公开(公告)号：EP3355032A1

公开(公告)日：2018-08-01

申请号：EP17153762.4

申请日：2017-01-30

Applicant: Dr. Johannes Heidenhain GmbH

Inventor： RISSING, Lutz ,  TIEMANN, Marc Oliver ,  FRANK, Alexander

IPC: G01D5/20 ,  H01L21/00

CPC classification number: H05K1/165 ,  G01D5/142 ,  G01D5/16 ,  G01D5/20 ,  G01D5/2013 ,  G01D5/24 ,  G01D5/26 ,  H01L21/00 ,  H01R4/023 ,  H01R4/027 ,  H01R4/34 ,  H01R12/63 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: Die Erfindung betrifft einen Sensor zur Positionsmessung eines relativ zum Sensor bewegbaren Bauteils (7), wobei der Sensor eine Leiterplatte (1; 1') und einen Metallkörper (2; 2') aufweist. Die Leiterplatte (1; 1') weist einen ersten Bereich (1.1) auf, in dem ein Detektor (1.12) angeordnet ist und einen zweiten Bereich (1.2), in dem elektronische Bauelemente (1.21) angeordnet sind, welche elektrisch mit dem Detektor (1.12) verbunden sind. Der Metallkörper (2; 2') weist eine erste Lage (2.1) mit einer ersten Fläche (S21) sowie eine zweite Lage (2.2, 2.2') mit einer zweiten Fläche (S22) auf. Der erste Bereich (1.1) der Leiterplatte (1; 1') ist auf der ersten Fläche (S21) befestigt und der zweite Bereich (1.2) der Leiterplatte (1; 1') auf der zweiten Fläche (S22). Die erste Lage (2.1) und die zweite Lage (2.2, 2.2') des Metallkörpers (2; 2') sind zwischen dem ersten Bereich (1.1) und dem zweiten Bereich (1.2) der Leiterplatte (1; 1') angeordnet, so dass der erste Bereich (1.1) in einer ersten Ebene (E11) und der zweite Bereich (1.2) in einer zweiten Ebene (E12) angeordnet sind.

公开(公告)号：EP3216088B1

公开(公告)日：2018-08-01

申请号：EP15786867.0

申请日：2015-10-21

Applicant: Rosenberger Hochfrequenztechnik GmbH & Co. KG

Inventor： SCHMIDT, Christian ,  ZEBHAUSER, Martin

IPC: H01R13/6463 ,  H01R12/51 ,  H01R12/72

CPC classification number: H01R12/716 ,  H01R12/51 ,  H01R12/7082 ,  H01R12/722 ,  H01R13/6463 ,  H05K1/111 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10356 ,  H05K2201/10878

公开(公告)号：EP3326246A1

公开(公告)日：2018-05-30

申请号：EP16745359.6

申请日：2016-07-21

Applicant: Bel Fuse (Macao Commercial Offshore) Limited

Inventor： MAROWSKY, Richard, D. ,  GUTTER, David, H. ,  BELOPOLSKY, Yakov

IPC: H01R13/6466 ,  H01R24/64 ,  H05K1/02 ,  H05K1/11 ,  H01R13/6463 ,  H01R24/28

CPC classification number: H01R13/6466 ,  H01R13/6463 ,  H01R13/665 ,  H01R24/28 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/10295 ,  H05K2201/10356

Abstract: A modular connector plug includes controlled capacitances to compensate for near end cross talk at the connector interface created by interaction of signals having signal frequencies in a data transmission bandwidth. A printed circuit board (PCB) is configured to receive cable pairs, and a connector assembly includes first and fourth plug contacts corresponding to the first cable pair and second and third plug contacts corresponding to the second cable pair. First ends of each contact are connected to the PCB, and second ends extend in parallel with each other and transversely to the PCB length, collectively defining a contact interface proximate the contact end. Each contact has a maximum width at the contact interface, with at least one plug contact having a maximum width greater than the maximum width of another plug contact. Each contact accordingly defines an electrode of a compensating capacitance formed between adjacent pairs of plug contacts.

