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    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME
    222.
    发明申请
    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME 有权
    降低基板对流与使用其的流体反应装置之间的温度差异的方法

    公开(公告)号：US20080053647A1

    公开(公告)日：2008-03-06

    申请号：US11689640

    申请日：2007-03-22

    Applicant: Kak Namkoong ,  Su-hyeon Kim ,  Jin-tae Kim ,  Chin-sung Park ,  Young-sun Lee

    Inventor： Kak Namkoong ,  Su-hyeon Kim ,  Jin-tae Kim ,  Chin-sung Park ,  Young-sun Lee

    IPC: F28F7/00

    CPC classification number: B81B3/0081 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00873 ,  B01L3/5027 ,  B01L7/5255 ,  B01L2200/14 ,  B01L2200/147 ,  B01L2300/1805 ,  B01L2300/1827 ,  B81B2201/051 ,  F28F21/02 ,  F28F2013/006

    Abstract: A method of reducing a temperature difference between a high-temperature and a low-temperature substrate includes interposing a heat transfer facilitating layer which has a higher thermal conductivity than air and can hold particles between the substrates, and maintaining close contact between the high-temperature substrate, the heat transfer facilitating layer, and the low-temperature substrate, wherein formation of an air layer can be at least substantially prevented between the high-temperature substrate and the heat transfer facilitating layer, and between the low-temperature substrate and the heat transfer facilitating layer. A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.

    Abstract translation: 降低高温和低温基板之间的温度差的方法包括：介于热传导率高于空气的传热促进层，并且可以在基板之间保持颗粒，并且保持高温 基板，传热促进层和低温基板，其中至少可以在高温基板和传热促进层之间以及在低温基板和热量之间基本上防止空气层的形成 转移促进层。 流体反应装置包括容纳流体的微流体反应芯片，加热器和介于微流体反应芯片和加热器之间的传热促进层，传热促进层具有比空气更高的导热性并且可以保持 颗粒，其中可以防止空气层的形成。

    MICRO ROTARY MACHINE AND METHODS FOR USING SAME
    223.
    发明申请
    MICRO ROTARY MACHINE AND METHODS FOR USING SAME 有权
    微型旋转机及其使用方法

    公开(公告)号：US20080048519A1

    公开(公告)日：2008-02-28

    申请号：US11757331

    申请日：2007-06-01

    Applicant: Harold Stalford

    Inventor： Harold Stalford

    IPC: H02N10/00 ,  F04B9/00

    CPC classification number: H02N10/00 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/034 ,  B81B2201/037 ,  B81B2201/051 ,  H02K7/00 ,  H02N1/002 ,  H02N11/006

    Abstract: A micro rotary machine may include a micro actuator and a micro shaft coupled to the micro actuator. The micro shaft comprises a horizontal shaft and is operable to be rotated by the micro actuator. A micro tool is coupled to the micro shaft and is operable to perform work in response to motion of the micro shaft.

    Abstract translation: 微型旋转机器可以包括微型致动器和耦合到微型致动器的微型轴。 微型轴包括水平轴，并且可由微型致动器旋转。 微型工具联接到微型轴，并且可操作以响应于微型轴的运动而执行工作。

    Polymerization welding and application to microfluidics
    229.
    发明申请
    Polymerization welding and application to microfluidics 审中-公开
    聚合焊接和应用于微流体

    公开(公告)号：US20050100712A1

    公开(公告)日：2005-05-12

    申请号：US10712808

    申请日：2003-11-12

    Applicant: Blake Simmons ,  Robert Crocker ,  Paul Dentinger ,  Marion Hunter ,  Kamlesh Patel ,  Jonathan Sala

    Inventor： Blake Simmons ,  Robert Crocker ,  Paul Dentinger ,  Marion Hunter ,  Kamlesh Patel ,  Jonathan Sala

    IPC: B29C65/00 ,  C08J5/12 ,  B32B31/26

    CPC classification number: B29C65/52 ,  B29C65/006 ,  B29C65/4815 ,  B29C65/4825 ,  B29C65/483 ,  B29C65/4835 ,  B29C65/484 ,  B29C65/485 ,  B29C65/521 ,  B29C65/523 ,  B29C65/526 ,  B29C66/112 ,  B29C66/1122 ,  B29C66/114 ,  B29C66/45 ,  B29C66/452 ,  B29C66/5346 ,  B29C66/54 ,  B29C66/71 ,  B29L2031/756 ,  B81B2201/051 ,  B81C3/001 ,  B81C2203/038 ,  C08J5/128 ,  Y10T428/24612 ,  B29K2065/00 ,  B29K2079/085 ,  B29K2071/00

