    申请号：US13716376

    申请日：2012-12-17

    Applicant: Intel Corporation

    Inventor： Brian S. Doyle ,  Aleksandar Aleksov ,  Ravindranath V. Mahajan

    IPC: H02J7/00 ,  H02J7/02

    CPC classification number: H02J7/0004 ,  H02J7/0013 ,  H02J7/0042 ,  H02J7/0044 ,  H02J7/025 ,  H02J50/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40 ,  H02J50/70 ,  H02J50/80 ,  Y02B40/90 ,  Y02E60/12

    Abstract: A wireless charging system includes a microelectronic package (110) containing a system on chip (120) (an SoC), an energy transfer unit (140), and a software protocol (127). The SoC includes a processing device (121), a memory device (122) coupled to the processing device, and a communications device (123) coupled to the processing device and the memory device. The communications device is capable of communicating wirelessly with an external electronic device (130). The energy transfer unit is capable of transferring energy to the external electronic device. The software protocol is implemented in the memory device and is capable of detecting a charging profile of the external electronic device and capable of adjusting a parameter of the energy transfer unit according to a requirement of the charging profile.

    Abstract translation: 一种无线充电系统包括一个包含片上系统（SoC），能量传输单元（140）和软件协议（127）的微电子封装（110）。 SoC包括处理设备（121），耦合到处理设备的存储设备（122）以及耦合到处理设备和存储设备的通信设备（123）。 通信设备能够与外部电子设备（130）进行无线通信。 能量传递单元能够将能量传递到外部电子设备。 软件协议在存储装置中实现，能够检测外部电子装置的充电曲线，并且能够根据充电曲线的要求调整能量转移单元的参数。

    METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT PACKAGES
    199.
    发明申请
    METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT PACKAGES 有权

    公开(公告)号：US20250112145A1

    公开(公告)日：2025-04-03

    申请号：US18478529

    申请日：2023-09-29

    Applicant: Intel Corporation

    Inventor： Aleksandar Aleksov ,  Tushar Kanti Talukdar

    IPC: H01L23/522 ,  H01L21/768 ,  H01L23/532

    Abstract: Methods and apparatus are disclosed to improve interconnect structures in integrated circuit packages. An example integrated circuit (IC) package includes a first interconnect structure positioned on a first surface of an underlying substrate; a second interconnect structure positioned on the first surface of the underlying substrate, the second interconnect structure adjacent to the first interconnect structure; and a first dielectric material between the first and second interconnect structures, the first dielectric material including an enclosed trench within a space between the first and second interconnect structures.

    INTEGRATED CIRCUIT PACKAGE SUPPORTS
    200.
    发明申请
    INTEGRATED CIRCUIT PACKAGE SUPPORTS 有权

    公开(公告)号：US20250069902A1

    公开(公告)日：2025-02-27

    申请号：US18945842

    申请日：2024-11-13

    Applicant: Intel Corporation

    Inventor： Kristof Kuwawi Darmawikarta ,  Robert May ,  Sri Ranga Sai Boyapati ,  Srinivas V. Pietambaram ,  Chung Kwang Christopher Tan ,  Aleksandar Aleksov

    IPC: H01L21/48 ,  H01L23/498

    Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.

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