気体供給装置
    21.
    发明专利
    気体供給装置 审中-公开

    公开(公告)号:JP2019119897A

    公开(公告)日:2019-07-22

    申请号:JP2017253464

    申请日:2017-12-28

    Abstract: 【課題】供給対象であるガスの供給量を精度良く調整できる気体供給装置を提供する。 【解決手段】気体供給装置60は、原料容器Znと、希釈容器Xnと、バルブ部Ynとを備える。原料容器Znは、原料ガスGnを収容する。希釈容器Xnは、原料容器Znから導入された原料ガスGnと、原料ガスGnを希釈するキャリアガスCGとを混合して、希釈原料ガスDnとして収容する。バルブ部Ynは、原料ガスGnとキャリアガスCGとを異なるタイミングで希釈容器Xnに導入する。バルブ部Ynは、原料ガスGnとキャリアガスCGとが混合された後に、希釈原料ガスDnを希釈容器Xnから放出する。 【選択図】図2

    シリコンウェーハのウェットエッチング方法
    22.
    发明专利
    シリコンウェーハのウェットエッチング方法 有权
    对于硅晶片湿式蚀刻法

    公开(公告)号:JP2016213337A

    公开(公告)日:2016-12-15

    申请号:JP2015096231

    申请日:2015-05-11

    Inventor: 吉川 和博

    Abstract: 【課題】混酸溶液を用いたウェットエッチングのようにNOxガスの発生がなく、ダメージレスのシリコンウェーハを得ることができるシリコンウェーハのウェットエッチング方法を提供すること。 【解決手段】可逆的に酸化還元反応を行うポリオキソメタレートとフッ酸を含む薬液をシリコンウェーハ2のエッチングに用い、エッチングした後の薬液を回収し、薬液からポリオキソメタレートを分離し、還元されたポリオキソメタレートを酸化処理して再びエッチングに用いることを特徴とする。 【選択図】 図1

    Abstract translation: 使用,而不产生NOx气体的混合酸溶液作为湿蚀刻,以提供一种能够获得硅晶片无损伤的硅晶片的湿蚀刻法。 含有多金属氧酸盐和氢氟酸的化学溶液来执行用于硅晶片2的蚀刻可逆的氧化还原反应,蚀刻收集后的化学溶液,分离多金属氧酸盐从化学, 减小的多金属氧酸盐的特征是再次使用蚀刻由氧化性。 点域1

    Flow rate standard and flow rate calibration method using the same
    25.
    发明专利
    Flow rate standard and flow rate calibration method using the same 有权
    流量标准和流量校准方法使用该方法

    公开(公告)号:JP2012037457A

    公开(公告)日:2012-02-23

    申请号:JP2010179757

    申请日:2010-08-10

    Inventor: ISHIKAWA KYOICHI

    Abstract: PROBLEM TO BE SOLVED: To provide a flow rate standard for accurately calibrating a flowmeter whose flow rate range is small in a short time.SOLUTION: A flow rate standard includes: a first channel pipe whose one end side is connected to a pressure source, and to whose other end a flow rate controller is connected; a second channel pipe whose one end side is connected to the pressure source, and whose other end is connected to the first channel pipe, and which is equipped with a connection port to which a test object flowmeter is serially connected in the channel; interruption means for interrupting the supply of gas from the pressure source to the first channel pipe and the supply of gas from the pressure source to the second channel pipe, and for separating the first channel pipe and the second channel pipe at the upstream side of the connection port. By using the flow rate standard, compressed gas is packed from the pressure source into the flow rate standard, and then when the pressure source and the flow rate standard are interrupted, the flow of gas whose flow rate is fine can be accurately generated from the upstream side to the downstream side of the test object flowmeter. This fine flow rate can be calculated from the flow rate generated by the flow rate controller and the volume ratio of the upstream side and the downstream side of the flowmeter.

