公开(公告)号：WO2006001402A1

公开(公告)日：2006-01-05

申请号：PCT/JP2005/011690

申请日：2005-06-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  SAKAI, Tadahiko ,  MAEDA, Tadashi

Inventor： SAKAI, Tadahiko ,  MAEDA, Tadashi

IPC: H05K3/34

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

Abstract translation: 一种将在其上形成有焊料凸块（7）的电子部件（6）焊接到基板（12）上的方法，其中凸块（7）被压在其上形成有由金属粉末的焊剂（10）形成薄膜的焊剂转移台 （16）对焊料具有良好的润湿性，以使金属粉末（16）穿透氧化膜（7a）并嵌入在凸块（7）的底部的表面上，并且在该状态下的凸块（7）被定位，并且 安装在基板（12）上的电极（12a）上。 然后将基板（12）加热熔融凸块（7），并允许熔化的焊料沿着金属粉末（16）的表面向电极（12a）流动并扩散。 因此，该方法可以提供高质量的焊接部分，而没有任何焊接缺陷和绝缘性能的劣化。

公开(公告)号：WO2005089510A2

公开(公告)日：2005-09-29

申请号：PCT/US2005/009299

申请日：2005-03-17

Applicant: NORTHROP GRUMMAN CORPORATION ,  BERRY, Cynthia, W. ,  BAILEY, Alex, E. ,  FISHER, Robert ,  GUPTA, Tapan, K. ,  BROSEY, Daniel ,  SMALLEY, Steve, M. ,  THOMAS, William, A.

Inventor： BERRY, Cynthia, W. ,  BAILEY, Alex, E. ,  FISHER, Robert ,  GUPTA, Tapan, K. ,  BROSEY, Daniel ,  SMALLEY, Steve, M. ,  THOMAS, William, A.

IPC: C03B29/00 ,  H01L21/48 ,  H01L23/495 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/248 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/1126 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49163

Abstract: An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

Abstract translation: LTCC模块包括在一个或多个表面上的基座，用于接收要连接到模块的一个或多个外部组件。 基底由预定图案的多层金属化形成。 这些层包括在LTCC模块表面上的粘附层，具有一个或多个中间层，随后是顶层。 在低于LTCC模块的正常共烧温度的降低温度下，每层施加该模块，但具有足够的值以部分地烧结层。 在最后施加的顶层之后，模块在升高的温度下被烧一次以完全烧结层。

公开(公告)号：WO02000437A1

公开(公告)日：2002-01-03

申请号：PCT/DE2001/001452

申请日：2001-04-12

IPC: B41F15/08 ,  B41F15/44 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/1233 ,  B41F15/0818 ,  B41F15/44 ,  H05K3/245 ,  H05K2201/035 ,  H05K2201/09927 ,  H05K2203/0139

Abstract: A multiple printing is carried out by screen printing, whereby the doctor blade (1) and the screen (5) are employed at a higher separation than for a previous printing. Particularly fine and very high structures can thus be formed.

Abstract translation: 在丝网印刷的多打印用刮板（1）和（5）分别由更大的距离比在先前的压力下进行的筛执行。 通过这种方式，可以形成很细，但很高的结构。

公开(公告)号：WO00054561A1

公开(公告)日：2000-09-14

申请号：PCT/DE2000/000377

申请日：2000-02-08

IPC: B23K1/20 ,  B23K1/00 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H01L23/498

CPC classification number: H05K3/403 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/248 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/09181 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention relates to a method of improving the manufacturing safety of weld joints (7) between a ceramic support (1) and a printed-circuit board (10). Said method consists of the deposition of a first metallization layer (5) resistant to alloy breakdown on the ceramic support (1), followed by the imprinting of a second metallization layer (6), which enhances wetting behaviour, on the first metallization layer (5). In this way the thickness of the overall metallization layer (5, 6) can be increased in the area of the edges (8) of a weld joint (7). The resulting raised solder ring in turn permits the fully automatic optical control of the weld joint (7).

