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公开(公告)号：US08450217B2
公开(公告)日：2013-05-28
申请号：US13519265
申请日：2010-12-22
Applicant: Mohamed Benwadih , Marie Heitzmann
Inventor： Mohamed Benwadih , Marie Heitzmann
IPC: H01L21/302 , H01L21/461 , H01L21/44
CPC classification number: H05K3/0044 , H05K2201/0239 , H05K2203/0522 , H05K2203/0746
Abstract: The method for making a hole in a layer includes the provision of first and second adhesion areas on a surface of a support. The first area has dimensions corresponding to the dimensions of the hole. The method includes depositing a layer on the first and second adhesion areas. The material of the layer has an adhesion coefficient to the first area lower than the adhesion coefficient to the second area. The part of layer arranged above the first area is eliminated by a fluid jet.
Abstract translation: 在层中制造孔的方法包括在支撑体的表面上设置第一和第二粘附区域。 第一区域具有与孔的尺寸相对应的尺寸。 该方法包括在第一和第二粘附区域上沉积一层。 该层的材料具有比第二区域的粘附系数低的第一区域的粘附系数。 通过流体射流消除了布置在第一区域上方的层的部分。
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202.发明授权Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers 有权具有介电层的电路化基底，其电介质组成不包括连续或半连续的纤维公开(公告)号：US08445094B2
公开(公告)日：2013-05-21
申请号：US11896786
申请日：2007-09-06
Applicant: Robert Japp , Kostas Papathomas
Inventor： Robert Japp , Kostas Papathomas
CPC classification number: H05K1/0373 , H01L2224/16225 , H01L2924/15311 , H05K3/4602 , H05K2201/0209 , H05K2201/0239 , Y10T428/24322 , Y10T428/24355 , Y10T428/24917
Abstract: A circuitized substrate which includes at least one circuit layer and at least one substantially solid dielectric layer comprised of a dielectric composition which includes a cured resin material and a predetermined percentage by weight of particulate fillers, but not including continuous or semi-continuous fibers as part thereof.
Abstract translation: 一种电路化衬底，其包括至少一个电路层和至少一个基本上固体的电介质层，该电介质层包括固化树脂材料和预定重量百分比的颗粒填料，但不包括连续或半连续纤维作为部分 其中。
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公开(公告)号：US20120289045A1
公开(公告)日：2012-11-15
申请号：US13519265
申请日：2010-12-22
Applicant: Mohamed Benwadih , Marie Heitzmann
Inventor： Mohamed Benwadih , Marie Heitzmann
IPC: H01L21/71
CPC classification number: H05K3/0044 , H05K2201/0239 , H05K2203/0522 , H05K2203/0746
Abstract: The method for making a hole in a layer includes the provision of first and second adhesion areas on a surface of a support. The first area has dimensions corresponding to the dimensions of the hole. The method includes depositing a layer on the first and second adhesion areas. The material of the layer has an adhesion coefficient to the first area lower than the adhesion coefficient to the second area. The part of layer arranged above the first area is eliminated by a fluid jet.
Abstract translation: 在层中制造孔的方法包括在支撑体的表面上设置第一和第二粘附区域。 第一区域具有与孔的尺寸相对应的尺寸。 该方法包括在第一和第二粘附区域上沉积一层。 该层的材料具有比第二区域的粘附系数低的第一区域的粘附系数。 通过流体射流消除了布置在第一区域上方的层的部分。
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204.发明申请Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board 审中-公开印刷电路板用铜箔和印刷电路板用铜包层压板公开(公告)号：US20120148862A1
公开(公告)日：2012-06-14
申请号：US13396334
申请日：2012-02-14
Applicant: Terumasa Moriyama , Kengo Kaminaga
Inventor： Terumasa Moriyama , Kengo Kaminaga
CPC classification number: H05K3/384 , C23C28/00 , C23C28/321 , C23C28/345 , C23C28/3455 , C25D3/562 , C25D3/565 , C25D7/0614 , H05K2201/0239 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/12583 , Y10T428/1259 , Y10T428/12618 , Y10T428/1266 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/12944 , Y10T428/263 , Y10T428/27 , Y10T428/273
Abstract: A copper foil for a printed circuit board is provided. The copper foil includes a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to as a “nickel zinc layer”) on a roughened surface of a copper foil and a chromate film layer on the nickel zinc layer. The zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm2 or more and 3500 μg/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.
