公开(公告)号：US08383957B2

公开(公告)日：2013-02-26

申请号：US12875156

申请日：2010-09-03

Applicant: Shou-Kuo Hsu ,  Yung-Chieh Chen ,  Hsien-Chuan Liang ,  Wen-Laing Tseng ,  Shen-Chun Li ,  Chia-Nan Pai

Inventor： Shou-Kuo Hsu ,  Yung-Chieh Chen ,  Hsien-Chuan Liang ,  Wen-Laing Tseng ,  Shen-Chun Li ,  Chia-Nan Pai

IPC: H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/115 ,  H05K2201/09836 ,  Y10T428/24917

Abstract: A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle θ, the angle θ is less than cos−1[(Lv2−Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.

Abstract translation: 印刷电路板（PCB）包括两层，两条信号传输路径和一条垂直互连接口（via）。 信号传输迹线分别布置在层上。 信号传输迹线通过通孔彼此电连接。 具有垂直线的通孔的中心线形成锐角和角度;角度和角度; 小于cos-1 [（Lv2-Lt2）/（Lv2 + Lt2）]。 其中Lt是以单位长度丢失两个信号传输迹线，并且Lv是单位长度中的通孔的损失。

公开(公告)号：US08373194B2

公开(公告)日：2013-02-12

申请号：US13000042

申请日：2009-06-23

Applicant: Marcus Johannes Gerardus Elzinga

Inventor： Marcus Johannes Gerardus Elzinga

IPC: H01L33/36 ,  H01L21/00

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：US20120273258A1

公开(公告)日：2012-11-01

申请号：US13156359

申请日：2011-06-09

Applicant: YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN ,  DAN-CHEN WU

Inventor： YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN ,  DAN-CHEN WU

IPC: H05K1/09

CPC classification number: H05K1/0251 ,  H05K1/0245 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09836

Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.

Abstract translation: 印刷电路板依次包括第一信号层，第一参考层，第二信号层和第三信号层，并且包括第一倾斜通孔和第二倾斜通孔。 第一信号层包括并行的第一传输线和第二传输线。 第一和第二传输线彼此耦合并协同地构成具有边缘耦合结构的第一差分对。 第二信号层包括第三传输线。 第三信号层包括与第三传输线并联并与第三传输线耦合的第四传输线。 第三和第四传输线协作地构成具有宽边耦合结构的第二差分对。 第一倾斜地倾斜地在第一传输线和第三传输线之间互连。 第二倾斜地倾斜地在第二传输线和第四传输线之间互连。

公开(公告)号：US20120205148A1

公开(公告)日：2012-08-16

申请号：US13452109

申请日：2012-04-20

Applicant: Satoshi YAMAMOTO ,  Hiroyuki HIRANO ,  Takanao SUZUKI

Inventor： Satoshi YAMAMOTO ,  Hiroyuki HIRANO ,  Takanao SUZUKI

IPC: H05K1/18 ,  H05K3/06

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/473 ,  H01L23/49816 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/1461 ,  H05K1/113 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10545 ,  H01L2924/00

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.

公开(公告)号：US20120048610A1

公开(公告)日：2012-03-01

申请号：US12875156

申请日：2010-09-03

Applicant: SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  HSIEN-CHUAN LIANG ,  WEN-LAING TSENG ,  SHEN-CHUN LI ,  CHIA-NAN PAI

Inventor： SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  HSIEN-CHUAN LIANG ,  WEN-LAING TSENG ,  SHEN-CHUN LI ,  CHIA-NAN PAI

IPC: H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/115 ,  H05K2201/09836 ,  Y10T428/24917

Abstract: A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle θ, the angle θ is less than cos−1[(Lv2−Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.

Abstract translation: 印刷电路板（PCB）包括两层，两条信号传输路径和一条垂直互连接口（via）。 信号传输迹线分别布置在层上。 信号传输迹线通过通孔彼此电连接。 具有垂直线的通孔的中心线形成锐角和角度;角度和角度; 小于cos-1 [（Lv2-Lt2）/（Lv2 + Lt2）]。 其中Lt是以单位长度丢失两个信号传输迹线，并且Lv是单位长度中的通孔的损失。

公开(公告)号：US20120039055A1

公开(公告)日：2012-02-16

申请号：US13283185

申请日：2011-10-27

Applicant: Satoshi YAMAMOTO ,  Hirokazu HASHIMOTO

Inventor： Satoshi YAMAMOTO ,  Hirokazu HASHIMOTO

IPC: H05K7/02 ,  H05K3/00

CPC classification number: H05K1/181 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/09836 ,  H05K2201/10545 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion.

Abstract translation: 提供一种装置安装结构，其包括：内插基板，包括基板和多个通孔互连; 第一装置，其包括布置成面对基板的第一主表面的多个电极; 以及第二装置，其包括多个电极，其布置与第一装置的布置不同，其中电极布置成面对基板的第二主表面。 每个通孔互连包括设置在与第一器件的电极对应的第一主表面上的位置处的第一导电部分和设置在第二主表面上对应于第二器件的电极的位置处的第二导电部分 。 第一装置的每个电极与第一导电部分电连接。 第二装置的每个电极与第二导电部分电连接。

公开(公告)号：US08101865B2

公开(公告)日：2012-01-24

申请号：US12641430

申请日：2009-12-18

Applicant: Tomoyuki Ikeda

Inventor： Tomoyuki Ikeda

IPC: H05K1/03

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

公开(公告)号：US20110056740A1

公开(公告)日：2011-03-10

申请号：US12875644

申请日：2010-09-03

Applicant: Takamasa Takano

Inventor： Takamasa Takano

IPC: H05K1/11 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15786 ,  H01L2924/1579 ,  H05K1/113 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09436 ,  H05K2201/09581 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/1178 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49165 ,  H01L2224/05647 ,  H01L2924/01024 ,  H01L2924/01079

Abstract: A through-hole electrode substrate includes a substrate including a plurality of through-holes, a plurality of through-hole electrodes arranged within each of the plurality of through-holes, and a first insulation layer arranged on one surface of the substrate, wherein the first insulation layer includes a plurality of first openings which expose each of the plurality of through-holes, the plurality of through-holes includes a leaning through-hole leaning from one surface to the other surface of the substrate, and each of the plurality of first openings is arranged to match an open position of the leaning through-hole.

Abstract translation: 通孔电极基板包括具有多个通孔的基板，配置在多个贯通孔的每一个内的多个通孔电极以及设置在基板的一个面上的第一绝缘层， 第一绝缘层包括暴露多个通孔中的每一个的多个第一开口，多个通孔包括从衬底的一个表面到另一个表面倾斜的倾斜通孔，并且多个 布置第一开口以匹配倾斜通孔的打开位置。

公开(公告)号：US07888599B2

公开(公告)日：2011-02-15

申请号：US12203081

申请日：2008-09-02

Applicant: Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

Inventor： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

IPC: H05K1/00

CPC classification number: H05K1/162 ,  H05K3/0047 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09645 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.

Abstract translation: 公开了一种包括嵌入式电容器的PCB及其制造方法。 长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。

公开(公告)号：US07786390B2

公开(公告)日：2010-08-31

申请号：US12115286

申请日：2008-05-05

Applicant: Tomoyuki Ikeda

Inventor： Tomoyuki Ikeda

IPC: H05K1/03

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。