公开(公告)号：WO2009126907A2

公开(公告)日：2009-10-15

申请号：PCT/US2009/040241

申请日：2009-04-10

Applicant: APPLIED MATERIALS, INC. ,  KRISHNASWAMI, Sriram ,  KURITA, Shinichi ,  SHAMOUN, Bassam ,  JOHNSTON, Benjamin, M. ,  WHITE, John, M. ,  FAN, Jiafa ,  HUANG, Inchen ,  MANENS, Antoine, P. ,  LEI, Wei-Sheng ,  HSU, Wei-Yung

Inventor： KRISHNASWAMI, Sriram ,  KURITA, Shinichi ,  SHAMOUN, Bassam ,  JOHNSTON, Benjamin, M. ,  WHITE, John, M. ,  FAN, Jiafa ,  HUANG, Inchen ,  MANENS, Antoine, P. ,  LEI, Wei-Sheng ,  HSU, Wei-Yung

IPC: B23K26/36 ,  B23K26/04 ,  B23K26/08 ,  B23K26/00 ,  H01L31/04 ,  G02B26/10

CPC classification number: B23K26/067 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/083 ,  B23K26/16 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K2201/34 ,  B23K2201/36 ,  B23K2203/16 ,  B23K2203/172

Abstract: Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process. A series of lasers (602, 622) can be used to concurrently remove material from multiple positions on the workpiece (104). Each laser (602, 622) can have at least one scanning device (614, 630, 632) positioned along a beam path thereof in order to adjust a position of the laser output relative to the workpiece (104). By adjusting the beam or pulse positions using the scanning devices (614, 630, 632) while translating the workpiece (104), substantially any pattern can be scribed into at least one layer of the workpiece (104) without the need for any rotation of the workpiece (104).

Abstract translation: 可以对工件（104）进行激光划线，例如在其上形成有层的基板，用于太阳能电池板，而不需要在划线过程中旋转工件（104）。 可以使用一系列激光器（602,622）来同时从工件（104）上的多个位置移除材料。 每个激光器（602,622）可以具有沿其光束路径定位的至少一个扫描装置（614,630,632），以便调节激光输出相对于工件（104）的位置。 通过在平移工件（104）的同时通过使用扫描装置（614,630,632）调节光束或脉冲位置，基本上任何图案都可以划分成工件（104）的至少一层，而不需要任何旋转 工件（104）。

公开(公告)号：WO2009012815A1

公开(公告)日：2009-01-29

申请号：PCT/EP2007/057628

申请日：2007-07-24

Applicant: FLISOM AG ,  BUDDE, Felix ,  STUDER, Thomas ,  KAELIN, Marc ,  RUDMANN, Dominik

Inventor： BUDDE, Felix ,  STUDER, Thomas ,  KAELIN, Marc ,  RUDMANN, Dominik

IPC: B23K26/04 ,  B23K26/08 ,  B23K26/40 ,  H05K3/00 ,  H05K13/00 ,  H01L27/142 ,  H01L31/042

CPC classification number: B23K26/046 ,  B23K26/042 ,  B23K26/082 ,  B23K26/0846 ,  B23K26/0853 ,  B23K26/40 ,  B23K2201/18 ,  B23K2201/36 ,  B23K2203/16 ,  B23K2203/172 ,  H01L31/0322 ,  H01L31/0475 ,  H01L31/1864 ,  H01L31/1872 ,  H01L31/1884 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0026 ,  H05K2201/0108 ,  H05K2201/09918 ,  Y02E10/50 ,  Y02P70/521

Abstract: The present application relates to a method and an apparatus for laser beam processing of an element (12) that has a total transmittance for light of at least 10-5, comprising a laser unit (1) for generating a laser beam on one side of the to-be-processed element (12), an illumination unit (7), an imaging system (10) comprising a sensor unit on the one side of the to-be-processed element (12), the sensor unit recording residual light that results from light of the illumination unit (7), a scanning unit (2) for adjusting the laser beam processing position, and a control unit. The control unit is operatively connected to the laser unit (1), the imaging system (10) and the scanning unit (2), and the illumination unit (7) is positioned on the other side of the to-be-processed element (12) in relation to the laser unit (1). Since the to-be- processed element (12) allows light to pass through an otherwise opaque or almost opaque layer, a good contrast is obtained that is used to determine the position of. the laser beam with high precision.

