公开(公告)号：US4560100A

公开(公告)日：1985-12-24

申请号：US662648

申请日：1984-10-19

Applicant: Richard L. Hall

Inventor： Richard L. Hall

IPC: B23K1/005 ,  B23K1/08 ,  H05K3/34

CPC classification number: B23K1/0056 ,  B23K1/08 ,  H05K3/3447 ,  H05K3/3478 ,  B23K2201/42 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/107 ,  H05K3/3494

Abstract: An automated discreet soldering system for plated holes of a printed wiring board, having a free piston type crucible mode of graphitic material, which is propelled along a guided path by pressurized nitrogen. A laser beam is directed along a path substantially coincident with the path of travel of the crucible to heat a susceptor surface for melting the solder therein.

Abstract translation: 一种用于印刷线路板的电镀孔的自动离散焊接系统，其具有自由活塞型坩埚模式的石墨材料，其通过加压氮气沿导向路径推进。 激光束沿着与坩埚的行进路径基本一致的路径引导，以加热基座表面以熔化其中的焊料。

公开(公告)号：US4529116A

公开(公告)日：1985-07-16

申请号：US489677

申请日：1983-04-28

Applicant: Ernst A. Gutbier

Inventor： Ernst A. Gutbier

IPC: B23K3/06 ,  G01N13/00 ,  G01N13/02 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K3/0653 ,  G01N13/00 ,  B23K2201/42 ,  G01N2013/0225 ,  H05K2201/10204 ,  H05K2203/162

Abstract: First and second transparent metallized gauge plates (52 and 52') of solder-nonwettable, heat-resistant material, such as glass or quartz, each have a solder wave test pattern in the form of spaced parallel metal strips (56 and 56') formed thereon. The metal strips (56) on the first gauge plate (52) are of progressively increasing widths, with a narrowest strip located adjacent one edge of the plate and a widest strip located adjacent an opposite edge of the plate. The metal strips 56' on the second gauge plate (52') are of uniform widths. The first gauge plate (52) is engaged with a solder wave (34) to measure the activation level of a soldering flux (44) being introduced into the solder wave, and thereby to determine the capability of the solder wave to produce properly soldered printed circuit board assemblies (10). The second gauge plate is engaged with the solder wave (34) to measure and/or adjust other flow characteristics of the solder wave, such as a width of solder wave impingement (80 ) on the printed circuit board assemblies (10).

Abstract translation: 焊料不可润湿的耐热材料（例如玻璃或石英）的第一和第二透明金属化计量板（52和52'）各自具有间隔开的平行金属条（56和56'）形式的焊波测试图案， 形成在其上。 第一计量板（52）上的金属条（56）具有逐渐增加的宽度，最窄的带位于板的一个边缘附近，并且最宽的带位于板的相对边缘附近。 第二计量板（52'）上的金属条56'具有均匀的宽度。 第一测量板（52）与焊波（34）接合，以测量引入到焊波中的焊剂（44）的激活电平，从而确定焊波产生适当焊接的印刷 电路板组件（10）。 第二测量板与焊波（34）接合以测量和/或调整焊波的其它流动特性，例如印刷电路板组件（10）上的焊波冲击（80）的宽度。

公开(公告)号：US4448636A

公开(公告)日：1984-05-15

申请号：US384355

申请日：1982-06-02

Applicant: Samuel C. Baber

Inventor： Samuel C. Baber

IPC: B23K26/00 ,  H01L21/027 ,  H01L21/268 ,  H01L21/302 ,  H01L21/3065 ,  B44C1/22 ,  C03C15/00 ,  B23K9/00 ,  B05D5/12

CPC classification number: H01L21/268 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  H01L21/0272 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/14 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  Y10S156/937 ,  Y10S438/949 ,  Y10S438/951 ,  Y10T156/1158 ,  Y10T156/19

Abstract: A method for selective removal of metallization in integrated circuits. A uniform metal film is applied over a patterned resist layer. A short pulse of radiant energy is then applied to the whole surface of the metal film. The resist underneath the metal film is locally heated enough to cause outgassing, which breaks the mechanical bond between the metal film and the resist. The metal film over the patterned resist layer is then removed, leaving the deposited metal film in place over areas which were not covered by the resist film.