Abstract translation: 提供了用于印刷电路板的铜箔。 铜箔包括在铜箔的粗糙表面上的镍，锌，镍化合物和锌的化合物（以下称为“镍锌层”）的层和镍锌层上的铬酸盐膜层。 镍锌层的单位面积的锌添加量为180μg/ dm 2以上且3500μg/ dm 2以下，镍锌层的镍重量比（镍附加重量/（镍添加量） 重量+锌附加重量）}为0.38以上且0.7以下。 铜箔的表面处理技术能够有效地防止在树脂基材上层叠铜箔并使用硫酸过氧化氢蚀刻溶液对电路进行软蚀刻的情况下的电路腐蚀现象。
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205.发明授权Copper foil for printed circuit board and copper clad laminate for printed circuit board 失效印刷电路板用铜箔和印刷电路板用铜箔层压板公开(公告)号：US08142905B2
公开(公告)日：2012-03-27
申请号：US12738995
申请日：2009-05-29
Applicant: Terumasa Moriyama , Kengo Kaminaga
Inventor： Terumasa Moriyama , Kengo Kaminaga
CPC classification number: H05K3/384 , C23C28/00 , C23C28/321 , C23C28/345 , C23C28/3455 , C25D3/562 , C25D3/565 , C25D7/0614 , H05K2201/0239 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/12583 , Y10T428/1259 , Y10T428/12618 , Y10T428/1266 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/12944 , Y10T428/263 , Y10T428/27 , Y10T428/273
Abstract: Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm2 or more and 3500 μg/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.
Abstract translation: 提供一种用于印刷电路板的铜箔，其包括在铜箔的粗糙表面上包含镍，锌，镍化合物和锌的层（以下称为“镍锌层”）的层，以及铬酸盐膜 镍锌层的单位面积锌添加量为180μg/ dm 2以上且3500μg/ dm 2以下，镍锌层中的镍重量比（镍添加量） - 重量/（镍附加重量+锌附加重量）}为0.38以上且0.7以下。 铜箔的表面处理技术能够有效地防止在树脂基材上层叠铜箔并使用硫酸过氧化氢蚀刻溶液对电路进行软蚀刻的情况下的电路腐蚀现象。
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Patent Agency Ranking
公开(公告)号：US08071160B2
公开(公告)日：2011-12-06
申请号：US12115874
申请日：2008-05-06
Applicant: Jeffrey D. Chinn , Robert W. Ashurst , Adam N. Anderson
Inventor： Jeffrey D. Chinn , Robert W. Ashurst , Adam N. Anderson
CPC classification number: H05K3/284 , H01L23/49894 , H01L2924/0002 , H05K2201/0209 , H05K2201/0239 , H05K2201/0257 , H05K2201/09872 , Y10T428/24355 , Y10T428/24364 , Y10T428/24372 , Y10T428/24388 , Y10T428/24405 , Y10T428/24413 , Y10T428/24421 , Y10T428/269 , Y10T428/2839 , H01L2924/00
Abstract: A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70 dyne/cm is deposited over the film to form a coated film. The coated film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.
Abstract translation: 提供了一种形成膜的方法。 使用液体沉积工艺将纳米颗粒沉积在基底的表面上。 使用接头分子将纳米颗粒彼此连接并连接到表面。 表面能小于70达因/厘米的涂层沉积在膜上以形成涂膜。 涂膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。
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207.发明申请EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME 审中-公开环氧树脂组合物，以及使用其的印刷电路板和印刷电路板公开(公告)号：US20110284276A1
公开(公告)日：2011-11-24
申请号：US12907521
申请日：2010-10-19
Applicant: Hsien Te CHEN
Inventor： Hsien Te CHEN
CPC classification number: C08J5/24 , C08K3/22 , H05K1/0326 , H05K1/0373 , H05K2201/0239 , C08L63/00
Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator.
Abstract translation: 公开了一种用于印刷电路板的环氧树脂组合物，其包括（A）环氧树脂; （B）固化剂; （C）包含氧化锰的无机填料; 和（D）固化促进剂。
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208.发明申请EPOXY RESIN COMPOSITION, PREPREG, AND METAL-CLAD LAMINATE AND MULTILAYERED PRINTED WIRING BOARD 有权环氧树脂组合物，PREPREG和金属层压板和多层印刷布线板公开(公告)号：US20100294548A1
公开(公告)日：2010-11-25
申请号：US12735235
申请日：2008-07-29
Applicant: Hiroyuki Fujisawa , Hiroki Tamiya
Inventor： Hiroyuki Fujisawa , Hiroki Tamiya
IPC: H05K1/00 , C08K9/10 , B32B15/092
CPC classification number: H05K1/0373 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/04 , B32B27/12 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/306 , B32B2307/50 , B32B2457/08 , C08G59/38 , C08G59/621 , C08J5/24 , C08J2363/08 , C08K3/22 , C08K3/36 , C08K5/13 , C08L63/00 , H05K3/4626 , H05K2201/0209 , H05K2201/0239 , Y10T428/31529 , C08L2666/22
Abstract: The present invention provides an epoxy resin composition exhibiting good workability in drilling, molding, and desmearing as well as good interlayer adhesion strength. This epoxy resin composition comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin is composed of a dicyclopentadiene-based epoxy resin and a novolac-based epoxy resin. The curing agent is a biphenyl-based phenol resin. The inorganic filler is composed of aluminum hydroxide and granular silica having an epoxy-silane treated surface. The epoxy resin composition contains 20 to 50% by weight of the granular silica. The epoxy resin composition contains 2 to 15% by weight, based on total weight of granular silica, of the aluminum hydroxide.