Abstract translation: 本发明涉及一种用于激光束处理的方法和装置，所述元件（12）具有至少10-5的光的总透射率，包括用于在一个或多个激光束的一侧产生激光束的激光单元（1） 待处理元件（12），照明单元（7），在被处理元件（12）的一侧上包括传感器单元的成像系统（10），所述传感器单元记录残余光 由照明单元（7）的光，用于调整激光束处理位置的扫描单元（2）和控制单元产生。 控制单元可操作地连接到激光单元（1），成像系统（10）和扫描单元（2），并且照明单元（7）位于被处理元件的另一侧（ 12）相对于激光单元（1）。 由于要处理的元件（12）允许光穿过其它不透明或几乎不透明的层，所以获得用于确定位置的良好的对比度。 激光束精度高。

公开(公告)号：WO2008150958A1

公开(公告)日：2008-12-11

申请号：PCT/US2008/065224

申请日：2008-05-30

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  LEI, Weisheng ,  MATSUMOTO, Hisashi ,  HARDY, Gregg ,  SUN, Yunlong

Inventor： LEI, Weisheng ,  MATSUMOTO, Hisashi ,  HARDY, Gregg ,  SUN, Yunlong

IPC: B23K26/38 ,  H05K3/00 ,  H01L21/268

CPC classification number: B23K26/384 ,  B23K26/389 ,  B23K2201/36 ,  H05K3/0035 ,  H05K2201/09827

Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q switched CO 2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Abstract translation: 用于在多层电子电路中钻出具有可选锥度的盲孔的方法和装置允许在层之间形成电连接，同时保持质量和生产量。 该方法依赖于识别定义锥度的通孔的顶部直径和通孔的底部直径是两个单独的方程组的函数。 这些方程的同时解决方案产生一个解空间，可以优化吞吐量，同时使用具有相同脉冲参数的临时未修改的Q切换CO2激光脉冲保持选定的锥度和质量。 不需要实时脉冲裁剪; 因此，系统复杂性和成本可能会降低。

公开(公告)号：WO2008075315A2

公开(公告)日：2008-06-26

申请号：PCT/IB2007/055259

申请日：2007-12-20

Applicant: NXP B.V. ,  WYLAND, Christopher

Inventor： WYLAND, Christopher

IPC: H01L23/485

CPC classification number: H01L23/16 ,  B23K1/0016 ,  B23K2201/36 ,  H01L23/10 ,  H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1401 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81232 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of flip-chip mounting a circuit to a substrate is provided by brazing together metallic elements formed on both the circuit and substrate. The brazing being achieved by initiating a chemical exothermic reaction in a multilayer stacked material disposed between the metallic elements on the circuit and substrate. Advantageously the chemical exothermic reaction provides a means of locally brazing the metallic elements without necessitating raising the circuit and substrate to a high temperature such as required in conventional flip-chip assembly with solder reflow. According to an exemplary embodiment of the invention the metallic elements are electrical conductors and an electrical trigger signal is provided via the metallic elements to initiate the chemical exothermic reaction.

Abstract translation: 通过将形成在电路和基板上的金属元件钎焊在一起来提供将电路倒装芯片安装到基板的方法。 通过在设置在电路和基板上的金属元件之间的多层堆叠材料中引发化学放热反应来实现钎焊。 有利地，化学放热反应提供了局部钎焊金属元件的方法，而不需要将电路和衬底升高到高温，例如在常规的倒装芯片组装中所需要的焊料回流。 根据本发明的示例性实施例，金属元件是电导体，并且经由金属元件提供电触发信号以引发化学放热反应。

公开(公告)号：WO2008043273A1

公开(公告)日：2008-04-17

申请号：PCT/CN2007/002892

申请日：2007-10-08

Applicant: 浙江长城换向器有限公司 ,  杨积锡 ,  林祥清 ,  罗洪 ,  张俊

Inventor： 杨积锡 ,  林祥清 ,  罗洪 ,  张俊

IPC: H01R39/06 ,  H01R43/06 ,  B23K1/00 ,  B23K35/30

CPC classification number: B23K1/0008 ,  B23K2201/36 ,  H01R39/045 ,  H01R39/16 ,  H01R43/06

