公开(公告)号：US09318466B2

公开(公告)日：2016-04-19

申请号：US14471620

申请日：2014-08-28

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Saket Chadda ,  Ramakanth Alapati ,  Adam Beece

IPC: H01L25/00 ,  H01L25/065

CPC classification number: H05K1/18 ,  H01L23/14 ,  H01L23/142 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L27/016 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06589 ,  H05K1/032 ,  H05K1/053 ,  H05K1/115 ,  H05K1/16 ,  H05K1/181 ,  H05K3/4053 ,  H05K3/445 ,  H05K3/4644 ,  H05K2201/032 ,  H01L2924/014

Abstract: A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.

Abstract translation: 公开了一种用于具有集成无源电路元件的薄柔性基板的方法，以及所得到的器件。 实施例可以包括在衬底的第一或第二表面上集成一个或多个无源电路部件，以及将一个或多个无源电路部件与一个或多个内插器的第二表面上的一个或多个集成电路（IC）管芯互连 在第一和第二表面之间的金属填充的通孔，第一和第二表面是基板的相对表面。

公开(公告)号：US20160064354A1

公开(公告)日：2016-03-03

申请号：US14471620

申请日：2014-08-28

Applicant: GLOBALFOUNDRIES INC.

Inventor： Saket CHADDA ,  Ramakanth ALAPATI ,  Adam BEECE

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H05K1/18 ,  H01L23/14 ,  H01L23/142 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L27/016 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06589 ,  H05K1/032 ,  H05K1/053 ,  H05K1/115 ,  H05K1/16 ,  H05K1/181 ,  H05K3/4053 ,  H05K3/445 ,  H05K3/4644 ,  H05K2201/032 ,  H01L2924/014

Abstract: A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.

Abstract translation: 公开了一种用于具有集成无源电路元件的薄柔性基板的方法，以及所得到的器件。 实施例可以包括在衬底的第一或第二表面上集成一个或多个无源电路部件，以及将一个或多个无源电路部件与一个或多个内插器的第二表面上的一个或多个集成电路（IC）管芯互连 在第一和第二表面之间的金属填充的通孔，第一和第二表面是基板的相对表面。

公开(公告)号：US09271394B2

公开(公告)日：2016-02-23

申请号：US13944105

申请日：2013-07-17

Applicant: FUJIFILM Corporation

Inventor： Akira Ichiki

IPC: H05K1/03 ,  H05K1/02 ,  G06F3/044 ,  H05K3/10

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/03 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/032

Abstract: A transparent electrode sheet includes a transparent support having thereon patterned electrodes, and an absolute value of a difference between a reflection chromaticity of a surface of the electrode of far side from the transparent support and a reflection chromaticity of a surface of the electrode of near side to the transparent support is not more than 2.

Abstract translation: 透明电极片包括其上具有图案化电极的透明支撑体和远侧透明支撑体的电极表面的反射色度与近侧电极表面的反射色度之差的绝对值 对透明支持不超过2。

公开(公告)号：US20150296617A1

公开(公告)日：2015-10-15

申请号：US14269884

申请日：2014-05-05

Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.

Inventor： Dror Hurwitz ,  Alex Huang

IPC: H05K1/11 ,  H05K3/06 ,  C25D5/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K3/007 ,  C25D5/022 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/0064 ,  H05K3/064 ,  H05K2201/032 ,  H05K2201/09609 ,  H05K2201/10242 ,  H01L2924/00

Abstract: An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.