Abstract translation: 本发明提供了一种在钻井，成型和除泥中表现出良好的加工性以及良好的层间粘合强度的环氧树脂组合物。 该环氧树脂组合物包含环氧树脂，固化剂和无机填料。 环氧树脂由二环戊二烯系环氧树脂和酚醛清漆型环氧树脂构成。 固化剂是联苯基酚醛树脂。 无机填料由氢氧化铝和具有环氧硅烷处理表面的颗粒状二氧化硅组成。 环氧树脂组合物含有20〜50重量％的粒状二氧化硅。 环氧树脂组合物含有2〜15重量％，相对于粒状二氧化硅的总重量为氢氧化铝。
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209.发明申请Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board 失效印刷电路板用铜箔和印刷电路板用铜包层压板公开(公告)号：US20100261033A1
公开(公告)日：2010-10-14
申请号：US12738995
申请日：2009-05-29
Applicant: Terumasa Moriyama , Kengo Kaminaga
Inventor： Terumasa Moriyama , Kengo Kaminaga
CPC classification number: H05K3/384 , C23C28/00 , C23C28/321 , C23C28/345 , C23C28/3455 , C25D3/562 , C25D3/565 , C25D7/0614 , H05K2201/0239 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/12583 , Y10T428/1259 , Y10T428/12618 , Y10T428/1266 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/12944 , Y10T428/263 , Y10T428/27 , Y10T428/273
Abstract: Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm2 or more and 3500 μg/dm2 or less, and the nickel weight ratio in the nickel zinc layer {nickel add-on weight/(nickel add-on weight+zinc add-on weight)} is 0.38 or more and 0.7 or less. This surface treatment technology of a copper foil is able to effectively prevent the circuit corrosion phenomenon in cases of laminating a copper foil on a resin base material and using a sulfuric acid hydrogen peroxide etching solution to perform soft etching to the circuit.
Abstract translation: 提供一种用于印刷电路板的铜箔，其包括在铜箔的粗糙表面上包含镍，锌，镍化合物和锌的层（以下称为“镍锌层”）的层，以及铬酸盐膜 镍锌层的单位面积锌添加量为180μg/ dm 2以上且3500μg/ dm 2以下，镍锌层中的镍重量比（镍添加量） - 重量/（镍附加重量+锌附加重量）}为0.38以上且0.7以下。 铜箔的表面处理技术能够有效地防止在树脂基材上层叠铜箔并使用硫酸过氧化氢蚀刻溶液对电路进行软蚀刻的情况下的电路腐蚀现象。
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210.发明申请公开(公告)号：US20100186992A1
公开(公告)日：2010-07-29
申请号：US12665027
申请日：2007-08-16
Applicant: Kazufumi Ogawa , Kazuhiro Soejima
Inventor： Kazufumi Ogawa , Kazuhiro Soejima
CPC classification number: H01B1/12 , C01P2006/40 , C09C1/62 , C09C3/08 , C09C3/12 , H05K1/095 , H05K1/097 , H05K2201/0224 , H05K2201/0239 , Y10T428/25 , Y10T428/29 , Y10T428/2991 , Y10T428/2995 , Y10T428/2998
Abstract: The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.
Abstract translation: 本发明涉及一种导电膏，其中细金属颗粒分散在由至少烷氧基硅烷化合物，硅烷醇缩合催化剂和非水有机溶剂的混合物制成的化学吸附液体中，以形成包含分子共价的有机薄膜 通过使细金属颗粒的表面与烷氧基硅烷化合物反应而与金属微粒表面结合，从而产生赋予表面的反应性功能的细小金属颗粒，同时几乎保持细金属的原始导电性 颗粒，然后用有机溶剂粘贴颗粒。
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