公开(公告)号：US20070065595A1

公开(公告)日：2007-03-22

申请号：US11601780

申请日：2006-11-20

Applicant: Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: C23C14/02

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。

公开(公告)号：US20070039828A1

公开(公告)日：2007-02-22

申请号：US11506586

申请日：2006-08-18

Applicant: Adam Cohen ,  Michael Lockhard ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockhard ,  Dennis Smalley

IPC: C25D5/02

CPC classification number: C25D1/003 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/10 ,  C25D5/022 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647 ,  Y10T156/10

Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

Abstract translation: 本发明的各种实施例涉及使用电化学制造技术形成中尺度或微尺寸器件，其中结构由多个层形成为打开的结构，其可折叠或以其他方式组合以形成所需构造的结构。 每个层由至少一种结构材料和至少一种牺牲材料形成。 开放结构的初始形成可以促进牺牲材料的释放，形成较少层以完成结构的能力，将附加材料定位到结构中的能力，对结构打开时暴露的区域执行附加处理操作的能力和/ 或形成完全封装和可能中空结构的能力。

公开(公告)号：US20070015179A1

公开(公告)日：2007-01-18

申请号：US11411528

申请日：2006-04-26

Applicant: Catherine Klapperich ,  Arpita Bhattacharyya

Inventor： Catherine Klapperich ,  Arpita Bhattacharyya

IPC: C12Q1/68 ,  C12P19/34 ,  C12M3/00

CPC classification number: B01J20/28026 ,  B01J20/28042 ,  B01L3/5023 ,  B01L3/502707 ,  B01L2200/0631 ,  B01L2200/10 ,  B01L2200/12 ,  B81B2201/051 ,  B81B2203/0338 ,  B81C1/00206 ,  B81C2201/0197 ,  C12Q1/6813 ,  G01N1/405

Abstract: The present invention is directed to methods of manufacture of microfluidic chip such as a plastic microfluidic chips, which has channels packed with polymer-embedded particles and uses thereof. The chip of the present invention is designed for application of an untreated biological sample on the chip thus allowing isolation, purification and detection of biomolecules, such as nucleic acids, proteins or peptides in one step. The invention also provides a microfluidic chip for combined isolation, purification and detection of biomolecules thus providing a complete Lab-on-a-Chip analysis system for biomolecules such as nucleic acids and proteins. The chips of the invention can be adapted to perform highly specific immunoassays and diagnostic test, for example, for diagnosis of infectious agents, such as bacteria, viruses or parasites.

Abstract translation: 本发明涉及微流控芯片的制造方法，例如具有填充有聚合物嵌入颗粒的通道的塑料微流体芯片及其用途。 本发明的芯片设计用于在芯片上施加未处理的生物样品，从而允许在一个步骤中分离，纯化和检测生物分子，例如核酸，蛋白质或肽。 本发明还提供用于组合分离，纯化和检测生物分子的微流体芯片，从而为生物分子例如核酸和蛋白质提供完整的实验室在芯片分析系统。 本发明的芯片可以适用于进行高度特异性的免疫测定和诊断测试，例如用于诊断感染因子如细菌，病毒或寄生虫。

公开(公告)号：US20060134820A1

公开(公告)日：2006-06-22

申请号：US11102982

申请日：2005-04-11

Applicant: Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

Inventor： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

IPC: H01L21/00 ,  H01L21/44

CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

公开(公告)号：US20060134819A1

公开(公告)日：2006-06-22

申请号：US11019912

申请日：2004-12-21

Applicant: Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian

Inventor： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian

IPC: H01L21/00 ,  H01L21/302

CPC classification number: B81C1/00666 ,  B81C2201/0109 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

公开(公告)号：US20050202180A1

公开(公告)日：2005-09-15

申请号：US11029165

申请日：2005-01-03

Applicant: Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

Inventor： Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

IPC: B05D1/38 ,  C08K3/00 ,  C25D3/30 ,  C25D3/38 ,  C25D3/48 ,  C25D5/02 ,  C25D5/10 ,  C25D21/12 ,  H01L21/288 ,  H01L21/301 ,  H01L21/302 ,  H01L21/4763 ,  H01L21/768

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and/or pre-machining depositions to within a small increment of desired surface level (e.g. using lapping or a rough cutting operation) and then using diamond fly cutting to complete he process, and/or forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.

Abstract translation: 公开了用于形成单层和多层中尺度和微结构的电化学制造方法，其包括使用金刚石加工（例如飞切或车削）来平坦化层。 一些实施例集中于可用于电化学制造的牺牲和结构材料的系统，并且可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn， 和Au和Sn-Pb），其中第一材料或材料是结构材料，第二材料是牺牲材料）。 一些实施例着重于在使用金刚石加工以平面化使用难以加工的材料进行电化学制造的结构（例如，通过沉积难以机械材料选择性且潜在地具有少量多余电镀厚度和/或预加工沉积 到所需表面水平的小增量（例如使用研磨或粗切割操作），然后使用金刚石飞切切割来完成其加工，和/或从硬质材料的薄壁区域形成结构或部分结构 而不是结构材料的宽固体区域。

公开(公告)号：US20030234179A1

公开(公告)日：2003-12-25

申请号：US10434315

申请日：2003-05-07

Applicant: MEMGen Corporation

Inventor： Christopher A. Bang

IPC: C25D005/02 ,  C25D001/10

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFABnull formation process), and typically contain features having resolutions within the 1 to 100 nullm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：US06572742B1

公开(公告)日：2003-06-03

申请号：US09488142

申请日：2000-01-20

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D1706

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

公开(公告)号：US06455227B1

公开(公告)日：2002-09-24

申请号：US09473655

申请日：1999-12-29

Applicant: Masaki Hara

Inventor： Masaki Hara

IPC: G03F726

CPC classification number: G03F7/2022 ,  B81C1/00126 ,  B81C2201/0108 ,  B81C2201/0152 ,  B81C2201/0197 ,  G03F7/095 ,  G03F7/11

Abstract: A multilayer resist structure is irradiated more than one time with ultraviolet rays through a photomask. Each time the structure is irradiated, ultraviolet rays of a little greater quantity of light than those used in the last irradiation are used. Also, with each exposure, a photomask which has a larger lightproof section than that used in the last irradiation is used. Next, the multilayer resist structure is developed, and the exposed area of each photoresist is removed with a developing solution. Also, in amorphous silicon layers, the areas under the removed photoresist are easily removed with the developing solution. A resist structure having desired steps is thus completed. Using the resist structure, a three-dimensional microstructure can be formed.

Abstract translation: 通过光掩模用紫外线照射多层抗蚀剂结构多次。 每次照射结构时，使用比上次照射中使用的光量稍大的紫外线。 此外，对于每次曝光，使用具有比在最后照射中使用的遮光部分更大的遮光部分的光掩模。 接下来，显影多层抗蚀剂结构体，用显影液去除各光致抗蚀剂的露出面积。 此外，在非晶硅层中，去除的光致抗蚀剂下的区域容易用显影液除去。 因此完成了具有所需步骤的抗蚀剂结构。 使用抗蚀剂结构，可以形成三维微结构。

公开(公告)号：US20010023010A1

公开(公告)日：2001-09-20

申请号：US09791634

申请日：2001-02-26

Applicant: Fuji Xerox Co. Ltd.

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: B44C001/22 ,  C03C015/00 ,  B32B001/00

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.