Abstract translation: 集成电路中选择性去除金属化的方法。 将均匀的金属膜施加在图案化的抗蚀剂层上。 然后将短脉冲的辐射能施加到金属膜的整个表面。 金属膜下面的抗蚀剂被局部加热足以引起脱气，这破坏了金属膜和抗蚀剂之间的机械结合。 然后去除图案化抗蚀剂层上的金属膜，使沉积的金属膜在未被抗蚀剂膜覆盖的区域上就位。

公开(公告)号：US4389797A

公开(公告)日：1983-06-28

申请号：US276493

申请日：1981-06-23

Applicant: Donald J. Spigarelli ,  Paul C. Dustin

Inventor： Donald J. Spigarelli ,  Paul C. Dustin

IPC: C23G3/04 ,  B01D3/00 ,  B01D5/00 ,  B23K1/015 ,  C23G5/04 ,  F26B21/06

CPC classification number: C23G5/04 ,  B01D3/00 ,  B01D5/0006 ,  B01D5/006 ,  B01D5/009 ,  B23K1/015 ,  B23K2201/42

Abstract: A continuous vapor processing system for vapor phase soldering, degreasing, or similar processes wherein a product is moved into and out of a vessel in a continuous manner via open conduits or channels while preventing escape of vapor from the processing tank and the conduits.

Abstract translation: 用于气相焊接，脱脂或类似工艺的连续蒸气处理系统，其中产品通过开放的管道或通道以连续的方式移入和流出容器，同时防止蒸气从处理槽和管道逸出。

公开(公告)号：US4258468A

公开(公告)日：1981-03-31

申请号：US969621

申请日：1978-12-14

Applicant: John W. Balde

Inventor： John W. Balde

IPC: B23K26/38 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC classification number: B23K26/382 ,  B23K26/40 ,  H05K3/0032 ,  H05K3/429 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K3/4611 ,  Y10T29/49126

Abstract: A via (21) is formed in a multilayer printed circuit board (10) by initially etching apertures (14) in the land areas (13) of the circuit pattern on the layers (11) prior to uniting the layers. A beam (16) of laser energy is then directed through the apertures to form a via through the printed circuit board. Each via is defined by the apertures in a plurality of vertically aligned land areas. The via is then electrolessly plated to provide electrical connections between vertically aligned land areas.

Abstract translation: 在多层印刷电路板（10）中，通过在层之间初始蚀刻层（11）上的电路图案的区域（13）中的孔（14），形成通孔（21）。 然后将激光能量的光束（16）引导通过孔径以形成通过印刷电路板的通孔。 每个通孔由多个垂直对齐的区域中的孔限定。 然后将通孔无电镀以提供垂直对齐的焊盘区域之间的电连接。

公开(公告)号：US4101066A

公开(公告)日：1978-07-18

申请号：US829559

申请日：1977-08-31

Applicant: Vincent A. Corsaro ,  Ernst A. Gutbier

Inventor： Vincent A. Corsaro ,  Ernst A. Gutbier

IPC: B23K3/06 ,  H05K3/34 ,  B23K1/02

CPC classification number: B23K3/0653 ,  B23K2201/42 ,  H05K3/3468

Abstract: In the wave soldering of terminals of an electrical device, such as a miniaturized printed circuit board assembly, the board is moved along a predetermined path so that it initially engages a first solder wave flowing counter to the direction of the board movement and subsequently engages a second solder wave flowing in the direction of board movement. The velocity of the solder in each of the solder waves is controlled independently by having separate independent pumping systems. Thus, the solder waves can be set at different independent velocities to achieve proper soldering of the terminals and associated conductor paths while reducing crossovers or bridges (i.e., shorts) between the terminals and the conductor paths as a result of the close spacing thereof.

Abstract translation: 在诸如小型化印刷电路板组件的电气设备的端子的波峰焊中，板沿着预定路径移动，使得其最初接合与板移动的方向相反流动的第一焊波，并且随后接合 第二焊波沿板移动方向流动。 每个焊波中焊料的速度由独立的独立泵送系统独立控制。 因此，可以将焊波设定为不同的独立速度，以实现端子和相关导体路径的适当焊接，同时由于其紧密间隔而减小端子与导体路径之间的交叉或桥接（即短路）。

公开(公告)号：US4046620A

公开(公告)日：1977-09-06

申请号：US703373

申请日：1976-07-08

Applicant: Ernst Andrascek ,  Hans Hadersbeck

Inventor： Ernst Andrascek ,  Hans Hadersbeck

IPC: H01H11/04 ,  B23K1/20 ,  B23K35/36 ,  C23G1/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/38 ,  C23F1/00 ,  B44C1/22

CPC classification number: B23K1/206 ,  B23K35/3612 ,  C23G1/00 ,  H05K3/22 ,  B23K2201/40 ,  B23K2201/42 ,  B23K2203/12 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/1157 ,  H05K2203/122 ,  H05K3/3489 ,  H05K3/383

Abstract: A process is provided for improving the solderability of electric circuit boards with conductor paths composed of copper or copper alloys, in which, at least at the locations to be soldered, the conductor paths are cleansed in a first solution and are thereby deoxidized, and are then activated in a second solution.