Abstract: A flat carbon commutator and preparation method thereof are provided, the commutator includes a commutating sheet (1), a molding plastic substrate (2) and a carbon block (3), wherein the commutating sheet (1) is molded by punching a metal ring plate, a groove (11) is formed at the inner edge of the commutating sheet (1) to position the carbon block (3) and a wrapping angle is formed at the outer edge of the same; the carbon block (3) opposed to the commutating sheet (1) is formed into the shape of ladder so as to cooperate with the molding plastic substrate (2) and the commutating sheet (1); a brazing material (4) is provided at the interface between the commutating sheet (1) and the carbon block (3); then the commutator assembly with the carbon block (3) is transmitted into a special brazing device and brazed at the temperature over 900? for 30 minutes, so a commutator blank is obtained; finally the commutating sheet (1) and the carbon block (3) are cocooned in the molding plastic substrate (2).

公开(公告)号：WO2007140448A3

公开(公告)日：2008-04-03

申请号：PCT/US2007070048

申请日：2007-05-31

Applicant: TEKA INTERCONNCTION SYSTEMS ,  ZANOLLI JAMES ,  CACHINA JOSEPH

Inventor： ZANOLLI JAMES ,  CACHINA JOSEPH

IPC: B23K31/02 ,  B23K37/00

CPC classification number: B23K3/0638 ,  B23K2201/36 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/043 ,  Y02P70/613

Abstract: A method of depositing a solder mass (300) within a plated opening (120) that is formed in a side edge of an electronic device (100) includes the step of carrying the solder mass (300) in a carrier device (200) and orienting the carrier device (200) with respect to the side edge such that the solder mass is aligned with the plated opening (120) The method further includes reflowing the solder mass (300) to cause the solder mass (300) to be deposited and securely held within the plated opening (120) and then removing the carrier device (200) leaving the solder mass (300) behind within the plated opening (120) and along the side edge of the electronic device (100)

Abstract translation: 在电子设备（100）的侧边缘中形成的电镀开口（120）内沉积焊料块（300）的方法包括将载体（300）载持在载体装置（200）中的步骤，以及 所述载体装置（200）相对于所述侧边缘定向，使得所述焊料质量与所述电镀开口（120）对准。所述方法还包括回流所述焊料块（300）以引起所述焊料块（300）沉积，以及 牢固地保持在镀覆开口（120）内，然后移除离开焊料块（300）在载体开口（120）之后并沿着电子装置（100）的侧边缘的载体装置（200）

公开(公告)号：WO2006110785A3

公开(公告)日：2007-07-12

申请号：PCT/US2006013570

申请日：2006-04-11

Applicant: ST JUDE MEDICAL ATRIAL FIBRILL ,  SLIWA JACK ,  PODMORE JONATHAN L ,  BAGLEY CHRIS ,  CROWE JOHN E ,  HOLZBAUR MICHAEL ,  HILLSTROM DEREK ,  SCHELLENBERG STEVE ,  GOETZ PETER ,  MORSE STEPHEN A

Inventor： SLIWA JACK ,  PODMORE JONATHAN L ,  BAGLEY CHRIS ,  CROWE JOHN E ,  HOLZBAUR MICHAEL ,  HILLSTROM DEREK ,  SCHELLENBERG STEVE ,  GOETZ PETER ,  MORSE STEPHEN A

IPC: H04R31/00

CPC classification number: H03H3/04 ,  B06B1/06 ,  B23K26/351 ,  B23K2201/36 ,  G01N29/245 ,  H03H3/02 ,  H03H3/08 ,  H03H2003/0407 ,  H03H2003/045 ,  H04R31/00 ,  Y10T29/42 ,  Y10T29/49004 ,  Y10T29/49005

Abstract: A method of manufacturing an ultrasound transducer (2) is provided. The ultrasound transducer (2) is activated and the activity across the transducer is measured to determine whether the activity at any area does not meet an acceptance criteria. The transducer is then modified so that the area meets the acceptance criteria. The transducer may be modified with a laser (43) which removes material from the area which does not meet the accceptance criteria.