公开(公告)号：EP3222124A1

公开(公告)日：2017-09-27

申请号：EP15795302.7

申请日：2015-11-05

Applicant: TE Connectivity Corporation

Inventor： SHOCKET, Abraham Louis ,  BRYAN, Lyle Stanley ,  COWAN, John Steven ,  PETERSON, Kevin John

IPC: H05K1/02 ,  H01R12/00 ,  H05K7/20

CPC classification number: H05K1/181 ,  H01R12/515 ,  H05K1/0203 ,  H05K5/0069 ,  H05K7/20854 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10537

Abstract: An electrical assembly (200) configured to be fixed in a housing of an electrical connector includes an electrical package (204) disposed on a substrate (202) and electrically connected to the substrate. The electrical assembly also includes a conductor (211) terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment (218) of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package.

Abstract translation: 被配置成固定在电连接器的外壳中的电组件包括设置在基板上并电连接到基板的电封装。 该电气组件还包括在与电气封装间隔开的位置处终止于衬底的导体，以向衬底提供功率或控制信号中的至少一个。 导体的端接段被热耦合至电封装以接收在电封装处产生的热量并且通过导体散发热量远离电封装。

公开(公告)号：EP3132184A1

公开(公告)日：2017-02-22

申请号：EP15709075.4

申请日：2015-02-27

Applicant: The Sloan Company, Inc. dba Sloanled

Inventor： LIND, Justin ,  FERRIE, Timothy, Drew ,  QUAAL, Bruce

IPC: F21S4/00 ,  F21V23/00 ,  G09F13/04 ,  G09F13/22 ,  F21Y101/00

CPC classification number: F21V23/001 ,  F21S4/10 ,  F21S4/22 ,  F21V21/0808 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F13/0404 ,  G09F2013/222 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10356

Abstract: The invention described herein is directed to different embodiments of a low profile lighting unit (300) that in some embodiments is adapted to conform to the shape of the mounting surface and/or adapted to be adjustable so as to be arranged in different configurations to accommodate various lighting applications.

Abstract translation: 本文描述的本发明涉及低调照明单元（300）的不同实施例，其在一些实施例中适于符合安装表面的形状和/或适于可调节，以便布置成不同的构造以容纳 各种照明应用。

公开(公告)号：EP3128820A2

公开(公告)日：2017-02-08

申请号：EP16182401.6

申请日：2016-08-02

Applicant: Goodrich Corporation

Inventor： ABBOTT, Michael ,  SLANKER, Andrew ,  SYVERSON, Brian ,  REED, Eric Joseph ,  DURKEE, Scott R. ,  WHITE, Alexander

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H01R13/58 ,  H01R12/7076 ,  H01R43/205 ,  H05K1/0257 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/116 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A circuit card (1, 9) is disclosed. The circuit card (1, 9) may have a strain relief aperture (22-1 ... 22-7) and a conductor contact. A conductor (3) may extend through the strain relief aperture (22-1) and connect in electrical continuity with the conductor contact. The circuit card (1, 9) may have a conformal coating, such as poly(p-xylylene) polymer applied. The conformal coating may be applied in layers, and the layers may have different thicknesses.

Abstract translation: 公开了一种电路卡（1,9）。 电路卡（1,9）可具有应变消除孔（22-1 ... 22-7）和导体触点。 导体（3）可以延伸穿过应变消除孔（22-1）并且与导体触点电连续地连接。 电路卡（1,9）可以具有保形涂层，例如所应用的聚（对二甲苯）聚合物。 保形涂层可以分层施加，并且这些层可以具有不同的厚度。

公开(公告)号：EP2993965A1

公开(公告)日：2016-03-09

申请号：EP14192956.2

申请日：2014-11-13

Applicant: LG Display Co., Ltd.

