公开(公告)号：EP2123828A4

公开(公告)日：2012-08-29

申请号：EP08721663

申请日：2008-03-04

Applicant: TEIJIN LTD ,  NAT INST FOR MATERIALS SCIENCE

Inventor： KUWAHARA HIROAKI ,  BANDO YOSHIO ,  ZHI CHUNYI ,  TANG CHENGCHUN ,  GOLBERG DMITRI

IPC: D21H13/46 ,  D04H1/42 ,  H05K1/03

CPC classification number: D21H13/46 ,  B82Y10/00 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0386 ,  H05K2201/026 ,  H05K2201/0284

公开(公告)号：EP2430639A1

公开(公告)日：2012-03-21

申请号：EP10722866.0

申请日：2010-05-04

Applicant: Cambrios Technologies Corporation

Inventor： ALLEMAND, Pierre-Marc ,  PSCHENITZKA, Florian ,  RAMOS, Teresa ,  SEPA, Jelena

IPC: H01B1/02 ,  H05K3/32 ,  C09D5/24 ,  H01B1/22

CPC classification number: H01B1/02 ,  B82Y10/00 ,  C08K3/08 ,  C09D5/24 ,  C09D7/70 ,  C09D11/037 ,  C09D11/38 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/022475 ,  H01L31/1884 ,  H05K1/097 ,  H05K2201/026 ,  Y02E10/50

Abstract: Reliable and durable conductive films formed of conductive nanostructures are described. The conductive films show substantially constant sheet resistance following prolonged and intense light exposure.

公开(公告)号：EP2282621A1

公开(公告)日：2011-02-09

申请号：EP10171801.3

申请日：2010-08-03

Applicant: The Boeing Company

Inventor： Vance, Jonathan B. ,  Johnston, Scott

IPC: H05K3/12

CPC classification number: B05B5/025 ,  H01L51/0022 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/105

Abstract: A system for in-process orientation of particles used in direct-write inks for fabricating a component may include a device for polarizing direct-write particles in an aerosol. An outlet may direct the aerosol including the polarized direct-write particles on a substrate to form a component. An apparatus may cause the polarized direct-write particles to be aligned in a selected orientation to form the component with predetermined characteristics when deposited on the substrate.

Abstract translation: 一种用于在过程中直接写入油墨用于制造组分粒子定向系统可以包括用于以气溶胶偏振直写颗粒的装置。 出口可引导气雾剂包含在基板上的偏振直写颗粒以形成一个组件。 一种装置，可能导​​致偏振直写颗粒在选定的取向对齐，以形成具有预定特性的组件时在衬底上沉积。

公开(公告)号：EP2252662A1

公开(公告)日：2010-11-24

申请号：EP09713701.2

申请日：2009-02-25

Applicant: Cambrios Technologies Corporation

Inventor： WINOTO, Adrian

IPC: C09D11/00 ,  H05K3/00

CPC classification number: C09D11/322 ,  B82Y10/00 ,  C09D11/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/00 ,  H05K2201/026 ,  Y10S977/762

Abstract: Disclosed is an electrically conductive feature on a substrate, and methods and compositions for forming the same, wherein the electrically conductive feature includes metallic anisotropic nanostructures and is formed by injetting onto the substrate a coating solution containing the conductive anisotropic nanostructures.

公开(公告)号：EP2251389A1

公开(公告)日：2010-11-17

申请号：EP10174097.5

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan, S. ,  Dai, Haixia ,  Knapp, Michael, R. ,  Na, Shuo ,  Pakabaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A. ,  Winoto, Adrian ,  Wolk, Jeffrey

IPC: C09D11/00 ,  B22F1/00 ,  H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A nanowire ink comprising:
a plurality of metal nanowires;
a surfactant;
a viscosity modifier; and
a solvent;
wherein, by weight, the ratio of the surfactant to the viscosity modifier is in the range of about 80 to about 0.01, the ratio of the viscosity modifier to the metal nanowires is in the range of about 5 to about 0.000625, and the ratio of the metal nanowires to the surfactant is in the range of about 560 to about 5.

Abstract translation: 一种纳米线油墨，包括：多个金属纳米线; 表面活性剂; 粘度调节剂; 和溶剂; 其中，按重量计，表面活性剂与粘度调节剂的比率在约80至约0.01的范围内，粘度调节剂与金属纳米线的比值在约5至约0.000625的范围内， 表面活性剂的金属纳米线在约560至约5的范围内。

公开(公告)号：EP2147466A1

公开(公告)日：2010-01-27

申请号：EP08746371.7

申请日：2008-04-18

Applicant: Cambrios Technologies Corporation

Inventor： JONES, David ,  PSCHENITZKA, Florian ,  QUAN, Xina ,  SPAID, Michael A. ,  WOLK, Jeffrey

IPC: H01L31/0224 ,  G02F1/00 ,  H01L33/00

CPC classification number: H05K3/245 ,  B82Y10/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/1884 ,  H01L51/0048 ,  H01L51/5206 ,  H05K1/097 ,  H05K3/249 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/50

Abstract: Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires or metal nanotubes and a secondary conductive medium based on a different type of nanostructures or a continuous conductive film.