Abstract translation: 提供一种制造超声波换能器（2）的方法。 激活超声换能器（2），测量换能器的活动，以确定任何区域的活动是否不符合验收标准。 然后对传感器进行修改，使得该区域满足接受标准。 传感器可以用激光器（43）进行修改，该激光器从不符合接受标准的区域去除材料。

公开(公告)号：WO2007010510A3

公开(公告)日：2007-06-07

申请号：PCT/IB2006052981

申请日：2006-08-28

Applicant: MAYER MICHAEL

Inventor： MAYER MICHAEL

IPC: B23K20/00 ,  B23K101/36

CPC classification number: B23K20/004 ,  B08B7/0035 ,  B23K20/007 ,  B23K2201/36 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/8501 ,  H01L2224/85013 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: A novel wire bonding system for bonding a wire to electronic components is described, which comprises a frame (1), a bond head (7) being connected to the frame and being movable by means of positioning elements (3, 4), and a bond site cleaning device (10, 11) mounted to the frame and adapted to emit an energy beam (12) towards a surface of the electronic component for cleaning from contaminants. The bond site cleaning device (10, 11) is mounted such that the energy beam (12) is directed in an angle towards the site of the electronic component to be immediately bonded to the wire, whereby the beam spot on the site is lying underneath the bonding head (7).

Abstract translation: 描述了一种用于将导线接合到电子部件的新颖的引线接合系统，其包括框架（1），结合头（7），其连接到框架并且可通过定位元件（3,4）移动，并且 粘合部位清洁装置（10,11），其安装到框架上并且适于向电子部件的表面发射能量束（12），以从污染物清洁。 焊接部位清洁装置（10,11）被安装成使得能量束（12）以一定角度指向电子部件的位置以立即结合到电线，由此现场的光束点位于下面 接合头（7）。

公开(公告)号：WO2007046164A1

公开(公告)日：2007-04-26

申请号：PCT/JP2006/310441

申请日：2006-05-25

Applicant: 津島 栄樹

Inventor： 津島 栄樹

IPC: B23K20/00 ,  H01L23/373

CPC classification number: H01L23/3735 ,  B23K20/02 ,  B23K20/04 ,  B23K2201/18 ,  B23K2201/36 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/18 ,  B32B15/01 ,  B32B15/018 ,  H01L2924/0002 ,  Y10T428/12632 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12903 ,  H01L2924/00

Abstract: Recently, there is a tendency to increase semiconductor device power. A material used for a heat sink substrate for semiconductor apparatus should have a small thermal expansion coefficient and a high thermal conductivity. A cladding material comprises a first material layer (10) and a second material layer (16), which are alternately stacked. The second material has a smaller thermal expansion coefficient than that of the first material and a lower thermal conductivity than that of the first material. At least five layers consisting of the first material layers and the second material layers are stacked.

Abstract translation: 近来，存在增加半导体器件功率的趋势。 用于半导体装置的散热基板的材料应具有小的热膨胀系数和高导热性。 包层材料包括交替层叠的第一材料层（10）和第二材料层（16）。 第二材料的热膨胀系数比第一材料的热膨胀系数小，并且比第一材料的热膨胀系数低。 层叠由第一材料层和第二材料层构成的至少五层。

公开(公告)号：WO2007008310A1

公开(公告)日：2007-01-18

申请号：PCT/US2006/021461

申请日：2006-06-02

Applicant: MOTOROLA, INC. ,  WALDVOGEL, John, M. ,  MILLER, Herman, J.

Inventor： WALDVOGEL, John, M. ,  MILLER, Herman, J.

IPC: B23K31/02 ,  B23K37/04

CPC classification number: B23K1/0016 ,  B23K2201/36 ,  H05K1/0206 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/0305 ,  H05K2201/09318 ,  H05K2201/09554 ,  H05K2201/10022 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K2203/0455 ,  Y02P70/611

Abstract: An electrical circuit apparatus (300) that includes; a substrate (330) having a top side, a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture (322) wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract translation: 一种电路装置（300），包括： 具有顶侧的衬底（330），接地层（336），至少一个热孔（332）和至少一个焊接孔（334）; 散热器（310）; 以及用于将散热器机械地耦合到衬底的接地层的粘合剂层（320），所述粘合剂层具有至少一个孔（322），其中使所述至少一个衬底焊接孔与所述至少一个粘合剂层孔径对准使得能够 在散热器和衬底的接地层之间的预定区域中的焊料润湿。