Abstract translation: 本发明涉及一种用于陶瓷基板（1）和电路板（10）之间增加焊点（7）的生产可靠性。 它包括陶瓷基板（1）和第二随后压印上施加第一ablegierungsbeständigen金属化层（5）的步骤中，润湿行为增强金属化层（6）的第一金属化层（5）上。 从而增加了Gesamtmetallisierungsschichtdicke（5,6）在边缘区域（8）的焊料接头的（7）是可以实现的，这又使焊接接头（7）的光学Lothochstieg全自动控制。

公开(公告)号：WO98056219A1

公开(公告)日：1998-12-10

申请号：PCT/JP1998/002497

申请日：1998-06-05

IPC: H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/382 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed. After the holes (40a) are formed, via holes (36a) are formed by filling up the holes (40a) with a metal (46) and a conductor circuit (32a) is formed by etching the metallic layer (42). Then, a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) of the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon another, only defectless single-sided circuit boards can be used in the step of lamination.

Abstract translation: 孔（40a）通过其上形成有金属层（42）的绝缘基板（40）形成有激光束。 在形成孔（40a）之后，通过用金属（46）填充孔（40a）形成通孔（36a），并且通过蚀刻金属层（42）形成导体电路（32a）。 然后，通过在通孔（36a）的表面上形成突出导体（38a）形成单面电路板（30A）。 电路板（30A）的突出导体（38a）被放置在另一单面电路板（30B）的导体电路（32b）上，粘合剂层（50）由未固化的树脂组成，并被加热并压靠 电路（32b）。 突出导体（38a）通过推开树脂并与电路（32b）电连接而进入未固化树脂。 由于单板电路板（30A，30B，30C，30D）可以在将板（30A，30B，30C和30D）层叠在另一个之前检查缺陷部件，所以只能使用无缺陷的单面电路板 在层压步骤中。

公开(公告)号：WO1997033311A1

公开(公告)日：1997-09-12

申请号：PCT/US1997003995

申请日：1997-02-28

Applicant: BIRD ELECTRONIC CORPORATION

Inventor： BIRD ELECTRONIC CORPORATION ,  WHISLER, Richard, E. ,  WYSONG, Larry, Lee

IPC: H01L21/48

CPC classification number: H05K3/321 ,  H01L21/4853 ,  H05K1/092 ,  H05K1/167 ,  H05K3/248 ,  H05K2201/035 ,  H05K2203/1453 ,  Y10T29/49099 ,  Y10T29/49149

Abstract: A method for making electrical connections between a lead and a conductor on a substrate, the method including the steps of disposing a copper conductor on a ceramic substrate; positioning a lead in contact with the conductor; applying a copper film to the lead and the conductor to attach the lead to the conductor; and heating the substrate, lead and conductor assembly to secure bond the lead and conductor together. In a preferred embodiment, the conductor, lead and film are made of copper. The method can further include disposing a resistive film on the substrate using thin or thick film processes.

Abstract translation: 一种用于在基板上的引线和导体之间进行电连接的方法，所述方法包括以下步骤：在陶瓷基板上设置铜导体; 定位导线与导体接触; 将铜膜施加到引线和导体以将引线附接到导体; 并加热基板，导线和导体组件，以将导线和导体固定在一起。 在优选实施例中，导体，导线和薄膜由铜制成。 该方法还可以包括使用薄膜或厚膜方法在基片上设置电阻膜。

公开(公告)号：WO9630932A3

公开(公告)日：1996-11-21

申请号：PCT/US9601779

申请日：1996-02-06

Applicant: GRUMMAN AEROSPACE CORP

Inventor： KOH WEI H ,  MCCAUSLAND CONNIE S

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0094 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.