公开(公告)号：US4011980A

公开(公告)日：1977-03-15

申请号：US670466

申请日：1976-03-25

Applicant: Howard A. Dvorak ,  William R. Studnick

Inventor： Howard A. Dvorak ,  William R. Studnick

IPC: B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/1527 ,  H05K3/3447

Abstract: A printed wiring board is oriented with a wiring surface facing up for mass soldering. Molten solder is pumped from a tank onto a trough and flows in a thin, wide stream across the upper surface of the printed wiring board which is held down to prevent the board from floating on top of the solder.

Abstract translation: 印刷电路板的布线面向上定向以进行大规模焊接。 将熔融的焊料从槽泵送到槽上，并在薄的宽的流中流过印刷电路板的上表面，该印刷电路板的上表面被压住以防止电路板漂浮在焊料的顶部。

公开(公告)号：US3993235A

公开(公告)日：1976-11-23

申请号：US609239

申请日：1975-09-02

Applicant: Kenneth G. Boynton

Inventor： Kenneth G. Boynton

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce a wave having increasing pressure along its flow path whereby a substantially uni-directional wave may be formed which is highest adjacent its rear.

Abstract translation: 描述了形成熔融焊料的驻波的大规模焊接系统。 焊波的特征在于具有基本水平的波峰，并且波沿其流动路径具有变化的压力。 在本发明的优选实施例中，波压被改变以产生沿其流动路径具有增加的压力的波，由此可以形成基本上单向的波，其相邻于其后方是最高的。

公开(公告)号：US3990621A

公开(公告)日：1976-11-09

申请号：US647321

申请日：1976-01-07

Applicant: Kenneth G. Boynton ,  Alvin W. Hicks ,  Warren L. Johnston ,  John Walega, Jr.

Inventor： Kenneth G. Boynton ,  Alvin W. Hicks ,  Warren L. Johnston ,  John Walega, Jr.

IPC: B23K1/08 ,  B23K3/06

CPC classification number: B23K1/08 ,  B23K3/0653 ,  B23K2201/42

Abstract: A mass wave soldering system is described in which a standing wave of molten solder is formed from a static head of solder. The system comprises a soldering apparatus which has a two-compartment solder reservoir. The first compartment is designed to hold a first portion of the solder supply at a first liquid level with a layer of oil floating on the solder therein. The second compartment is designed for holding a second portion of the solder supply at a second liquid level above the first liquid level with a layer of oil floating on the solder therein. A sump and nozzle are positioned in the first compartment so that the sump is partially submerged in the molten solder therein, with the nozzle above the solder and oil levels therein, but below the solder and oil levels in the second compartment. The apparatus also includes a first conduit having an inlet disposed in the second compartment and an outlet disposed in the sump for carrying a flow of molten solder between the second compartment and the sump, and a second conduit having an inlet disposed in the second compartment for carrying a flow of oil from the second compartment and for depositing the oil onto the solder overflow adjacent the nozzle. Completing the apparatus are a conduit and pump for transferring molten solder and oil from the first compartment into the second compartment so as to maintain the liquid level of solder and the oil in the second compartment.

Abstract translation: 描述了一种质量波形焊接系统，其中熔融焊料的驻波由静止的焊料头形成。 该系统包括具有双室焊料储存器的焊接装置。 第一隔室被设计成将焊料供应源的第一部分保持在第一液面上，其中一层油漂浮在其上的焊料上。 第二隔室被设计成用于将焊料供应的第二部分保持在高于第一液面的第二液面上，其中一层油浮在其上的焊料上。 储槽和喷嘴位于第一隔室中，使得储槽部分地浸没在其中的熔融焊料中，其中喷嘴位于其中的焊料和油位之上，但低于第二隔室中的焊料和油的水平。 该设备还包括第一管道，其具有设置在第二隔室中的入口和设置在贮槽中的出口，用于在第二隔室和贮槽之间承载熔融焊料流，​​以及第二管道，其具有设置在第二隔室中的入口 携带来自第二隔室的油流，并将油沉积在邻近喷嘴的焊料溢流上。 完成设备是用于将熔融的焊料和油从第一隔室转移到第二隔室中的导管和泵，以便保持焊料和油在第二隔室中的液面。