Abstract translation: 由有机矩阵框架限定的芯片插座阵列，该有机矩阵框架通过有机矩阵框架围绕插座，并且还包括通过有机矩阵框架的金属通孔网格。 在一个实施例中，面板包括芯片插座阵列，每个芯片插座由包括通过有机矩阵框架的铜通孔网格的有机矩阵框架包围和限定。 面板包括具有插座的至少第一区域，该插座具有用于接收一种类型的芯片的一组尺寸，以及具有插座的第二区域和用于接收第二类型芯片的另一组尺寸。

公开(公告)号：US09125333B2

公开(公告)日：2015-09-01

申请号：US13183870

申请日：2011-07-15

Applicant: Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

Inventor： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/40

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

Abstract translation: 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US20150156871A1

公开(公告)日：2015-06-04

申请号：US14606777

申请日：2015-01-27

Applicant: BYD COMPANY LIMITED

Inventor： Haibin LI ,  Wen HU ,  Hongye LIN

IPC: H05K1/09 ,  C09D11/52 ,  H05K3/12 ,  C09D167/00 ,  C09D133/00 ,  H05K1/02 ,  C09D163/00

CPC classification number: H01B1/22 ,  C09D11/037 ,  C09D11/104 ,  C09D11/52 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  H05K1/0298 ,  H05K1/092 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/032 ,  H05K2203/0709 ,  H05K2203/107

Abstract: An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.

Abstract translation: 提供油墨组合物和电路板及其制造方法。 油墨组合物包括：丙烯酸树脂; 环氧树脂; 聚酯树脂; 固化剂; 以及包含改性金属化合物的活性粉末，其中所述改性金属化合物的金属元素为选自Zn，Cr，Co，Cu，Mn，Mo和Ni中的至少一种。

公开(公告)号：US20150107878A1

公开(公告)日：2015-04-23

申请号：US14501409

申请日：2014-09-30

Applicant: Carestream Health, Inc.

Inventor： Andrew T. Fried ,  Robert S. Loushin ,  Robert J. Monson

IPC: H05K1/02 ,  H05K3/10 ,  G06F3/044

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04112 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/0537 ,  Y10T29/49155

Abstract: Electrically conductive films and methods for making them. The films include at least two patterns, the first of which, alone, would be visible, but with the addition of one or more other patterns, becomes invisible to the unaided human eye. These films are useful in applications where invisible patterning is desirable, such as, for example, devices employing touch screens.

Abstract translation: 导电膜及其制造方法。 这些胶片包括至少两种图案，其中第一种仅仅是可见的，但是随着一种或多种其它图案的添加，对于肉眼不可见。 这些膜可用于期望不可​​见图案化的应用中，例如采用触摸屏的装置。

公开(公告)号：US20150027755A1

公开(公告)日：2015-01-29

申请号：US14006568

申请日：2012-12-11

Applicant: Akira Tsujimoto ,  Akihiko Tadamasa ,  Taisuke Matsui ,  Eri Yasuhara

Inventor： Akira Tsujimoto ,  Akihiko Tadamasa ,  Taisuke Matsui ,  Eri Yasuhara

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/02 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0274 ,  B82Y30/00 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/027 ,  H05K3/4664 ,  H05K2201/032 ,  H05K2201/2054

Abstract: Provided is a transparent conductive film wherein an electrically conductive region is converted to an electrically insulating region more readily and rapidly than traditional conductive films and the level difference between the electrically conductive region and the electrically insulating region is smaller. The transparent conductive film has an electrically conductive region 4 and an electrically insulating region 5. The electrically conductive region 4 contains a resin component 10, a metal nanowire 2 and an insulation-promoting component 3. The insulation-promoting component 3 has a light absorption higher than that of the metal nanowire 2. The electrically insulating region 5 is defined by a region which contains a resin component 10 but not the metal nanowire 2 or a region which contains a resin component 10 and additionally a metal nanowire 2 having an aspect ratio of smaller than that of the metal nanowire 2.

