公开(公告)号：EP2331727A2

公开(公告)日：2011-06-15

申请号：EP09787552.0

申请日：2009-09-01

Applicant: Ramot at Tel-Aviv University Ltd

Inventor： MARKOVICH, Gil ,  AZULAI, Daniel ,  KRICHEVSKI, Olga

IPC: C23C18/14 ,  C23C18/16 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/48 ,  H05K3/18

CPC classification number: H05K1/09 ,  C23C18/14 ,  C23C18/166 ,  C23C18/1667 ,  C23C18/1676 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/48 ,  H01B1/02 ,  H01L29/786 ,  H05K1/0274 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125

Abstract: A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

公开(公告)号：EP1634342B1

公开(公告)日：2011-06-15

申请号：EP04821363.1

申请日：2004-02-17

Applicant: MacDermid, Incorporated

Inventor： CULLEN, Donald, P.

IPC: H01L51/00 ,  H05K3/02

CPC classification number: H05K3/02 ,  B82Y10/00 ,  H01L51/0015 ,  H01L51/0021 ,  H01L51/0048 ,  H05K1/0373 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1142 ,  Y10S977/932

Abstract: An improved method of fabricating an electronic interconnect device using direct imaging of dielectric composite material by the inclusion of a conducting material in the composite material that becomes non-conducting through exposure to electromagnetic radiation. The conducting material generally comprises single-wall carbon nanotubes.

公开(公告)号：EP2174910A1

公开(公告)日：2010-04-14

申请号：EP09172609.1

申请日：2009-10-09

Applicant: Exaenc Corp.

Inventor： Lee, Tack-Soo ,  Kang, Seung-Kyung ,  Kim, Chul-Ki

IPC: C01B31/02 ,  H01B1/18 ,  H05K1/09

CPC classification number: H05K1/167 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/174 ,  C01B2202/02 ,  C01B2202/06 ,  C01B2202/28 ,  H01B1/24 ,  H01C7/005 ,  H01C17/0652 ,  H01C17/06586 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0323

Abstract: The present inventive concept relates to a high conductive paste composite which can minimally undergo effects of a negative temperature resistance coefficient (e.g., heat radiation effect 5 to 10 times larger than that of copper or aluminum, high field emission effect, black body radiation, etc.) that the carbon nano tube has in the case of products using the carbon nano tube (MWNT or SWNT), which can solve problems (negative temperature resistance coefficient and high resistance) of a heating part (conductive carbon paste) that converts electric energy of a heating body into thermal energy.

Abstract translation: 本发明构思涉及一种能够最低限度地承受负温度系数（例如，比铜或铝的热辐射效应大5至10倍，高场发射效应，黑体辐射等）的高导电性糊剂复合物 ），碳纳米管在使用碳纳米管（MWNT或SWNT）的产品的情况下，可以解决转换电能的加热部件（导电性碳糊）的问题（负温度系数和高电阻） 的加热体变成热能。

公开(公告)号：EP1962349A3

公开(公告)日：2010-04-07

申请号：EP08103198.1

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolf, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地说，导电层包括纳米线网络，纳米线网络可嵌入基体中并且还包含一种或多种腐蚀抑制剂。 导电层是光学透明且柔韧的。 它可以被涂覆或层压到各种基材上，包括柔性和刚性基材。

公开(公告)号：EP2151830A1

公开(公告)日：2010-02-10

申请号：EP08162124.5

申请日：2008-08-08

Applicant: pp-mid GmbH

Inventor： Putsch, Peter

IPC: H01B1/24

CPC classification number: C08J7/08 ,  B82Y10/00 ,  C08J7/123 ,  H01B1/24 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/026 ,  H05K2203/107 ,  H05K2203/1105

Abstract: Die vorliegende Erfindung betrifft ein Verfahren zur Erzeugung leitfähiger Strukturen auf der Oberfläche von nicht oder nur gering leitfähigen Polymerformkörpern, umfassend die folgenden Schritte:
a) Bereitstellen eines Polymerformkörpers aus mindestens einer Polymerphase, die Carbon Nanotubes (CNT) enthält;
b) thermische Behandlung mindestens einer Oberfläche des Polymerformkörpers zur Erzeugung der leitfähigen Strukturen auf der Oberfläche, wobei die thermische Behandlung ein Erhitzen auf eine Temperatur umfasst, die mindestens der Schmelztemperatur der mindestens einen Polymerphase entspricht.
Des Weiteren betrifft die Erfindung einen Polymerformkörper, umfassend mindestens eine Polymerphase und zwischen 0,01 und 10 Gew.-% Carbon Nanotubes (CNT), bezogen auf die Polymerphase/n, wobei der Polymerformkörper auf der Oberfläche elektrisch leitfähige Strukturen aufweist, wobei die Konzentration der CNT in den Bereichen der elektrisch leitfähigen Oberflächenstrukturen höher ist als in den nicht elektrisch leitfähigen Oberflächenbereichen.

