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    Metal coated laminate and method for production of the same
    201.
    发明专利
    Metal coated laminate and method for production of the same 有权
    金属包覆层压板及其制造方法

    公开(公告)号：JP2008260274A

    公开(公告)日：2008-10-30

    申请号：JP2008066175

    申请日：2008-03-14

    Applicant: Furukawa Electric Co Ltd:The ,  古河電気工業株式会社

    Inventor： ZAMA SATORU ,  OGA KENICHI

    IPC: B32B15/08

    CPC classification number: H05K3/022 ,  C22C1/002 ,  C23C18/31 ,  C25D5/50 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0129 ,  H05K2201/0344 ,  H05K2203/1105 ,  Y10T428/24322 ,  Y10T428/31678

    Abstract: PROBLEM TO BE SOLVED: To provide a metal coated laminate enabling an improvement in adhesion of a metal layer and a thermoplastic polymer film having flexibility, and in dimensional stability at the time of conductor etching, and a manufacturing method of the same. SOLUTION: This method for production of the metal coated laminate comprising the film and the metal layer consisting of a foundation layer and an upper layer includes (a) a process of forming the foundation layer by plating on at least a part of the surface of the film, (b) a process of forming the upper layer by plating on a first laminate formed by the process (a), and (c) a process of carrying out a heat treatment to a second laminate formed by the process (b). The film is a thermoplastic polymetric film having a flexibility, the foundation layer is a nickel alloy, and the upper layer is copper. The plated film formed by the processes (a) and (b) has a compression stress before the process (c), and the metal coated laminate contracts in the direction of the film plane by the process (c). COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够改善金属层和具有挠性的热塑性聚合物膜以及在导体刻蚀时的尺寸稳定性中的粘合性的金属涂层层压板及其制造方法。 解决方案：用于生产包含该膜的金属涂层层压板和由基础层和上层组成的金属层的方法包括：（a）通过在至少一部分 膜的表面，（b）通过在由方法（a）形成的第一层压体上电镀形成上层的方法，和（c）对通过该方法形成的第二层压体进行热处理的方法（ b）。 该膜是具有柔软性的热塑性聚甲醛膜，基础层是镍合金，上层是铜。 通过方法（a）和（b）形成的镀膜在方法（c）之前具有压缩应力，并且金属涂层的层压体通过方法（c）在膜平面的方向上收缩。 版权所有（C）2009，JPO＆INPIT

    配線基板
    202.
    发明专利
    配線基板 审中-公开
    接线板

    公开(公告)号：JP2016092053A

    公开(公告)日：2016-05-23

    申请号：JP2014221171

    申请日：2014-10-30

    Applicant: 京セラサーキットソリューションズ株式会社

    Inventor： 松本 啓作

    IPC: H01L23/12 ,  H05K1/02

    CPC classification number: H05K1/0224 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K3/243

    Abstract: 【課題】搭載する半導体素子に対して十分な電源供給をすることにより、作動電圧の低い半導体素子を安定的に作動させることができるととともに、微細なラインアンドスペースの小型高密度配線基板を提供すること。 【解決手段】絶縁層1の同じ主面に、信号用の帯状配線導体2aと、接地または電源用のプレーン導体2bとを配設して成る配線基板Aであって、プレーン導体2bの厚みが帯状配線導体2aの厚みよりも大きいことを特徴とする。 【選択図】図2

    Abstract translation: 要解决的问题：提供具有精细线空间的紧凑且高密度的布线基板，其可以通过向安装的半导体元件提供足够的电力来稳定地激活具有低工作电压的半导体元件。解决方案：布线板A 包括用于信号的带状布线导体2a和用于接地或电源的扁平导体2b布置在绝缘层1的相同主表面上，其中平面导体2b的厚度大于 带状接线导体2a.SELECTED DRAWING：图2

    Flexible film and display device
    205.
    发明专利
    Flexible film and display device 审中-公开
    柔性胶片和显示装置