公开(公告)号：EP2082436A2

公开(公告)日：2009-07-29

申请号：EP07844249.8

申请日：2007-10-12

Applicant: Cambrios Technologies Corporation

Inventor： ALLEMAND, Pierre-Marc ,  DAI, Haixia ,  NA, Shuo ,  PAKBAZ, Hash ,  PSCHENITZKA, Florian ,  QUAN, Xina ,  SEPA, Jelena ,  SPAID, Michael A.

IPC: H01L31/0224

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可以嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子体显示面板等的视觉显示装置中的透明电极。

公开(公告)号：EP3349551A1

公开(公告)日：2018-07-18

申请号：EP17151014.2

申请日：2017-01-11

Applicant: Mitsubishi Electric R & D Centre Europe B.V. ,  Mitsubishi Electric Corporation

Inventor： Degrenne, Nicolas ,  Mollov, Stefan

IPC: H05K1/18 ,  H01L25/00 ,  H01L23/22 ,  H01L23/24 ,  H01L23/48

CPC classification number: H01L25/00 ,  H01L23/22 ,  H01L23/24 ,  H01L23/48 ,  H01L2924/00 ,  H05K1/0206 ,  H05K1/145 ,  H05K1/185 ,  H05K3/325 ,  H05K3/366 ,  H05K3/4697 ,  H05K2201/0162 ,  H05K2201/026 ,  H05K2201/10166 ,  H05K2203/0307

Abstract: The present invention concerns a printed circuit board embedding a power die wherein interconnections between the power die and the printed circuit board are composed of micro/nano wires, the printed circuit board comprising a cavity wherein the power die is placed, and wherein the cavity is further filled with a dielectric fluid.

公开(公告)号：EP3330327A1

公开(公告)日：2018-06-06

申请号：EP17176974.8

申请日：2017-06-20

Applicant: Samsung Electronics Co., Ltd. ,  Foundation Of Soongsil University-Industry Cooperation

Inventor： CHU, Kunmo ,  SONG, Byonggwon ,  PARK, Sunghoon ,  YANG, Kiyeon ,  LEE, Changseung

IPC: C09D5/24 ,  C09D11/52 ,  H01B1/22 ,  H01L23/532 ,  H01R13/24

CPC classification number: C09D5/24 ,  C08K3/041 ,  C08K3/08 ,  C08K3/10 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/011 ,  C09D7/61 ,  C09D7/69 ,  C09D7/70 ,  C09D11/52 ,  C09D183/04 ,  H01B1/22 ,  H01B1/24 ,  H01L21/4867 ,  H01L23/49883 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/27515 ,  H01L2224/29105 ,  H01L2224/29191 ,  H01L2224/29193 ,  H01L2224/3003 ,  H01R13/2414 ,  H05K1/028 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/128

Abstract: Provided are a paste material, a method of forming the paste material, a wiring member formed from the paste material, and an electronic device including the wiring member. The paste material may include a plurality of liquid metal particles and a polymer binder. The paste material may further include a plurality of nanofillers. At least some of the plurality of nanofillers may each have an aspect ratio equal to or greater than about 3. The content of the plurality of liquid metal particles may be greater than the content of the polymer binder and may be greater than the content of the plurality of nanofillers. The wiring member may be formed by using the paste material, and the wiring member may be used in various electronic devices.

公开(公告)号：EP3162561A4

公开(公告)日：2018-04-11

申请号：EP14752247

申请日：2014-06-10

Applicant: SHENGYI TECHNOLOGY CO LTD

Inventor： CHAI SONGGANG

IPC: H05K1/03 ,  B32B27/08 ,  H05K3/02

CPC classification number: B32B27/20 ,  B32B5/022 ,  B32B5/024 ,  B32B15/092 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/38 ,  B32B37/14 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/204 ,  B32B2457/08 ,  D06N1/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/026

Abstract: The present invention relates to a thermosetting resin sandwich prepreg, and the copper clad laminates and multi-layered printed circuit wiring boards manufactured therefrom. The interlayer of the thermosetting resin sandwich prepreg contains the thermosetting resin composition with a high content of fillers, and the outer layer of the prepreg contains the thermosetting resin composition with a low content of fillers. The copper clad laminates prepared by using the prepregs have good adhesion to metal foils, insulativity and uniform dielectric constant distribution.