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    Method of imprinting shadow mask nanostructures for display pixel segregation
    221.
    发明授权
    Method of imprinting shadow mask nanostructures for display pixel segregation 失效
    印刷阴影纳米结构用于显示像素分离的方法

    公开(公告)号：US07615179B2

    公开(公告)日：2009-11-10

    申请号：US11089101

    申请日：2005-03-24

    Applicant: Jarrett Dumond ,  Hong Yee Low

    Inventor： Jarrett Dumond ,  Hong Yee Low

    IPC: A61M25/00 ,  B28B11/08 ,  B29C59/02 ,  C03C15/00 ,  H01J29/80

    CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

    Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials, particularly for pixel segregation in OLED-based displays. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

    Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 特别是用于基于OLED的显示器中的像素分离。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

    Process for Producing 3-Dimensional Mold, Process for Producing Microfabrication Product, Process for Producing Micropattern Molding, 3-Dimensional Mold, Microfabrication Product, Micropattern Molding and Optical Device
    222.
    发明申请
    Process for Producing 3-Dimensional Mold, Process for Producing Microfabrication Product, Process for Producing Micropattern Molding, 3-Dimensional Mold, Microfabrication Product, Micropattern Molding and Optical Device 审中-公开
    三维模具生产工艺，微加工产品生产工艺，微型模具生产工艺，三维模具，微加工产品，微型模具成型及光学装置

    公开(公告)号：US20090176060A1

    公开(公告)日：2009-07-09

    申请号：US11991477

    申请日：2006-09-08

    Applicant: Jun Taniguchi

    Inventor： Jun Taniguchi

    IPC: G03F7/20 ,  B29D11/00 ,  B32B3/00

    CPC classification number: G03F7/36 ,  B29C33/3842 ,  B29C33/424 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G02B5/1847 ,  G03F7/0002 ,  G03F7/0757 ,  Y10T428/24479

    Abstract: A process for producing a 3-dimensional mold, including irradiating a resist layer of a processing object having the resist layer made of an organopolysiloxane on a substrate with an electron beam, and developing, by thermal desorption treatment, the resist layer after the irradiation with an electron beam to form protrusions and depressions in the resist layer; a process for producing a microfabrication product by using the 3-dimensional mold; a process for producing a micropattern molding by using the 3-dimensional mold or the microfabrication product; and a 3-dimensional mold, a microfabrication product and a micropattern molding which are finely formed by these production processes, as well as an optical device.

    Abstract translation: 一种三维模具的制造方法，其特征在于，在电子束的基板上照射具有由有机聚硅氧烷构成的抗蚀剂层的加工对象的抗蚀剂层，并且通过热解吸附处理使照射后的抗蚀剂层照射 电子束在抗蚀剂层中形成突起和凹陷; 使用该三维模具生产微细加工产品的方法; 通过使用三维模具或微细加工产品来生产微图案模制品的方法; 以及通过这些制造方法精细地形成的3维模具，微细加工产品和微图案模塑件以及光学装置。

    Method of forming structured sintered articles
    224.
    发明申请
    Method of forming structured sintered articles 失效
    形成结构烧结制品的方法

    公开(公告)号：US20090102101A1

    公开(公告)日：2009-04-23

    申请号：US11975414

    申请日：2007-10-19

    Applicant: Diane Kimberlie Guilfoyle ,  Paul John Shustack ,  Lung-Ming Wu

    Inventor： Diane Kimberlie Guilfoyle ,  Paul John Shustack ,  Lung-Ming Wu

    IPC: B29C35/08

    CPC classification number: C03C17/28 ,  B81B2201/058 ,  B81C1/00071 ,  B81C2201/034 ,  C03B19/06 ,  C03C11/00 ,  C03C17/04 ,  C03C17/324 ,  C03C23/0005

    Abstract: Disclosed is a method of forming a structured sintered article including providing a mixture comprising a sinterable particulate material and a binder, the binder comprising, as a function of total resin content of the binder, at least 50% by weight of a thermoplastic binder material and at least 5% by weight of a radiation-curable binder material; shaping the mixture with a mold to form a structure; setting the structure by cooling the structure or by allowing the structure to cool; separating the structure from the mold; irradiating the structure so as to at least partially cure the radiation-curable binder material, and debinding and sintering the structure so as to form a structured sintered article. Shaping may include forming a structure having one or more open channels, and sintering may include sintering in together in contact with at least one additional structure so as to cover or enclose the channels.

