公开(公告)号：CA2490096A1

公开(公告)日：2003-12-31

申请号：CA2490096

申请日：2003-06-24

Applicant: ADVANCED INTERCONNECTIONS

Inventor： PREW RAYMOND A ,  LANGON ALFRED J ,  PERUGINI MICHAEL ,  EASTMAN GARY D ,  SAYDAM EROL D

IPC: H01R13/648 ,  H05K9/00

Abstract: An intercoupling component for receiving an array of contacts within a digit al or analog transmission system having an electrical ground circuit and chassi s ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within th e plurality of holes disposed on the segment. One or more of these contacts ma y be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

公开(公告)号：CA2490096C

公开(公告)日：2011-08-16

申请号：CA2490096

申请日：2003-06-24

Applicant: ADVANCED INTERCONNECTIONS

Inventor： PERUGINI MICHAEL ,  SAYDAM EROL D ,  EASTMAN GARY D ,  LANGON ALFRED J ,  PREW RAYMOND A

IPC: H01R13/648 ,  H05K9/00

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

公开(公告)号：HK1078172A1

公开(公告)日：2006-03-03

申请号：HK05111562

申请日：2005-12-15

Applicant: ADVANCED INTERCONNECTIONS

Inventor： PERUGINI MICHAEL ,  SAYDAM EROL D ,  EASTMAN GARY D ,  LANGON ALFRED J ,  PREW RAYMOND A

IPC: H01R13/648 ,  H05K9/00

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

公开(公告)号：AU2003249355A1

公开(公告)日：2004-01-06

申请号：AU2003249355

申请日：2003-06-24

Applicant: ADVANCED INTERCONNECTIONS

Inventor： EASTMAN GARY D ,  LANGON ALFRED J ,  PREW RAYMOND A ,  PERUGINI MICHAEL ,  SAYDAM EROL D

IPC: H01R13/648 ,  H05K9/00

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

公开(公告)号：EP1540779A4

公开(公告)日：2010-01-06

申请号：EP03761284

申请日：2003-06-24

Applicant: ADVANCED INTERCONNECTIONS

Inventor： PERUGINI MICHAEL ,  SAYDAM EROL D ,  EASTMAN GARY D ,  LANGON ALFRED J ,  PREW RAYMOND A

IPC: H01R13/648 ,  H05K9/00

CPC classification number: H01R12/716 ,  H01R12/52 ,  H01R13/187 ,  H01R13/405 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/6586 ,  H01R13/6591 ,  H01R13/6598

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.