    公开(公告)号：JP2009288774A

    公开(公告)日：2009-12-10

    申请号：JP2009081732

    申请日：2009-03-30

    Applicant: Lg Electronics Inc ,  エルジー エレクトロニクス インコーポレイティド

    Inventor： YUM JUNGSUP ,  KO DONGKI

    IPC: G09F9/00 ,  G02B5/00

    CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2201/09827 ,  H05K2201/10681 ,  Y10T428/24331

    Abstract: PROBLEM TO BE SOLVED: To provide a flexible film (flexible printed circuit) superior in safeness and reliability in which a hole is easily formed, and to provide a display device which has the film. SOLUTION: The flexible film relating to one embodiment includes: an insulating film including a hole, an inner circumference surface surrounding the hole, a first surface, and a second surface opposite to the first surface; and a metal layer covering the inner circumference surface and at least one of the first surface and the second surface and including a first layer and a second layer. The metal layer has a first region, located on the inner circumference surface and a second region located on the first surface or the second surface, with the second region having a thickness which is larger than that of the first region. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种安全性和可靠性优异的可容易地形成孔的柔性膜（柔性印刷电路），并提供具有该膜的显示装置。 ＆lt; P＆gt;解决方案：涉及一个实施例的柔性膜包括：绝缘膜，包括孔，围绕孔的内周表面，第一表面和与第一表面相对的第二表面; 以及覆盖所述内周面和所述第一表面和所述第二表面中的至少一个的金属层，并且包括第一层和第二层。 金属层具有位于内周面上的第一区域和位于第一表面或第二表面上的第二区域，第二区域的厚度大于第一区域的厚度。 版权所有（C）2010，JPO＆INPIT

    Core layer including nickel layer, multilayer substrate and manufacturing method thereof
    206.
    发明专利
    Core layer including nickel layer, multilayer substrate and manufacturing method thereof 有权
    核心层，包括镍层，多层基板及其制造方法

    公开(公告)号：JP2007227937A

    公开(公告)日：2007-09-06

    申请号：JP2007044065

    申请日：2007-02-23

    Applicant: Samsung Electro-Mechanics Co Ltd ,  サムソン エレクトロ−メカニックス カンパニーリミテッド.

    Inventor： JUN SOON-OH ,  CHOI CHEOL-HO ,  NAM CHANG-HYUN ,  KIM HONG-WON ,  KIM SEUNG-CHUL

    IPC: H05K3/38 ,  H05K1/09 ,  H05K3/18 ,  H05K3/46

    CPC classification number: H05K3/108 ,  H05K3/181 ,  H05K3/4661 ,  H05K2201/0344 ,  Y10T29/49124 ,  Y10T428/31678

    Abstract: PROBLEM TO BE SOLVED: To provide a core layer and a multilayer substrate which are effective for reduction of a raw cost, and their manufacturing method. SOLUTION: A core layer which includes a nickel layer as a seed layer and can form a fine inner circuit by a semi-additive method by improving combination force between a core insulating layer or an insulating layer such as prepreg and a conductive layer such as a copper layer, can reduce the number of layers of a substrate to be laminated since a fine interconnection can be formed directly in the core layer, can thin the substrate since the thickness of a formed electroless nickel plating layer can be reduced, thus improving productivity, and can reduce a raw cost, a multilayer substrate and their manufacturing method are provided. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供有效降低原始成本的芯层和多层基板及其制造方法。 解决方案：一种芯层，其包括镍层作为种子层，并且可以通过提高芯绝缘层或绝缘层（例如预浸料和导电层）之间的组合力，通过半添加方法形成精细的内部电路 由于可以直接在芯层中形成微细的互连，所以可以减少层叠的基板的层数，能够减小形成的无电镀镍层的厚度，从而能够使基板薄型化 提高生产率，并且可以降低原始成本，提供多层基板及其制造方法。 版权所有（C）2007，JPO＆INPIT