    Abstract translation: 公开了一种形成结构化烧结制品的方法，包括提供包含可烧结颗粒材料和粘合剂的混合物，所述粘合剂包含作为粘合剂的总树脂含量的函数，至少50重量％的热塑性粘合剂材料和 至少5重量％的可辐射固化粘合剂材料; 用模具成型混合物以形成结构; 通过冷却结构或通过使结构冷却来设定结构; 将结构与模具分离; 照射该结构以至少部分地固化可辐射固化的粘合剂材料，以及脱结和烧结该结构以便形成结构化的烧结制品。 成形可以包括形成具有一个或多个开放通道的结构，并且烧结可以包括与至少一个附加结构接触在一起的烧结以覆盖或封闭通道。

    Method for selectively anchoring large numbers of nanoscale structures
    225.
    发明申请
    Method for selectively anchoring large numbers of nanoscale structures 有权
    选择性地锚定大量纳米尺度结构的方法

    公开(公告)号：US20080145616A1

    公开(公告)日：2008-06-19

    申请号：US11827169

    申请日：2007-07-10

    Applicant: Morteza Gharib ,  Derek Rinderknecht ,  Elijah Sansom

    Inventor： Morteza Gharib ,  Derek Rinderknecht ,  Elijah Sansom

    IPC: B32B3/00 ,  B29C65/00

    CPC classification number: B29C70/64 ,  B29K2105/162 ,  B81C3/008 ,  B81C2201/034 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/18 ,  C01B2202/08 ,  Y10S977/742 ,  Y10S977/753 ,  Y10T156/109 ,  Y10T428/24479

    Abstract: A method is provided for creating composites by combining pre-fabricated nanoscale structures (nanostructures) and other materials in which the nanostructures are anchored. This method results in anchored nanostructures with their base held and encased within the anchoring material to a specified depth and with a specified length of protrusion of the nanostructures from the anchoring material. This represents a major advance over previous methods of creating composites containing nanostructures which were limited to fully embedded nanostructures or, at best, very limited and uncontrolled protrusion of nanostructures. In summary, the current method involves bringing nanostructures and anchoring materials into physical contact in a controlled fashion and optionally conducting a treatment step to complete the anchoring process.

    Abstract translation: 提供了一种通过组合预制纳米尺度结构（纳米结构）和其中纳米结构被锚定的其它材料来产生复合材料的方法。 该方法导致锚定的纳米结构，其基部保持并且被包裹在锚固材料内到达指定的深度并且具有来自锚定材料的纳米结构的特定长度的突出。 这代表了先前创建含有纳米结构的复合材料的方法的重大进步，这些纳米结构限于完全嵌入的纳米结构，或者至多是非常有限的和不受控制的纳米结构突起。 总之，目前的方法涉及使纳米结构和锚定材料以受控的方式物理接触，并且可选地进行处理步骤以完成锚定过程。

    Fine metal structure, process for producing the same, fine metal mold and device
    229.
    发明申请
    Fine metal structure, process for producing the same, fine metal mold and device 审中-公开
    精细金属结构，制造方法，精细金属模具及装置

    公开(公告)号：US20070148653A1

    公开(公告)日：2007-06-28

    申请号：US10584139

    申请日：2004-12-21

    Applicant: Hiroshi Yoshida

    Inventor： Hiroshi Yoshida

    IPC: C12Q1/68 ,  B05D3/04 ,  B32B3/30 ,  G01N33/53 ,  C12M3/00 ,  B32B15/02

    CPC classification number: B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

    Abstract: A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

    Abstract translation: 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

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