FLIP-TOP ACTUATOR
    21.
    发明申请
    FLIP-TOP ACTUATOR 审中-公开

    公开(公告)号:WO2006055307A3

    公开(公告)日:2006-05-26

    申请号:PCT/US2005/040248

    申请日:2005-11-04

    Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.

    HERMAPHRODITIC SOCKET/ADAPTER
    22.
    发明申请
    HERMAPHRODITIC SOCKET/ADAPTER 审中-公开
    HERMAPHRODITIC SOCKET / ADAPTER

    公开(公告)号:WO2006028633A2

    公开(公告)日:2006-03-16

    申请号:PCT/US2005028139

    申请日:2005-08-09

    CPC classification number: H01R12/714 H01R12/716 H01R13/631 H01R24/84

    Abstract: A hermaphroditic terminal assembly for connecting electrical devices includes an insulating support member for supporting female sockets and male pins, a number of female sockets, and a number of male pins. An intercoupling component for connecting electrical devices includes two hermaphroditic terminal assemblies configured such that the first hermaphroditic terminal assembly can be mated with the second hermaphroditic terminal assembly.

    Abstract translation: 用于连接电气装置的阴模组合件包括用于支撑阴插座和阳销,多个阴插座和多个阳销的绝缘支撑构件。 用于连接电气装置的相互耦合部件包括两个两性端子组件,其被配置为使得第一阴模端子组件可以与第二阴模端子组件配合。

    HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE
    23.
    发明申请
    HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE 审中-公开
    高速,高密度互连装置

    公开(公告)号:WO2004001912A1

    公开(公告)日:2003-12-31

    申请号:PCT/US2003/019830

    申请日:2003-06-24

    Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

    Abstract translation: 一种用于在具有电接地电路和底盘接地电路的数字或模拟传输系统内接收接触阵列的相互耦合部件,所述互耦部件包括由电绝缘材料形成的并具有上表面和下表面的部分,所述部分包括多个 设置在其上表面上并且布置成预定占地面积的一个或多个屏蔽构件,该屏蔽构件由导电材料形成,该屏蔽构件设置在该段内并被配置为连接到该系统的底盘接地电路。 相互耦合部件可以包括在设置在片段上的多个孔内的导电触点阵列。 这些触点中的一个或多个可以被配置为与系统的电接地电路电连接。 相互耦合组件还可以包括位于信号触头之间的空腔,以调整信号触点之间的差分阻抗。

    INTEGRATED CIRCUIT ADAPTER HAVING GULLWING-SHAPED LEADS
    24.
    发明申请
    INTEGRATED CIRCUIT ADAPTER HAVING GULLWING-SHAPED LEADS 审中-公开
    集成电路适配器具有全方位的领先优势

    公开(公告)号:WO1991015881A1

    公开(公告)日:1991-10-17

    申请号:PCT/US1991002386

    申请日:1991-04-08

    CPC classification number: H01L21/67121 H01R12/716 H05K7/1023 H05K7/1084

    Abstract: An adapter to connect device leads (12) to contacts arranged in a rectangle on a circuit surface (30). The adapter has a body and leads (26) that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface (30). The body has sites (16) for connecting with the device (10) and supports conductive elements connecting the leads to the sites. The adapter may connect gullwing-shaped device leads disposed in a rectangle (e.g., QFP) to contacts in a similar pattern. Strain relief elements (32) are shown. The body may include a stack of connected body portions. The device leads may be anchored in holes in the substrate, and may be bent portions of a lead frame sealed in a molded insulating body. Vertically extending resilient single-reed-shaped contacts (224) may connect to a surface of a downwardly extending section on a device package lead (214).

    Abstract translation: 用于将设备引线(12)连接到布置在电路表面(30)上的矩形中的触点的适配器。 适配器具有主体和引线(26),其在一对相对的曲线中再次向外,向下和向外延伸,以形成与电路表面(30)上的图案相匹配的脚。 主体具有用于与设备(10)连接的位置(16),并且支撑将引线连接到现场的导电元件。 适配器可以将以矩形(例如,QFP)布置的鸥翼形装置引线连接到类似图案的触点。 示出了应变消除元件(32)。 主体可以包括连接的主体部分的堆叠。 装置引线可以锚定在基板的孔中,并且可以是被密封在模制绝缘体中的引线框架的弯曲部分。 垂直延伸的弹性单簧片形触头(224)可以连接到器件封装引线(214)上的向下延伸部分的表面。

    DOUBLE-POGO CONVERTER SOCKET TERMINAL

    公开(公告)号:CA2579223C

    公开(公告)日:2013-03-19

    申请号:CA2579223

    申请日:2005-08-09

    Abstract: A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).

    26.
    发明专利
    未知

    公开(公告)号:AT550811T

    公开(公告)日:2012-04-15

    申请号:AT03761284

    申请日:2003-06-24

    Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

    HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE

    公开(公告)号:CA2490096C

    公开(公告)日:2011-08-16

    申请号:CA2490096

    申请日:2003-06-24

    Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

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