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    Microfluid-System-Supporting Unit And Production Method Thereof
    212.
    发明申请
    Microfluid-System-Supporting Unit And Production Method Thereof 审中-公开
    微流体系统支持单位及其制作方法

    公开(公告)号：US20110140300A1

    公开(公告)日：2011-06-16

    申请号：US13026875

    申请日：2011-02-14

    Applicant: Kunihiko AKAI ,  Hiroshi KAWAZOE

    Inventor： Kunihiko AKAI ,  Hiroshi KAWAZOE

    IPC: B29C39/10 ,  B29C39/02 ,  B29C39/12

    CPC classification number: B81B3/0067 ,  B01L3/502707 ,  B01L2200/025 ,  B01L2200/12 ,  B01L2300/0838 ,  B01L2300/0874 ,  B81B2201/051 ,  B81B2203/0338 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/249921

    Abstract: The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof.

    Abstract translation: 本发明涉及一种微流体系统支撑单元，其包括形成在基板上的固定层，保护层或固定层，其中至少一个任何形状的中空丝的一部分被放置并固定在固定层中。 因此，即使存在外径不同的多根中空丝或中空丝彼此交叉并且能够抵抗交叉区域中的中空丝的位置偏差，也提供了表面不规则性较低的微流体系支撑单元， 方法。

    Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip
    213.
    发明申请
    Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip 失效
    用于制造微通道芯片，用于模制微通道芯片和微通道芯片的方法

    公开(公告)号：US20110133364A1

    公开(公告)日：2011-06-09

    申请号：US13059494

    申请日：2009-08-17

    Applicant: Kanji Sekihara

    Inventor： Kanji Sekihara

    IPC: B29C45/16

    CPC classification number: B29C45/263 ,  B01L3/502707 ,  B01L2200/10 ,  B01L2200/12 ,  B01L2300/044 ,  B01L2300/12 ,  B29C45/0025 ,  B81B2201/051 ,  B81B2203/0338 ,  B81C1/0046

    Abstract: A die (100) is provided with: a cavity which can contain a molten resin; a micro-structure (102) provided on a molding transfer surface (101) forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (101); and a anti-shrinkage convex section (103) protruding higher than the micro-structure (102) to the cavity side from one surface. A molten resin is applied to the die (100) and the surface of the die is relatively removed in the order of the micro-structure (102) and the anti-shrinkage convex section (103) from a resin substrate (001) formed by solidifying the resin.

    Abstract translation: 模具（100）设置有：可容纳熔融树脂的空腔; 设置在形成所述空腔的成型转印表面（101）上的微结构（102），使得所述精细结构从所述模制转印表面（101）突出到所述空腔侧; 以及从一个表面向空腔侧突出高于微结构（102）的抗收缩凸部（103）。 将熔融树脂施加到模具（100），并且从微结构（102）和抗收缩凸部（103）的顺序相对于模具的表面相对于由 固化树脂。

    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME
    215.
    发明申请
    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME 失效
    降低基板对流与使用其的流体反应装置之间的温度差异的方法

    公开(公告)号：US20110033919A1

    公开(公告)日：2011-02-10

    申请号：US12904557

    申请日：2010-10-14

    Applicant: Kak NAMKOONG ,  Su-hyeon KIM ,  Jin-tae KIM ,  Chin-sung PARK ,  Young-sun LEE

    Inventor： Kak NAMKOONG ,  Su-hyeon KIM ,  Jin-tae KIM ,  Chin-sung PARK ,  Young-sun LEE

    IPC: C12M1/40

    CPC classification number: B81B3/0081 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00873 ,  B01L3/5027 ,  B01L7/5255 ,  B01L2200/14 ,  B01L2200/147 ,  B01L2300/1805 ,  B01L2300/1827 ,  B81B2201/051 ,  F28F21/02 ,  F28F2013/006

    Abstract: A method of reducing a temperature difference between a high-temperature and a low-temperature substrate includes interposing a heat transfer facilitating layer which has a higher thermal conductivity than air and can hold particles between the substrates, and maintaining close contact between the high-temperature substrate, the heat transfer facilitating layer, and the low-temperature substrate, wherein formation of an air layer can be at least substantially prevented between the high-temperature substrate and the heat transfer facilitating layer, and between the low-temperature substrate and the heat transfer facilitating layer. A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.

    Abstract translation: 降低高温和低温基板之间的温度差的方法包括：介于热传导率高于空气的传热促进层，并且可以在基板之间保持颗粒，并且保持高温 基板，传热促进层和低温基板，其中至少可以在高温基板和传热促进层之间以及在低温基板和热量之间基本上防止空气层的形成 转移促进层。 流体反应装置包括容纳流体的微流体反应芯片，加热器和介于微流体反应芯片和加热器之间的传热促进层，传热促进层具有比空气更高的导热性并且可以保持 颗粒，其中可以防止空气层的形成。

    Manufacturing method of a microchemical chip made of a resin
    218.
    发明授权
    Manufacturing method of a microchemical chip made of a resin 有权
    由树脂制成的微量化学芯片的制造方法

    公开(公告)号：US07682541B2

    公开(公告)日：2010-03-23

    申请号：US11103497

    申请日：2005-04-12

    Applicant: Mitsuru Saito ,  Yoshiyuki Ikegami ,  Kenji Obara

    Inventor： Mitsuru Saito ,  Yoshiyuki Ikegami ,  Kenji Obara

    IPC: B29C39/02 ,  B29C33/40

    CPC classification number: B29C39/26 ,  B01L3/502707 ,  B29C33/306 ,  B29C33/3842 ,  B29C33/424 ,  B29C39/006 ,  B29C45/2673 ,  B29C45/372 ,  B29K2033/08 ,  B29K2083/00 ,  B29L2031/756 ,  B81B2201/051 ,  B81B2201/058 ,  B81C99/0085 ,  B81C99/009

    Abstract: A manufacturing method of a microchemical chip made of a resin and having a micro channel, which comprises forming a photoresist film over the surface of one side of a metal support substratum, stacking a photomask for the formation of a channel pattern over the photoresist film, forming a minute-structure photoresist pattern over the metal support substratum by a photofabrication technology as a flat-sheet mold, disposing the flat-sheet mold or unit mold obtained by separating the flat-sheet mold on the bottom of a contour forming frame for resin molding, pouring a resin into the contour forming frame for resin molding and curing the resin to form a resin structure having a micro channel formed by the mold, and attaching the resin structure having a micro channel to a flat sheet to be a lid of the micro channel; and microchemical chips manufactured by this method.

    Abstract translation: 一种由树脂制成并具有微通道的微化学芯片的制造方法，包括在金属支撑基底的一侧的表面上形成光致抗蚀剂膜，在光致抗蚀剂膜上堆叠用于形成沟道图案的光掩模， 通过作为平板模具的光加工技术在金属支撑基底上形成微小结构光致抗蚀剂图案，将通过将平板模具分离而获得的平板模具或单元模具设置在用于树脂的轮廓形成框架的底部上 将树脂浇注到轮廓成形框架中以进行树脂模制和固化树脂，以形成具有由模具形成的微通道的树脂结构，并将具有微通道的树脂结构附着到平板上，以成为 微通道 和通过该方法制造的微量化学芯片。

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