    Abstract translation: 要解决的问题:提供用于在短时间内精确校准流量范围小的流量计的流量标准。 解决方案:流量标准包括:第一通道管,其一端连接到压力源,另一端连接流量控制器; 第二通道管,其一端连接到压力源,并且另一端连接到第一通道管,并且在通道中配备有连接端口,测试对象流量计串联连接到该连接端口; 用于中断从压力源向第一通道管供应气体和从压力源向第二通道管供应气体的中断装置,并且用于在第一通道管和第二通道管的上游侧分离第一通道管和第二通道管 连接端口 通过使用流量标准,将压缩气体从压力源填充到流量标准中,然后当压力源和流量标准被中断时,流量微细的气体流可以从 上游侧到测试对象流量计的下游侧。 可以根据流量控制器产生的流量和流量计的上游侧和下游侧的体积比来计算该流量。 版权所有(C)2012,JPO&INPIT

    Flow rate measuring apparatus
    28.
    发明专利
    Flow rate measuring apparatus 有权
    流量测量装置

    公开(公告)号:JP2007155350A

    公开(公告)日:2007-06-21

    申请号:JP2005346752

    申请日:2005-11-30

    Abstract: PROBLEM TO BE SOLVED: To provide a flow rate measuring apparatus capable of continuing a precise measurement of a flow rate, even in the case that a problem occurs in a hole or a pressure sensor disposed for detecting various pressures.
    SOLUTION: The flow rate measuring apparatus comprises: a pressure detecting tube 10 for detecting values of total pressure, trailing pressure and static pressure; a pressure sensor 20a and the like for outputting signals corresponding to the total pressure, trailing pressure and static pressure; a flow rate calculating section 21 for calculating a value Qa of flow rate based on a difference pressure between the total pressure and the trailing pressure obtained based on the signals from the pressure sensor 20a and the like, a value Qb of flow rate based on a difference pressure between the total pressure and the static pressure obtained based on the signals from the pressure sensor 20a and the like, and a value Qc of flow rate based on a difference pressure between the static pressure and the trailing pressure obtained based on the signals from the pressure sensor 20a and the like; a determining section 22 for determining a defect point based on values of the total pressure, trailing pressure and static pressure obtained from the signals of the pressure sensor 20a and the like; and a defect information outputting section 24 for outputting information representing the defect point specified by the determining section 22.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:即使在用于检测各种压力的孔或压力传感器中发生问题的情况下,也能够提供能够继续精确测量流量的流量测量装置。 解决方案:流量测量装置包括:用于检测总压力,拖尾压力和静压力值的压力检测管10; 压力传感器20a等,用于输出对应于总压力,拖尾压力和静压力的信号; 流量计算部21,根据来自压力传感器20a等的信号,求出基于总压和后压之间的差压的流量的值Qa,流量的值Qb基于 基于来自压力传感器20a等的信号获得的总压力和静压力之间的差压和基于静压力和后退压力之间的差压的流量值Qc基于来自 压力传感器20a等; 确定部分22,用于基于从压力传感器20a等的信号获得的总压力,拖尾压力和静压力的值来确定缺陷点; 以及缺陷信息输出部分24,用于输出表示由确定部分22指定的缺陷点的信息。版权所有:(C)2007,JPO&INPIT

    Apparatus and method for compositing substrate lot

    公开(公告)号:JP2004055696A

    公开(公告)日:2004-02-19

    申请号:JP2002208961

    申请日:2002-07-17

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for compositing a substrate lot, in which the substrate lot having a large-diameter substrate can be conveyed easily in a vertical state, cleaning or the like can be performed, and a disposing space can be reduced by holding the volume of a substrate lot assembling support to a minimum by a simple process. SOLUTION: The apparatus, for compositing the substrate lot to form at least one synthetic substrate lot by compositing a plurality of the substrate lots, by superposing a plurality of substrates with each other, includes a support frame having a plurality of support plates stood for supporting the ends of the respective substrates. The substrates of other substrate lots supported to the support plates are superposed at a predetermined interval between the substrates of the substrate lots, placed in a compositing space between the respective support plates, and the plurality of the substrate lots are composited so as to form a single composite substrate lot. COPYRIGHT: (C)2004,JPO

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