Abstract translation: 产生的无或仅略微导电性高分子成型体的表面上的导电结构，包括：（A）由至少一种聚合物相含有碳纳米管提供聚合物成型体; 和（b）热处理所述聚合物成型体的至少一个表面，以产生聚合物成型体，其中，所述热处理包括加热到一个温度，该温度至少对应于在的熔融温度的表面上的导电结构 至少一个聚合物相。 一个独立的claimsoft包含一种聚合物成型体，其包括具有碳纳米管，其中所述聚合物模制的表面上体表现出导电或导热结构的至少一个聚合物相，和碳纳米管在导电表面结构的部分中的浓度 比在非导电性表面部分更高。

公开(公告)号：EP1976351A2

公开(公告)日：2008-10-01

申请号：EP08152161.9

申请日：2008-02-29

Applicant: Fujitsu Ltd.

Inventor： Nihei, Mizuhisa ,  Sato, Shintaro ,  Kondo, Daiyu ,  Awano, Yuji

IPC: H05K3/14

CPC classification number: B82Y10/00 ,  H01L21/76879 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0293 ,  H05K1/09 ,  H05K3/146 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/173 ,  Y10T29/49169 ,  Y10T29/49194 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.

Abstract translation: 通过将多个CNT从接触块的相对表面朝向相互相对的表面生长并且通过使CNT彼此相交以彼此电连接而形成CNT束。 随后，用金属材料填充电连接的CNT束的间隙，从而形成CNT束和金属材料的复合状态的布线。

公开(公告)号：EP1962349A2

公开(公告)日：2008-08-27

申请号：EP08103198.1

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolf, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

公开(公告)号：EP1922759A2

公开(公告)日：2008-05-21

申请号：EP06801576.7

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： ALDEN, Jonathan, S. ,  DAI, Haixia ,  KNAPP, Michael, R. ,  NA, Shuo ,  PAKBAZ, Hash ,  PSCHENITZKA, Florian ,  QUAN, Xina ,  SPAID, Michael, A., ,  WINOTO, Adrian ,  WOLK, Jeffrey

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1333 ,  G02F1/1335

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

公开(公告)号：EP3393218A1

公开(公告)日：2018-10-24

申请号：EP17167486.4

申请日：2017-04-21

Applicant: C.R.F. Società Consortile per Azioni

Inventor： VECA, Antonino Domenico ,  CHIAPPERO, Paolo ,  DALMASSO, Francesca ,  LAMBERTINI, Vito Guido

IPC: H05K3/10 ,  H05K1/03 ,  B60G17/019 ,  G01L1/18

CPC classification number: B60G17/01941 ,  B60G17/016 ,  B60G17/019 ,  B60G2204/11 ,  B60G2204/112 ,  B60G2204/116 ,  B60G2204/41 ,  B60G2206/73 ,  B60G2400/60 ,  B60G2401/10 ,  B60G2401/26 ,  B60G2600/02 ,  B60G2600/182 ,  G01L1/18 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An elastic support (1, 2) is described here for on-board suspension systems (S) of a motor-vehicle. The support comprises at least one body (C) formed of polymeric elastomeric material supplemented with carbon-based nanofillers, wherein an outer surface is provided with one or more piezo-resistive areas (3, 4, 5) where a polymeric material supplemented with carbon-based nanofillers has been made locally piezo-resistive by laser irradiation (L) so as to define one or more electric deformation sensors configured to detect the load applied on the elastic support (1, 2).

公开(公告)号：EP3357308A1

公开(公告)日：2018-08-08

申请号：EP16795235.7

申请日：2016-09-30

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： SILVANO DE SOUSA, Jonathan

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K1/0274 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0317 ,  H05K2201/0323 ,  H05K2201/10416 ,  H05K2201/2054

Abstract: A component carrier for carrying and cooling at least one heat generating electronic component is presented. The component carrier comprising includes an outer layer structure, an electrically insulating layer arranged adjacent to the outer layer structure, and a heat conducting structure arranged adjacent to the electrically insulating layer on a side opposite to the outer layer structure. The heat conducting structure is thermally coupled to the at least one heat generating electronic component such that the outer layer structure receives thermal radiation irradiated by the heat conducting structure and transports corresponding heat away from the component carrier via convection by a heat transfer medium surrounding the component carrier.