Inventor： Lee, Sunghoon

IPC: H05K1/02

CPC classification number: G06F3/041 ,  G06F2203/04102 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/2009

Abstract: There are provided a flexible printed circuit board having enhanced peeling force and a touch panel including the same. The flexible printed circuit board (FPCB) includes a first bonding portion and a second bonding portion respectively bonded to a first circuit unit and a second circuit unit. The first bonding portion includes a pad corresponding portion corresponding to pads of the first circuit unit and dummy portions outwardly extending from both end portions of the pad corresponding portion. An FPCB wiring formation portion includes FPCB wirings respectively connected to the pads and extending from the first bonding portion to the second bonding portion and concave portions respectively disposed to be adjacent to the dummy portions and having a curved surface.

Abstract translation: 提供了具有增强的剥离力的柔性印刷电路板和包括该柔性印刷电路板的触摸面板。 柔性印刷电路板（FPCB）包括分别接合到第一电路单元和第二电路单元的第一接合部分和第二接合部分。 第一接合部分包括对应于第一电路单元的焊盘的焊盘对应部分和从焊盘对应部分的两个端部向外延伸的虚拟部分。 FPCB布线形成部分包括分别连接到焊盘并且从第一接合部分延伸到第二接合部分的FPCB布线和分别设置成与虚设部分相邻并具有弯曲表面的凹部。

公开(公告)号：EP2987448A1

公开(公告)日：2016-02-24

申请号：EP14784990.5

申请日：2014-04-16

Applicant: Olympus Corporation

Inventor： IGARASHI Takatoshi

IPC: A61B1/00 ,  A61B1/04 ,  G02B23/24 ,  H04N5/225 ,  H04N7/18

CPC classification number: H04N5/2252 ,  A61B1/00124 ,  A61B1/051 ,  G02B23/2476 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N7/18 ,  H04N2005/2255 ,  H05K1/14 ,  H05K1/185 ,  H05K2201/10356

Abstract: An image pickup apparatus 40 includes a laminated substrate 46 on which a plurality of electronic components 55 to 58 configuring a driving circuit of a solid-state image pickup device 44 are mounted and in which a plurality of conductor layers 76 to 78 and a plurality of vias 71 to 75 are formed, electronic component connection lands 61 and 62 provided on a surface of the laminated substrate 46, any one of the plurality of electronic components 55 to 58 being electrically connected to the electronic component connection lands 61 and 62, and a cable connection land 63 provided on the surface of the laminated substrate 46, a plurality of signal cables 48 being electrically connected to the cable connection land 63. At least one of the plurality of electronic components 55 to 58 is embedded in a position superimposed on the electronic component connection lands 61 and 62 or the cable connection land 63 on an inside of the laminated substrate 46.

Abstract translation: 图像拾取装置40包括其上安装有构成固态图像拾取装置44的驱动电路的多个电子部件55至58的层叠基板46，并且其中多个导体层76至78和多个 形成通孔71至75，设置在层压基板46的表面上的电子部件连接焊盘61和62，多个电子部件55至58中的任一个电连接到电子部件连接焊盘61,62，以及 设置在层叠基板46的表面上的电缆连接平台63，多个信号电缆48电连接到电缆连接平台63.多个电子部件55至58中的至少一个嵌入在叠加在 电子部件连接用焊盘61,62或层叠基板46的内侧的电缆连接焊盘63。

公开(公告)号：EP2416631B1

公开(公告)日：2016-02-17

申请号：EP11176666.3

申请日：2011-08-05

Applicant: Indesit Company S.p.A.

Inventor： Lippera, Mario ,  Duri, Sandro

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/14 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10356

公开(公告)号：EP2870837A4

公开(公告)日：2015-07-15

申请号：EP13822473

申请日：2013-07-26

Applicant: HUAWEI TECH CO LTD

Inventor： YU FEI ,  YANG HANG ,  GAO FENG

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/11 ,  H05K1/0245 ,  H05K3/103 ,  H05K3/4644 ,  H05K2201/10356

Abstract: A printed circuit board (PCB) includes a first dielectric layer and a differential cable structure embedded in the dielectric layer. The differential cable structure includes a first inner conductor, a second inner conductor, a dielectric surrounding portions of the first inner conductor and portions of the second inner conductor, and a ground shield surrounding the dielectric.