    Plating method
    208.
    发明专利
    Plating method 失效
    涂层方法

    公开(公告)号：JPS59185771A

    公开(公告)日：1984-10-22

    申请号：JP6186783

    申请日：1983-04-07

    Applicant: Satoosen:Kk

    Inventor： OOTA HIDEO ,  SHIRAYOSHI TATSUZOU ,  ITOU YASUNORI ,  TAKAGI FUSAO

    IPC: C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/36 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42

    CPC classification number: H05K3/42 ,  C23C18/36 ,  H05K3/187 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/0344 ,  H05K2201/09736 ,  H05K2203/025 ,  H05K2203/0571

    Abstract: PURPOSE:To subject only the inner wall of a hole in a copper-lined laminated board to electroless plating by leaving catalyst nuclei only on the inner wall and carrying out plating under specified conditions using a specified electroless Ni plating bath. CONSTITUTION:Catalyst nuclei are stuck to the whole surface of a copper-lined laminated board including the inner wall of a hole pierced in the board, and the catalyst nuclei on the surface of the copper foil of the board are removed by planing to leave the catalyst nuclei only on the inner wall of the hole. The board is then immersed in an electroless Ni plating bath of 2.1-2.6pH at 65- 75 deg.C. The plating bath contains 3-9g/l (expressed in terms of Ni) Ni salt, 15- 30g/l sodium citrate and 30-50g/l sodium hypophosphite. Only the inner wall of the hole in the copper lined laminated board is subjected to electroless Ni plating.

    Abstract translation: 目的：仅使用铜衬层压板的孔内壁进行化学镀，只能在内壁上留下催化剂核，并在规定的条件下使用指定的无电Ni镀浴进行电镀。 构成：将催化剂核粘附到包括板的穿孔内壁的铜衬层压板的整个表面，并通过刨削去除板的铜箔表面上的催化剂核，离开 催化剂核只在孔的内壁上。 然后将板浸入在65-75℃的2.1-2.6pH的无电镀镍浴中。 电镀浴含有3-9g / l（以Ni表示）Ni盐，15-30g / l柠檬酸钠和30-50g / l次磷酸钠。 只有铜衬层压板中孔的内壁进行化学镀镍。

    PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRISING ELECTROLESS FILL
    209.
    发明公开
    PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRISING ELECTROLESS FILL 审中-公开
    美国麻省理工学院麻省理工学院麻省理工学院

    公开(公告)号：EP3130007A1

    公开(公告)日：2017-02-15

    申请号：EP15718326.0

    申请日：2015-04-09

    Applicant: Qualcomm Incorporated

    Inventor： JOMAA, Houssam Wafic ,  BCHIR, Omar James ,  KIM, Chin-Kwan

    IPC: H01L23/498

    CPC classification number: H05K1/112 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K3/422 ,  H05K3/425 ,  H05K3/429 ,  H05K2201/0344 ,  H05K2201/09036 ,  H05K2201/10378

    Abstract: Some novel features pertain to a substrate that includes a first dielectric layer, a first interconnect, a first cavity, and a first electroless metal layer. The first dielectric layer includes a first surface and a second surface. The first interconnect is on the first surface of the substrate layer. The first cavity traverses the first surface of the first dielectric layer. The first electroless metal layer is formed at least partially in the first cavity. The first electroless metal layer defines a second interconnect embedded in the first dielectric layer. In some implementations, the substrate further includes a core layer. The core layer includes a first surface and a second surface. The first surface of the core layer is coupled to the second surface of the first dielectric layer. In some implementations, the substrate further includes a second dielectric layer.

    Abstract translation: 一些新颖特征涉及包括第一介电层，第一互连，第一腔和第一无电金属层的衬底。 第一介电层包括第一表面和第二表面。 第一互连是在衬底层的第一表面上。 第一空腔穿过第一介电层的第一表面。 第一无电金属层至少部分地形成在第一腔中。 第一无电金属层限定嵌入在第一介电层中的第二互连。 在一些实施方案中，衬底还包括芯层。 芯层包括第一表面和第二表面。 芯层的第一表面耦合到第一介电层的第二表面。 在一些实施方案中，衬底还包括第二介电层。

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