Abstract translation: 提供了一种透明导电膜，其中导电区域比传统导电膜更容易和快速地转换成电绝缘区域，并且导电区域和电绝缘区域之间的电平差较小。 透明导电膜具有导电区域4和电绝缘区域5.导电区域4包含树脂组分10，金属纳米线2和绝缘促进组分3.绝缘促进组分3具有光吸收 高于金属纳米线2.电绝缘区5由含有树脂成分10而不是金属纳米线2的区域或包含树脂成分10的区域和另外具有纵横比的金属纳米线2 小于金属纳米线2。

公开(公告)号：US20150022980A1

公开(公告)日：2015-01-22

申请号：US14370516

申请日：2013-01-04

Applicant: Access Business Group International LLC

Inventor： Joseph C. Van Den Brink ,  Sean T. Eurich ,  Neil W. Kuyvenhoven ,  Kaitlyn J. Turner ,  Benjamin C. Moes ,  Hai D. Nguyen

IPC: H05K7/02 ,  H05K13/00 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K7/02 ,  H01F27/2804 ,  H01F38/14 ,  H05K1/028 ,  H05K1/092 ,  H05K1/111 ,  H05K1/165 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2201/10401 ,  Y10T29/49117

Abstract: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.

Abstract translation: 一种包括用于向负载（32）提供电力的感应次级（50）的打印介质（30）的项目。 电感次级电流响应于电磁通量以在其中产生时变电流或电压。 感应次级中引起的电流或电压直接或间接地为负载供电，从而增强打印介质的功能和/或吸引力，而不会显着增加其成本。 负载可以提供视觉和/或听觉输出，并且可以包括电致发光显示器，电子墨水显示器，压电扬声器线圈，静电扬声器，OLED，LED或LCD显示器。 本发明的实施例可以用于各种各样的打印介质，包括例如书籍，小册子，小册子，标签，杂志，手册​​，小册子，地图，图表，海报，期刊，报纸或散页页。

公开(公告)号：US20150021479A1

公开(公告)日：2015-01-22

申请号：US14353020

申请日：2012-07-25

Applicant: Jian Cai ,  Qian Wang ,  Ziyu Liu ,  Yang Hu

Inventor： Jian Cai ,  Qian Wang ,  Ziyu Liu ,  Yang Hu

IPC: H05K1/11 ,  G01J5/24 ,  H01L27/146 ,  G01J5/10

CPC classification number: H05K1/115 ,  G01J5/00 ,  G01J5/02 ,  G01J5/10 ,  G01J5/20 ,  G01J5/24 ,  H01L21/6835 ,  H01L23/481 ,  H01L27/1443 ,  H01L27/14683 ,  H01L31/02005 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/11002 ,  H05K2201/032 ,  H05K2201/0329

Abstract: A bolometer and a preparation method thereof. The bolometer includes: an infrared detection element (1) and a readout circuit (2), wherein the infrared detection element (1) is formed on one side of a first substrate (100), and an edge of the infrared detection element (1) is provided with an electrode hole (9), and the readout circuit (2) is formed on one side of a second substrate (200) and the readout circuit (2) has an electrode, the first substrate (100) is formed thereon with a silicon via (8) passing through the first substrate (100) and filed with a conductive material, the electrode hole (9) of the infrared detection element (1) is electrically connected to the electrode of the readout circuit (2) via the conductive material filled in the silicon via (8). The following defects are overcome: bolometers in the prior art need to flatten the silicon wafer surface with a suitable chemical-mechanical polishing process after a readout circuit thereof has been manufactured, the circuit is large in area, and the requirements of the system integration process are high.

Abstract translation: 测辐射热谱仪及其制备方法。 测辐射热计包括：红外线检测元件（1）和读出电路（2），其中红外线检测元件（1）形成在第一基板（100）的一侧，红外线检测元件（1）的边缘 ）设置有电极孔（9），读出电路（2）形成在第二基板（200）的一侧，读出电路（2）具有电极，第一基板（100）形成在其上 通过硅通孔（8）穿过第一衬底（100）并放置导电材料，红外线检测元件（1）的电极孔（9）经由读出电路（2）的电极经由 填充在硅通孔（8）中的导电材料。 克服了以下缺陷：现有技术中的辐射热测量仪在其制造的读出电路之后需要用合适的化学机械抛光工艺来平坦化硅晶片表面，电路面积大，并且系统集成工艺的要求 很高