公开(公告)号：WO1996030932A2

公开(公告)日：1996-10-03

申请号：PCT/US1996001779

申请日：1996-02-06

Applicant: GRUMMAN AEROSPACE CORPORATION

Inventor： GRUMMAN AEROSPACE CORPORATION ,  KOH, Wei, H. ,  McCAUSLAND, Connie, S.

IPC: H01L00/00

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0094 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.

Abstract translation: 一种用于在非导电衬底中形成导电通孔的方法，其中具有形成在其中间两侧的通孔。 该方法采用以下步骤：将金膏施加到通孔，以提供通过其的导电性; 并且当在基板上存在薄导电膜并且在基板上不存在薄导电膜时完全烧制金膏时，在烧结金膏时。 当在基板上存在薄膜时，在烧制金膏时，可以防止薄导电膜的劣化。 金膏的后续处理确保其完整性和可靠性。 因此，与当代薄膜通孔相比，金膏提供增强的导电性和改进的可靠性。

公开(公告)号：WO1995032449A1

公开(公告)日：1995-11-30

申请号：PCT/JP1995000976

申请日：1995-05-22

Applicant: SEIKO EPSON CORPORATION ,  UCHIYAMA, Kenji

Inventor： SEIKO EPSON CORPORATION

IPC: G02F01/1345

CPC classification number: G02F1/13452 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83951 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01R4/04 ,  H01R13/03 ,  H05K3/102 ,  H05K3/245 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/035 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A connecting terminal (2) of copper foil is formed on a substrate (3) of a glass epoxy base material, and a layer (1) of super-fine particles of Ag is deposited on the surface of this connecting terminal (2). The layer (1) is connected electrically with a connecting terminal (4) of copper foil formed on another substrate (5) comprising a polyamide base film via a bonding agent (6). The layer (1) compensates for a defect of conduction of the connecting terminals and increases the contact areas of the conductive connecting portions to attain the reduction of the resistance thereof. The fine particle layer lessens the stress imparted to the connecting terminals during a connecting operation, and, even when a crack occurs in a connecting terminal, this layer makes up therefor. This stabilizes the conductive connecting portions and improves the yield of structures thereof.

Abstract translation: 在玻璃环氧基材的基板（3）上形成有铜箔的连接端子（2），并且在该连接端子（2）的表面上淀积有超细Ag粒子的层（1）。 层（1）通过粘合剂（6）与形成在包括聚酰胺基膜的另一基板（5）上的铜箔的连接端子（4）电连接。 层（1）补偿连接端子的导通缺陷，并且增加导电连接部分的接触面积，以实现电阻的降低。 细小颗粒层减少了在连接操作期间施加到连接端子的应力，并且即使在连接端子发生裂纹时，该层构成。 这使得导电连接部分稳定并提高其结构的产量。

公开(公告)号：WO1985002946A1

公开(公告)日：1985-07-04

申请号：PCT/JP1984000626

申请日：1984-12-27

Applicant: NISSHA PRINTING CO., LTD. ,  MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  MATSUMURA, Kozo ,  OGAWA, Yukio

Inventor： NISSHA PRINTING CO., LTD. ,  MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

IPC: H01R11/01

CPC classification number: H05K3/323 ,  H01R4/04 ,  H01R12/714 ,  H05K3/061 ,  H05K3/245 ,  H05K3/36 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/035 ,  H05K2203/0571 ,  H05K2203/066

Abstract: A conductive circuit pattern portion is formed on an insulating substrate film, the pattern portion being constituted by a laminate of a thin metal film pattern layer with excellent electrical properties and an easily formable printed pattern layer, and a hot-melt adhesive layer with anisotropic electrical conductivity is further formed on the circuit pattern portion, whereby it is possible to easily a flexible conductive film connector which is accurately formed with a minute conductive circuit pattern having excellent electrical characteristics. The conductive film connector has excellent electrical characteristics and makes it possible to obtain complete adhesion. Further, there is no danger that the conductive film connector will fail as a result of long use; hence, it provides a highly reliable connection.