    Abstract: Methods and materials are described for the joining of plastics and other materials wherein polymerizable substances are diffused into the material to form a surface diffusion zone adjacent to the surface of the plastic workpiece to be joined. The surfaces are brought into contact and the polymerization reactions in the surface diffusion zone are initiated, creating thereby a strong bond across the contacting surfaces. High-performance engineered plastics such as polyetherimides, polyphenylenes, and polyether-ether-ketones are among the materials that are advantageously joined by this technique. Polymerizable substances including styrene and divinylbenzene are shown to give good bonds. Such joining methods can bond dissimilar materials difficult or impossible to join by other techniques. The surfaces to be joined are dry prior to initiation of the polymerization reaction, permitting repositioning and realignment of the surfaces as often as desired before joining. The present joining techniques do not clog or interfere with the structure of microfeatures on the surface of the workpieces to be joined, making this joining techniques especially advantageous for the fabrication of microfluidic devices. Such devices fabricated from high-performance engineered plastic joined by the present bonding techniques are shown to be capable of routine operation at high pressures and to withstand high-pressure cycling without damage.

    Abstract translation: 描述了用于连接塑料和其它材料的方法和材料，其中可聚合物质扩散到材料中以形成邻近待连接的塑料工件的表面的表面扩散区。 使表面接触，并且开始表面扩散区中的聚合反应，从而产生穿过接触表面的强结合。 通过这种技术有利地连接的材料之中的高性能工程塑料如聚醚酰亚胺，聚苯醚和聚醚 - 醚 - 酮。 包括苯乙烯和二乙烯基苯在内的可聚合物质显示出良好的键合。 这种接合方法可以通过其他技术使不相似的材料难以或不可能接合。 在开始聚合反应之前，待连接的表面是干的，允许在接合之前经常按需要重新定位和重新排列表面。 本接合技术不会堵塞或干扰要接合的工件的表面上的微特征的结构，使得该接合技术对于微流体装置的制造特别有利。 由通过本发明的接合技术连接的高性能工程塑料制造的这种装置被证明能够在高压下常规操作并且承受高压循环而不损坏。

    Method for producing microcomponents
    230.
    发明授权
    Method for producing microcomponents 失效
    生产微量元件的方法

    公开(公告)号：US06736983B1

    公开(公告)日：2004-05-18

    申请号：US09979318

    申请日：2002-02-04

    Applicant: Andreas Thies ,  Konrad Cramer ,  Heinrich Meyer

    Inventor： Andreas Thies ,  Konrad Cramer ,  Heinrich Meyer

    IPC: C23F100

    CPC classification number: F28F3/048 ,  B01J19/0093 ,  B01J2219/00317 ,  B01J2219/00783 ,  B01J2219/00835 ,  B01J2219/00873 ,  B32B15/01 ,  B81B2201/0214 ,  B81B2201/051 ,  B81B2203/033 ,  B81C1/00206 ,  C40B60/14 ,  F28F2260/02 ,  G03F7/00 ,  H01M8/0631 ,  Y02P70/56

    Abstract: Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The micro-components are intended to be suitable for a large number of different applications in chemical reaction technology, for heat exchanging, for mixing substances or for evaporating liquids. In particular, the micro-components are intended to have no problems in respect of leaks in the flow channels. The method has the following method steps: A. producing the at least one individual layer by: a. producing a first metal layer or a metal foil 1; b. forming the inner structures in and/or on the first metal layer or metal foil 1 by suitable etching methods and/or metal deposition methods; and c. forming the functional layers 3 solely on the walls of the inner structures and thereafter B. stacking up and joining the one individual layer to a segment terminating the inner structures, or a plurality of individual layers to one another and to the terminating segment.

    Abstract translation: 根据该方法制备具有至少一个单独层的微组件，该方法在内部结构的壁上（例如流动通道）上具有功能层3。 微型组件旨在适用于化学反应技术中的大量不同应用，用于热交换，混合物质或蒸发液体。 特别地，微组件意在在流动通道中泄漏方面没有问题。 该方法具有以下方法步骤：A.通过以下方式产生至少一个单独的层：a。 制造第一金属层或金属箔1; b。 通过合适的蚀刻方法和/或金属沉积方法在第一金属层或金属箔1上形成内部结构和/或形成内部结构; 和c。 仅在内部结构的壁上形成功能层3，之后B.将一个单独层叠合并连接到终止内部结构的区段，或者将多个单独的层彼此堆叠并连接到终止区段。

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